Abstract:
A method for forming a silicon pattern in a contact hole, a method for manufacturing a diode employing the same, and a method for manufacturing a phase changeable memory are provided to form silicon layers without a seam of a void in a contact hole by depositing silicon layers in the contact hole having a high aspect ratio in two times. An interlayer dielectric(120) having a contact hole(122) is formed on a semiconductor substrate(100). A first silicon pattern(130a) gap-fills a part of the contact hole. A plasma cleaning process is performed on the first silicon pattern to remove a native oxide layer generated on the first silicon pattern. A second silicon pattern is formed in the contact hole on the first silicon pattern. The plasma cleaning process is performed by using cleaning gas including CF4 and ammonia. Before the plasma cleaning process is performed, a wet cleaning process is performed on the first silicon pattern. The first and second silicon patterns are respectively formed with an amorphous silicon layer and a polycrystal silicon layer.
Abstract:
A formation method of the epitaxial silicone structure, and a formation method of semiconductor device using the same are provided to suppress the formation of void and seam of the epitaxial silicone structure due to the hydrochloric acid gas. A formation method of the epitaxial silicone structure includes the step for providing the first source including the silicon(Si) and hydrochloride(HCl) onto the substrate; the step for forming the first silicon epitaxial layer(102) by performing the primary epitaxial growth process; the step for forming the second silicon epitaxial layer(104) by providing the second source including the silicon and the hydrochloric acid gas(Cl2) onto the first silicon epitaxial layer, and performing the second epitaxial growth process.
Abstract:
A panel transfer apparatus is provided to reduce an exchanging time by processing automatically an exchanging process according to a size of a display panel. A plurality of vacuum holes(A,B) are formed at a plurality of setting positions on a main plate(100). A main vacuum unit(400) provides vacuum force to the plurality of vacuum holes corresponding to the setting positions which are selected according to a size of a panel. The size of the panel includes a first and a second setting size. A first setting position corresponds to the first setting size. A second setting position corresponds to the second setting size. The main vacuum unit includes a first main vacuum pump(310), a second main vacuum pump(330), and a second main line part. The panel of the first setting size is positioned on the first setting position and is absorbed by the first main vacuum pump. The panel of the second setting size is positioned on the second setting position and is absorbed by the second main vacuum pump.
Abstract:
소자 분리 영역을 형성 방법 및 이를 이용한 이미지 소자의 형성 방법에 있어서, 우선, 플라즈마 식각 공정을 통해 반도체 기판에 트렌치를 형성한다. 상기 플라즈마에 의한 상기 트렌치 내측 표면의 손상을 치유하기 위하여 수소 및 산소를 포함하고 상기 수소의 비율이 5 내지 60%인 챔버 분위기 하에서 열처리하여 상기 트렌치의 내측 표면상에 라디칼 산화막을 형성한다. 이어서, 상기 트렌치를 메우도록 상기 기판 상에 소자 분리막을 형성함으로써 소자 분리 영역을 형성한다. 계속해서, 상기 소자 분리 영역으로 형성된 액티브 영역 상에 트랜지스터를 형성하고, 상기 소자 분리 영역과 접하는 액티브 영역 표면 아래에 포토 다이오드를 형성한다. 이때, 상기 플라즈마 식각 공정에 의한 트렌치 내측 표면 손상을 5 내지 60%의 수소 가스를 주입함으로써 상기 트렌치 내측 표면상에 라디칼 산화막을 충분하게 형성함으로써 치유할 수 있다. 따라서, 상기 트렌치 내측의 손상에 의한 이미지 소자의 암신호 생성을 미연에 억제할 수 있다.