인쇄 회로 기판 및 이의 제조 방법
    1.
    发明公开
    인쇄 회로 기판 및 이의 제조 방법 审中-实审
    印刷电路板及其制造方法

    公开(公告)号:KR1020140035652A

    公开(公告)日:2014-03-24

    申请号:KR1020120102157

    申请日:2012-09-14

    Abstract: The present invention relates to a printed circuit board including a first conductive layer and a via part electrically connected to the first conductive layer, and the shortest distance from the via part and an interface of the first conductive layer to a bottom surface of the first conductive layer is shorter than a height of the first conductive layer.

    Abstract translation: 本发明涉及一种印刷电路板,其包括第一导电层和电连接到第一导电层的通孔部分,并且与第一导电层的通孔部分和界面到第一导电层的底表面的最短距离 层比第一导电层的高度短。

    전해 도금장치
    2.
    发明公开
    전해 도금장치 审中-实审
    电解电镀装置

    公开(公告)号:KR1020170090271A

    公开(公告)日:2017-08-07

    申请号:KR1020160010916

    申请日:2016-01-28

    Abstract: 전해도금장치가개시된다. 본발명의일 측면에따른전해도금장치는, 도금액을수용하는도금조, 도금조내에배치되는양극, 도금조내에배치되고피도금체와전기적으로연결되는음극및 피도금체와이격되게양극과음극사이에배치되고도금액에전해(electro-dissolution)되는금속을포함하는전류밀도조절부를포함한다.

    Abstract translation: 公开了一种电解电镀设备。 根据本发明的一个方面的电解电镀装置包括容纳电镀液的电镀槽,设置在电镀槽中的阳极,设置在电镀槽中并与电镀体电连接的阴极, 并且电流密度调节器包括设置在电极之间并且可电解溶解的金属。

    도금설비용 차폐장치
    3.
    发明公开
    도금설비용 차폐장치 无效
    涂装设备阻塞结构

    公开(公告)号:KR1020130033821A

    公开(公告)日:2013-04-04

    申请号:KR1020110097743

    申请日:2011-09-27

    CPC classification number: C25D5/022

    Abstract: PURPOSE: A shielding device for a plating facility is provided to easily change a shielding plate when plating solutions or current densities are changed as the shielding plate is detachably installed in a plating bath. CONSTITUTION: A shielding device(1) for a plating facility comprises a shielding plate(10) and a fixing member(20). An opened part(11) is formed in the shielding plate. The fixing member is installed in a plating bath and comprises side walls(23). The side walls make an opening(21) to expose the opened part of the shielding plate to the outside and detachably install the shielding plate. Guide rails are formed in the side walls of the fixing member.

    Abstract translation: 目的:提供一种用于电镀设备的屏蔽装置,用于当电镀溶液或电流密度随着屏蔽板可拆卸地安装在镀浴中时改变屏蔽板。 构成:用于电镀设备的屏蔽装置(1)包括屏蔽板(10)和固定构件(20)。 在屏蔽板上形成开放部分(11)。 固定构件安装在镀浴中并且包括侧壁(23)。 侧壁形成开口(21),将屏蔽板的打开部分露出到外部并可拆卸地安装屏蔽板。 导轨形成在固定部件的侧壁上。

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