公开(公告)号：KR100689850B1

公开(公告)日：2007-03-08

申请号：KR1020060013850

申请日：2006-02-13

Applicant: 삼성전자주식회사

Inventor： 김성안 ,  천성규 ,  김덕겸 ,  양선일 ,  김정열

IPC: H01L21/66

Abstract: An inspection apparatus for printed circuit board is provided to check whether solder cream is coated on a substrate uniformly by irradiating slit light onto the surface of the substrate and analyzing the light reflected on the surface of the substrate. A light scanning unit(200) scans slit light onto a surface of a substrate(10). A light receiving unit(300) receives light(R) reflected on the surface of the substrate. A camera(400) is used for sensing the reflected light of the light receiving unit. A transfer unit(100) transfers the substrate. An analysis unit(500) inspects a flatness state of the substrate by analyzing continuously the reflected light of the camera.

Abstract translation: 提供一种用于印刷电路板的检查设备，用于通过将狭缝光照射到基板表面上并分析在基板表面上反射的光来检查焊膏是否均匀地涂覆在基板上。 光扫描单元（200）将狭缝光扫描到衬底（10）的表面上。 光接收单元（300）接收在衬底表面上反射的光（R）。 照相机（400）用于感测光接收单元的反射光。 转印单元（100）转印基材。 分析单元（500）通过连续分析照相机的反射光来检查基板的平坦状态。