Abstract:
PURPOSE: A structure of a wafer guide is provided to improve a structure of a wafer guide pin disposed in a baking unit of a spinner equipment, thereby exactly mounting a wafer at a right position though the wafer is incorrectly conveyed. CONSTITUTION: The device comprises a guide pin(230) provided along with an outer circumference of a mounting portion(220) on which a wafer is mounted and having a corner portion inclined at a desired angle about an inside direction of the mounting portion; and an up/down pin(240) provided at a desired portion of the mounting portion to move the wafer in a vertical direction, wherein three or more guide pins and up/down pins are provided. In the structure, the guide pin is formed of a heat resistant ceramic material. The guide pin has a triangular pyramid shape. The corner portion inclined at 40 to 50 degree is arranged toward an inside of the mounting portion, and the rest two corner portion are arranged toward an outside of the mounting portion.
Abstract:
PURPOSE: An apparatus and a method for supplying a photoresist solution of a spin coating unit are provided to measure correctly the amount of photoresist solution by installing a flow meter at a supply tube between a filter and a suck valve. CONSTITUTION: The first drain tube(14a) is installed at an intermediate tank(14) in order to discharge residues of the photoresist solution from the intermediate tank(14). The photoresist solution stored in the intermediate tank(14) is supplied to a filter(18) by a pump(16). The photoresist solution is filtered by the filter(18). The filtered photoresist solution is supplied to a nozzle through a suck valve(20). The second drain tube(18a) is installed at the filter(18) in order to discharge the residues of the photoresist solution. The pump(16) is connected with a control portion(50). A flow meter(40) is installed at a supply tube between the filter(18) and the suck valve(20). The suck valve(20) is controlled by control portion(50). A spin coating device(30) rotates a rotary chuck(32) by using a rotary motor(34). The photoresist solution drops from the nozzle to a wafer(W).
Abstract:
PURPOSE: A semiconductor fabricating equipment with a wafer mapping check system, and a method of checking a wafer mapping are provided to inform a user of a fact that a wafer mapping result performed in a process equipment is disagreed with a wafer mapping data in a system. CONSTITUTION: The device and method comprise an automation system(100) having data of a wafer mapping to be supplied to a semiconductor fabricating process and performing whole controlling operations; a robot system(120) connected with the automation system(100) and conveying a wafer; a process equipment(110) for performing a mapping operation with respect to a wafer conveyed from a robot system(120); and a wafer mapping check portion for comparing a wafer mapping result performed in the process equipment(110) with data from the automation system(100) and informing to a user if the wafer mapping result performed in the process equipment(110) is disagreed with the wafer mapping data. In the equipment, the wafer mapping check portion comprises the first counter(131) for showing the wafer mapping data from the automation system(100), the second counter(132) for showing the wafer mapping data from the processor equipment(110), and a comparator(133) for comparing counted values of the first(131) and second counter(132).
Abstract:
PURPOSE: Photolithography equipment is provided to shorten an interval of time for transferring a wafer from conventional developing equipment to curing equipment and to reduce wafer standby time needed in a conventional disposition process, by compositively performing a curing process in the developing equipment by a single-wafer-type method. CONSTITUTION: Coating equipment(100) applies photoresist on a wafer. Exposure equipment(200) projects a predetermined pattern on the photoresist-coated wafer. A developing process for developing the wafer having the predetermined pattern and a curing process for curing the developed wafer are performed in developing/curing composite equipment(300). Wafer transfer equipment transfers the wafer so that each process is continuously performed in the coating equipment, the exposure equipment and the developing/curing composite equipment.
Abstract:
PURPOSE: A bake apparatus of semiconductor fabrication equipment is provided to set a wafer on a proper position of a hot plate by using a guide sensor. CONSTITUTION: A process chamber(100) is used for performing a bake process. A hot plate(110) is installed within the process chamber(100) in order to perform the bake process by heating a wafer(130). A plurality of support pins(120) are installed on the hot plate(110) in order to load or unload the wafer(130) on the hot plate(110). A plurality of guide sensors(140) are installed on the hot plate(110) in order to guide the wafer(130) to a proper position. The guide sensors(140) are used as optical sensors. An insulating body(150) is installed on a contact portion between the hot plate(110) and the guide sensors(140) in order to protect the guide sensors(140) from the heat.
Abstract:
PURPOSE: A flux control device of photo spinner equipment is provided to control a variation of injected chemicals by checking correctly a variation of flow rate in the photo spinner equipment. CONSTITUTION: A controller(50) outputs control signals for controlling valves, flow rates, and pressures. The first and the second pressure valves(60,62) are used for controlling the pressures. The first and the second pin flows(64,66) are used for outputting flow detection signals. The first and the second filters(68,70) are used for filtering deionized water. The first flow meter(72) is used for measuring the flow rate of the deionized water filtered by the first filter(68). A rinse nozzle(78) is used for injecting the deionized water. The first suck back valve(74) is used for sucking the remaining drops of the injected deionized water. A back rinse nozzle(80) is used for injecting the filtered deionized water. The second suck back valve(76) is used for sucking the remaining drops of the injected deionized water. A develop A and B(82,84) are used for storing develop solution. A bubble removal system(86) is used for removing bubbles from develop solution. The third pin flow(88) is used for outputting a flow detection signal of the develop solution. The third filter(90) is used for filtering the develop solution. The second flow meter(92) is used for measuring the flow rate of the develop solution. A develop nozzle(96) is used for injecting the develop solution. The third suck back valve(94) is used for sucking the remaining drops of the develop solution.