公开(公告)号：KR2020010001412U

公开(公告)日：2001-01-15

申请号：KR2019990011852

申请日：1999-06-29

Applicant: 삼성전자주식회사

Inventor： 박정혁 ,  우창우 ,  윤명식 ,  김향란

IPC: B25B5/14

Abstract: 목적: 본고안은고주파플라즈마를이용한건식식각공정에서파생되는정전기유도시에도핑거부저면에웨이퍼가부착되는것을방지할수 있는건식식각장치의클램프링을제공한다. 구성: 챔버내 척전극의상부면에안치된웨이퍼(WF)의외주측에지부를상부에서눌러고정하도록내주면에다수의핑거부(142)가형성된클램프링(140)을갖는건식식각장치에있어서, 상기핑거부(142) 저면을너얼링가공하여요철(142a)을형성함으로써웨이퍼(WF)와의접촉면적을줄일수 있다. 효과: 웨이퍼를눌러고정하는클램프링의핑거부저면을웨이퍼와의접촉면적을줄일수 있는동시에공간방전을속행시킬수 있는구조로개선하여정전기충전으로인한웨이퍼의부착을방지할수 있고, 이에따라서웨이퍼의클램프링 부착으로인해발생되던공정상의불량을해결할수 있어수율을양호하게확보할수 있다.

公开(公告)号：KR1020070064734A

公开(公告)日：2007-06-22

申请号：KR1020050125142

申请日：2005-12-19

Applicant: 삼성전자주식회사

Inventor： 김정수 ,  김봉수 ,  김태영 ,  이은순 ,  명현규 ,  김향란 ,  이기준

IPC: H01L21/66

CPC classification number: H01L22/12 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8887

Abstract: A method for inspecting a defect in a semiconductor device fabricating process is provided to check out a gray level of the different region between a basic image and an inspection image. A basic image having a pattern with no defect is obtained(S11), and an inspection image having a pattern for inspecting whether a defect occurs actually is obtained(S13). The basic image is compared with the inspection image to identify a difference therebetween(S15). If there is a difference, a gray level is obtained(S17), and the maximum value and mean value of the gray level are obtained(S19). The maximum value of the gray level is subtracted by the meal value to determine occurrence of the defect(S21,S23).

Abstract translation: 提供了一种用于检查半导体器件制造工艺中的缺陷的方法，以检查基本图像和检查图像之间的不同区域的灰度级。 获得具有无缺陷图案的基本图像（S11），并且获得具有用于检查是否实际发生缺陷的图案的检查图像（S13）。 将基本图像与检查图像进行比较以识别它们之间的差异（S15）。 如果存在差异，则得到灰度级（S17），得到灰度级的最大值和平均值（S19）。 灰度值的最大值由餐值减去以确定缺陷的发生（S21，S23）。