Abstract:
본발명의집적회로반도체소자는, 하부기판에형성되고수직형트랜지스터및 평면형트랜지스터중적어도어느하나로구성된제1 트랜지스터를구비한다. 제1 트랜지스터상에는접합절연층이형성되어있고, 접합절연층에는상부기판이접합되어있다. 상부기판에는수직형트랜지스터및 평면형트랜지스터중적어도어느하나로구성된제2 트랜지스터가형성되어있다. 제1 트랜지스터및 제2 트랜지스터는배선층으로연결되어있다. 제1 트랜지스터및 제2 트랜지스터의수직형트랜지스터는, 하부기판또는상부기판에형성된제1 액티브패턴의측면을감싸는제1 게이트구조물과, 제1 액티브패턴의표면부위와제1 게이트구조물하부에구비되는제1 불순물영역들포함한다. 제1 액티브패턴은, 일방향으로연장하는핀 액티브패턴(fin active pattern)과, 핀액티브패턴상에구비되는기둥액티브패턴(pillar active pattern)으로이루어진다.
Abstract:
PURPOSE: A semiconductor memory device which is optimized in high integration and method of forming the same are provided to minimize an occupancy area of first and second storage cells including first and second buried gates respectively by arranging a first buried gate and a second buried gate, respectively controlled, in a groove. CONSTITUTION: In semiconductor memory device which is optimized in high integration and method of forming the same, a substrate(100) comprises a cell array region and a peripheral circuit region. A cell element isolation pattern(103a) defines a cell active part(105) extended to first direction. The first buried gate(127a) and the second buried gate(127b) are respectively arranged on the first inner wall and the second inner wall of the groove(112b). The gate dielectric layer(125) is allowed in between the first inner wall of the groove and the first buried gate. The first and the A -doped domain(150b) the second are respectively formed in the top of the active part of the groove either side.
Abstract:
PURPOSE: A vertical pillar transistor is provided to secure high reliability since the adhesive force of the semiconductor pattern is improved. CONSTITUTION: A vertical pillar transistor is composed of an insulating layer(106), a conductive construct(148), a semiconductor pattern(140a), a gate(154), and impurity domain frames(143,156). The insulating layer covers the first substrate(100), and the conductive construct is equipped on the insulating layer. The conductive construct includes at least one metal silicide layer, and a semiconductor pattern is equipped on the conductive construct. The semiconductor pattern has a pillar shape, and the gate surrounds the center of the semiconductor pattern while being separated from the conductive construct.
Abstract:
A list operation device of a video telephony terminal and a method thereof are provided to capture transceived image data during a video call, and to store the captured image data as a call list together with a telephone number, so that a user can easily remember a speaker by confirming the call list. A controller confirms whether a video telephony call is formed(S101). If so, the controller confirms whether a video call list function is set(S105). If so, the controller captures an image received from the other party(S109). The controller controls size of the captured image(S111). The controller links the captured image with a telephone number(S113). The controller stores the image linked with the telephone number in a memory as a video telephony list(S115).
Abstract:
본 발명은 휴대단말에서 디지털 방송신호 수신 중 화상통신이 요청되는 경우에 디지털 방송신호 수신을 계속하면서 상기 방송신호의 방송화면 및 화상통신의 화상통화화면을 동시에 표시하기 위한 방법 및 장치에 관한 것이다. 이를 위해, 디지털 방송신호 재생 및 화상통화 기능을 구비한 휴대단말에서 디지털 방송신호의 방송화면 및 화상통화화면 동시 출력 방법에 있어서, 디지털 방송신호를 수신하여 재생하는 단계; 상기 방송신호의 재생 중 화상통신이 요청될 시 표시부의 화면을 복수의 영역으로 구분하여, 제1영역에 방송화면을 할당하고, 제2영역에 화상통화화면을 할당하여 표시하는 단계; 문자 대화가 요청될 시 상기 제2영역 중 일 영역에 문자 대화용 화면을 생성하여 표시하는 단계를 포함한다. 디지털 방송, 화상통신, 방송화면, 화상통화화면
Abstract:
A mobile terminal having an RFID(Radio Frequency Identification) function is provided to improve RFID communication by accurately matching an operation band of an antenna to a frequency band of an RFID radio signal through an RFID matching circuit. An antenna(5) is mounted at one side of a mobile terminal and transmits/receives a radio signal. An RFID matching circuit(20) changes an operation band of an antenna into a frequency band allowing input/output of an RFID radio signal. A communication module(50) processes a mobile communication radio signal transmitted/received through the antenna(5). A switch(10) is mounted between the antenna(5) and the RFID matching circuit(20) and connects the antenna(5) to one of the communication module and the RFID matching circuit.