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公开(公告)号：KR101778031B1
公开(公告)日：2017-09-26
申请号：KR1020100091492
申请日：2010-09-17
Applicant: 삼성전자주식회사
CPC classification number: B25J15/0009 , B25J15/086 , B25J15/10 , Y10S901/38 , Y10S901/39
Abstract: 인간의임의물체파지기능과산업용 gripper의고정밀안정파지기능을동시에갖추고, 복잡도나자유도를증가시키지않고, 완전한대향성을가지면서인간형자세가가능한로봇핸드를제공한다. 로봇핸드는베이스부; 상기베이스부상부에구비되고, 일부는상기베이스부에연결되는복수의손가락연결부; 상기복수의손가락연결부와각각결합되어물건을파지할수 있도록구성되는복수의손가락모듈;을포함하고, 상기복수의손가락연결부중 상기베이스부에연결되는손가락연결부는각각인접하는손가락연결부와구름관절로연결되어함께구동되도록구성되고, 상기베이스부에연결되는손가락연결부에인접하는손가락연결부는상기베이스부에연결되는손가락연결부와별개로구동될수 있도록구성되어상기복수의손가락모듈이서로대칭파지가이루어질수 있도록구성되는것을특징으로한다.
Abstract translation: 提供一种机器人手，具有完全不透明度的人形姿态，不增加复杂性或自由度，同时具有人的任意物体抓握功能和工业抓手的高精度稳定握持功能。 机器人手包括基部; 多个指状连接部分，其设置在基底浮动部分上并且部分地连接到基底部分; 多个手指的模块，分别被配置耦合到所述多个连接部分的手指被抓握产品;包括耦合到所述多个连接连接至所述指状连接部的手指和云彩关节邻接的每一个的基部的手指连接 配置适于与连接在相邻的手指，其连接到基部部分的指状连接器被配置为在手指连接被连接到独立驱动的被驱动所述基座，使得所述多个手指模块的对称抓握彼此来实现 它的特点。
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公开(公告)号：KR101551777B1
公开(公告)日：2015-09-10
申请号：KR1020080109624
申请日：2008-11-06
Applicant: 삼성전자주식회사
CPC classification number: G03F7/70291 , G03F7/70508
Abstract: 본발명은노광데이터를재정렬하여새로운노광데이터를생성하고, 생성된새로운노광데이터를압축하는노광장치의구성과방법으로노광데이터의압축효율을향상시켜실시간으로노광을수행할수 있다.
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公开(公告)号：KR1020120029600A
公开(公告)日：2012-03-27
申请号：KR1020100091492
申请日：2010-09-17
Applicant: 삼성전자주식회사
CPC classification number: B25J15/0009 , B25J15/086 , B25J15/10 , Y10S901/38 , Y10S901/39
Abstract: PURPOSE: A robot hand is intended to provide an object gripping function like human's hands and a highly precise and stable gripping function of an industrial gripper through the driving of a plurality of finger connecting units. CONSTITUTION: A robot hand(1) comprises a base unit(10), a plurality of finger connecting units(20), and a plurality of finger modules(30). The finger connecting units are installed on the top of the base unit. Some of the finger connecting units are connected to the base unit. The finger modules are coupled to each finger connecting unit and grip objects. The finger connecting unit connected to the base unit is connected to a neighboring finger connecting unit through a rolling joint and is driven together.
Abstract translation: 目的：机器人手旨在通过驱动多个手指连接单元来提供诸如人的手的对象握持功能和工业夹具的高度精确和稳定的抓握功能。 构成：机器人手（1）包括基座单元（10），多个指状连接单元（20）和多个指形模块（30）。 手指连接单元安装在基座单元的顶部。 一些手指连接单元连接到基座单元。 手指模块联接到每个手指连接单元和夹持物体。 连接到基座的手指连接单元通过滚动接头连接到相邻的手指连接单元，并一起驱动。
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公开(公告)号：KR1020070084759A
公开(公告)日：2007-08-27
申请号：KR1020060016937
申请日：2006-02-21
Applicant: 삼성전자주식회사
IPC: H01L21/304
Abstract: A wet cleaning apparatus having roller is provided to allow a chemical solution to be indirectly supplied on a semiconductor wafer using the roller so that a physical damage generated on the semiconductor wafer by the chemical solution is minimized. A wet cleaning apparatus includes a chamber(100), a stage(102), a roller(R) and a first supply opening(104). The stage is positioned at the bottom of the chamber, and a member(W) to be cleaned rests on the stage. The roller is spaced apart from an upper surface of the stage by a predetermined interval. The first supply opening is positioned to an upper side of the roller so that a cleaning solution(C) is supplied onto the surface of the roller. The roller has a width which is at least identical with that of the member to be cleaned, and moves in parallel in a direction perpendicular to the width thereof. The first supply opening is a slot whose length corresponds to a width direction of the roller or a plurality of injection nozzles which are arranged in the width direction of the roller.
Abstract translation: 提供具有辊的湿式清洁装置，以使用该辊间接地供给到半导体晶片上的化学溶液，使得通过化学溶液在半导体晶片上产生的物理损伤最小化。 湿式清洗装置包括一个室（100），一个台（102），一个辊子（R）和一个第一供应开口（104）。 工作台位于室的底部，待清洁的构件（W）位于工作台上。 辊子与工作台的上表面隔开预定间隔。 第一供给口位于辊的上侧，使得清洁溶液（C）被供给到辊的表面上。 辊的宽度至少与要清洁的构件的宽度相同，并且在垂直于其宽度的方向上平行移动。 第一供给口是其长度对应于沿辊的宽度方向配置的辊的宽度方向或多个喷嘴的槽。
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公开(公告)号：KR100689850B1
公开(公告)日：2007-03-08
申请号：KR1020060013850
申请日：2006-02-13
Applicant: 삼성전자주식회사
IPC: H01L21/66
Abstract: An inspection apparatus for printed circuit board is provided to check whether solder cream is coated on a substrate uniformly by irradiating slit light onto the surface of the substrate and analyzing the light reflected on the surface of the substrate. A light scanning unit(200) scans slit light onto a surface of a substrate(10). A light receiving unit(300) receives light(R) reflected on the surface of the substrate. A camera(400) is used for sensing the reflected light of the light receiving unit. A transfer unit(100) transfers the substrate. An analysis unit(500) inspects a flatness state of the substrate by analyzing continuously the reflected light of the camera.
Abstract translation: 提供一种用于印刷电路板的检查设备，用于通过将狭缝光照射到基板表面上并分析在基板表面上反射的光来检查焊膏是否均匀地涂覆在基板上。 光扫描单元（200）将狭缝光扫描到衬底（10）的表面上。 光接收单元（300）接收在衬底表面上反射的光（R）。 照相机（400）用于感测光接收单元的反射光。 转印单元（100）转印基材。 分析单元（500）通过连续分析照相机的反射光来检查基板的平坦状态。
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Patent Agency Ranking
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公开(公告)号：KR1020120089383A
公开(公告)日：2012-08-10
申请号：KR1020100110345
申请日：2010-11-08
Applicant: 삼성전자주식회사
Abstract: PURPOSE: A method for producing a speed profile is provided to reduce a cycle time of a process by early starting the overlapping. CONSTITUTION: A method for producing a speed profile is as follows. If a joint is operated by a plurality of motions, the amount of the overlapping to overlap the plurality of motions is set(200). The speed profile of a motor is produced according to information on the speed profile inputted from users(202,204). The movement amount of the motor is obtained from the speed profile(206). The movement amount of the motor is compared with the amount of the overlapping(208). The degree of the speed profile is determined(210).
Abstract translation: 目的：提供一种用于产生速度曲线的方法，以通过早期开始重叠来减少处理的周期时间。 构成：制作速度曲线的方法如下。 如果通过多个运动操作关节，则设定与多个运动重叠的重叠量（200）。 根据从用户（202,204）输入的速度曲线的信息来生成电动机的速度曲线。 从速度曲线（206）获得电动机的移动量。 将电动机的移动量与重叠量（208）进行比较。 确定速度分布的程度（210）。
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公开(公告)号：KR100889816B1
公开(公告)日：2009-03-20
申请号：KR1020070030065
申请日：2007-03-27
Applicant: 삼성전자주식회사
Inventor： 김덕겸
Abstract: 본 발명은 위상 정렬 장치 및 방법에 관한 것으로, 보다 구체적으로는 논리게이트 및 디스큐를 더 구비함으로써 테스트 장치 내에서 출력되는 테스트 신호들 간의 위상차를 제거하여 신속하고 정확하게 동기화시킬 수 있는 위상 정렬 장치 및 방법에 관한 것이다.
본 발명은 테스트 신호를 출력하는 복수개의 드라이버; 상기 드라이버의 각 테스트 신호를 수신하여 합성하는 논리게이트; 상기 논리게이트에서 합성된 신호를 미리 설정된 지연 값만큼 지연시키는 디스큐; 및 상기 복수의 테스트 신호 및 지연신호를 수신하여 대응하는 두 신호를 비교한 후 위상 지연값을 측정하며, 상기 위상 지연 값 중 가장 큰 위상지연 값을 가진 신호에 나머지 신호를 정렬시키는 비교기;를 포함한다.-
公开(公告)号：KR1020080087601A
公开(公告)日：2008-10-01
申请号：KR1020070030065
申请日：2007-03-27
Applicant: 삼성전자주식회사
Inventor： 김덕겸
Abstract: A device and a method for aligning phase are provided to remove an error accumulated in phase alignment, shorten a phase alignment time remarkably, and offer economical efficiency and easy usage with the reduced number of phase aligners by using a logical gate and a deskew unit. A plurality of drivers(DR1-DRn) output a test signal. A logical gate(120) such as an OR gate receives and composes the test signals of the drivers. A deskew unit(130) delays the composed signal as much as a predetermined delay value. Plural comparators(CP1-CPn) measure a phase delay value by receiving the test signals and a delay signal, and comparing the matched signals, and align the remaining signals to the signal having the biggest phase delay value among the phase delay values. The drivers output a normal signal according to the signal having the biggest phase delay value among the phase delay values.
Abstract translation: 提供了一种用于对准相位的装置和方法，以消除相位对准中累积的误差，显着缩短相位对准时间，并且通过使用逻辑门和偏移单元来减少相位对准器的数量，提供经济的效率和容易的使用。 多个驱动器（DR1-DRn）输出测试信号。 诸如OR门的逻辑门（120）接收并组成驱动器的测试信号。 歪斜度单元（130）将合成信号延迟到预定的延迟值。 多个比较器（CP1-CPn）通过接收测试信号和延迟信号来测量相位延迟值，并比较匹配信号，并将剩余信号与相位延迟值中具有最大相位延迟值的信号对准。 驱动器根据在相位延迟值中具有最大相位延迟值的信号输出正常信号。
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公开(公告)号：KR1020080070100A
公开(公告)日：2008-07-30
申请号：KR1020070007700
申请日：2007-01-25
Applicant: 삼성전자주식회사
IPC: H01L21/66
CPC classification number: H01L21/67271 , H01L21/67288
Abstract: A wafer checking device for a semiconductor manufacturing device and a checking method thereof are provided to minimize the generation of badness by forming a controller for displaying a normal or abnormal condition and separating a defect wafer. A wafer checking device for a semiconductor manufacturing device comprises a wafer handler part(16) transferring a loaded wafer, a wafer handler control part(14) controlling the wafer handler part, a wafer reading section(18), a controller(20), and a display part(22). The wafer reading section reads the badness of the wafer transferred from the wafer handler part. The controller controls to display a normal or abnormal condition by receiving a wafer reading signal from the wafer reading section, and to separate a defect wafer. The display part displays the normal or abnormal condition of the wafer by control of the controller.
Abstract translation: 提供一种用于半导体制造装置的晶片检查装置及其检查方法，用于通过形成用于显示正常或异常状况的控制器和分离缺陷晶片来最小化不良的产生。 一种用于半导体制造装置的晶片检查装置包括：转印加载的晶片的晶片处理器部分（16），控制晶片处理器部分的晶片处理器控制部分（14），晶片读取部分（18），控制器（20） 和显示部（22）。 晶片读取部读取从晶片处理器部件传送的晶片的不良情况。 控制器通过从晶片读取部接收晶片读取信号并且分离缺陷晶片来控制显示正常或异常状态。 显示部通过控制器的控制来显示晶片的正常或异常状态。
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