Abstract:
본 개시의 다양한 실시예들에 따르면, 전자 장치에 설치된 어플리케이션의 업데이트 시에 런타임 성능(runtime performance)을 향상할 수 있는 장치 및 방법에 관하여 개시한다. 다양한 실시예들에 따른 전자 장치는, 무선 통신을 제공하도록 구성된 통신 회로, 상기 통신 회로와 작동적으로 연결된 적어도 하나의 프로세서, 및 상기 프로세서와 작동적으로 연결된 메모리를 포함하고, 상기 메모리는, 실행 시에, 상기 프로세서가, 어플리케이션의 업데이트를 감지하고, 상기 어플리케이션의 업데이트 감지에 기반하여, 상기 어플리케이션의 업데이트를 위한 업데이트 파일을 획득하고, 상기 어플리케이션에 대한 인스톨(install) 동작에서, 상기 어플리케이션과 관련하여 이전에 기록된 제1 정보와 상기 어플리케이션의 상기 업데이트 파일과 관련된 제2 정보를 획득하고, 상기 제1 정보와 상기 제2 정보의 매칭(matching)에 기반하여, 업데이트 이후에 상기 어플리케이션에서 사용될 새로운 프로파일을 생성하도록 하는 인스트럭션들을 저장할 수 있다. 다양한 실시예들이 가능하다.
Abstract:
A 3D nonvolatile memory device and a fabricating method thereof are provided. The 3D nonvolatile memory device includes a substrate where a cell array region and a connection region are defined, an electrode structure which is formed on the cell array region and the connection region and includes stacked electrodes, a second recess formed on the electrode structure on the connection region, a first recess which is formed on the electrode structure of the connection region and is arrange between the cell array region and the second recess, and vertical lines which are formed on the upper surface of the electrode exposed by the first recess.
Abstract:
PURPOSE: A non-volatile memory device and a manufacturing method thereof are provided to improve the reliability of the memory device by including a contact plug and an etch stop layer pattern formed on a common source line strapping region. CONSTITUTION: Channel regions (112) are extended in the vertical direction on a substrate. Gate electrodes (150) are separated in the vertical direction and the horizontal direction along an outer wall of the channel regions. A first impurity region is provided to the substrate and is formed on the lower part of the channel regions. A first interlayer insulating film is formed on the substrate and covers the gate electrodes and the channel regions. A contact hole passes through the first interlayer insulating film and is formed between the adjacent gate electrodes. A contact plug (170) is formed in the contact hole and is electrically connected to a second impurity region. An etch stop layer pattern (182) is formed on the contact plug and the first interlayer insulating film.
Abstract:
PURPOSE: A method for manufacturing a vertical memory device is provided to suppress residue due to a height difference in a planarization process for forming a third interlayer dielectric layer by forming a lower mold structure with the same height as a polishing prevention layer after a substrate of a cell region is exposed. CONSTITUTION: A device isolation layer(105) is formed on a substrate(100) which is divided into a first region and a second region. A gate structure(130) is formed in the first region. The gate structure includes a gate insulation layer(110) and a gate electrode(120). A gate spacer(140) is formed on an sidewall of the gate structure. A first interlayer dielectric layer(150) which covers the gate structure and the gate spacer is formed in the first region and the second region of the substrate. A first polishing prevention layer(160) and a second interlayer dielectric layer are successively formed on the first interlayer dielectric layer. A second interlayer dielectric pattern(175) is formed by performing a planarization process on the upper side of the second interlayer dielectric layer. [Reference numerals] (AA) First direction; (BB) Second direction
Abstract:
PURPOSE: A washing machine and a method for controlling the same are provided to improve the solubility and the washing performance of a detergent using a washing plate capable of wobbling washing. CONSTITUTION: A controller detects the amount of laundries inserted into a washing tub when a user selects a washing course(70). The controller sets the water level by the detected amount of the laundries(71). Washing water is supplied to the set water level for conducting a first washing process when the water level is set, and the controller rotates a washing plate(72). The operation of the washing plate stops when the washing water reaches the first set water level, and the washing water is supplied until the water reaches the second set water level(74). The controller stops the water supply when the water reaches the second set water level, and conducts the first washing process(76, 77). The controller stops the first washing process when the first washing time passes the first preset time, and rotates the washing plate while supplying the washing water(79, 80). The water supply is stopped when the washing water reaches the third set water level, and a second washing process is conducted(82, 83). The controller conducts a dehydration process, a rinsing process, and a second dehydration process. [Reference numerals] (70) Detecting the amount of laundries; (71) Setting the level of water; (72,80,86) Supplying water, and rotating a washing plate; (73) Is a first set water level reached?; (74) Stopping the rotation of the washing plate, and supplying water; (75) Is a second set water level reached?; (76,82,88) Stopping the supply of water; (77) Executing a first washing operation; (78) Is a first set time elapsed?; (79) Stopping the first washing operation; (81) Is a third set water level reached?; (83) Executing a second washing operation; (84) Is a second set time elapsed?; (85) Stopping a second washing operation, and dehydrating; (87) Is a rinse set water level reached?; (89) Executing a rinsing operation; (90) Dehydrating; (AA) Start; (BB,DD,FF,HH,JJ,LL) No; (CC,EE,GG,II,KK,MM) Yes; (NN) End
Abstract:
기판 표면 피트 생성이 억제된 불순물 영역 형성 방법에 있어서, 우선 반도체 기판에 희생 산화막을 형성하고, 상기 희생 산화막으로 불순물을 주입한다. 상기 희생 산화막 상에 생성된 오염물이 확산되어 기판 표면에 부착되는 것을 억제시키고 상기 불순물을 활성화하기 위하여 산소 및 수소 분위기 하에서 상기 반도체 기판을 열처리한다. 이어서, 상기 희생 산화막을 제거한다. 이때, 상기 열처리 시, 수소 및 산소를 주입함으로써 산소 라디칼을 반도체 기판 표면과 반응시킴으로써, 반도체 기판 표면에 피트가 생성되는 것을 미연에 방지할 수 있다.
Abstract:
A structure for a recessed gate electrode is provided to improve the operation characteristic of a cell transistor by controlling the transfer of voids generated in an expanded recess when a recessed cell transistor having a recess whose lower part is expanded is formed. A substrate(100) includes a first recess(104) and a second recess(108) having a broader inner width than that of the first recess such that the second recess is connected to the lower part of the first recess. A gate oxide layer(110) is formed on the upper surface of the substrate and the inner walls of the first and the second recesses. The inside of the first recess is filled with a first polysilicon layer(118) doped with impurities of a first density. The inside of the second recess is filled with a second polysilicon layer(120) doped with impurities of a second density higher than the first density such that the second polysilicon layer includes voids(115) in the center of the second recess. A third polysilicon layer(122) is formed on the gate oxide layer and the first polysilicon layer, having impurities of a third density. The second density included in the second polysilicon layer has a density capable of controlling the position of the void transferred by diffusion of silicon. The impurities doped into the first, second and third polysilicon layers can be the same conductivity type.