公开(公告)号：KR1020000043452A

公开(公告)日：2000-07-15

申请号：KR1019980059831

申请日：1998-12-29

Applicant: 삼성전자주식회사

Inventor： 문수민 ,  이용휘

IPC: H01L21/265

Abstract: PURPOSE: A vacuum controlling system used for a rapid thermal processing equipment is provided to enable a disassembly of an adaptor without damaging spare parts. CONSTITUTION: A vacuum controlling system(20) includes a lamp module(21) having a lamp and a quartz window, and an adaptor(22) equipped inside the lamp module(21) to control vacuum pressure. The lamp emits radiant light to apply heat to a wafer in a chamber, and the quartz window prevents interference between radiant lights. The adaptor(22) is connected to a loadlock(23) through a gas line(24) having a vacuum gauge(25) for measuring the degree of vacuum inside the gas line(24). The measured data of a vacuum pressure is transmitted to a controller(26), and the controller(26) controls a vacuum pressure below 15 torr. The gas line(24) is branched by a hand tri-route valve(27) and then connected to a vacuum cutoff valve(28) and an atmosphere cutoff valve(29) both controlled by the controller(26). To disassemble the adaptor(22), the vacuum cutoff valve(28) is closed and the atmosphere cutoff valve(29) is slowly opened according to output signals of the controller(26). Therefore, the difference in pressure between the adaptor(22) and the atmosphere is slowly diminished.

Abstract translation: 目的：提供用于快速热处理设备的真空控制系统，以便拆卸适配器，而不会损坏备件。 构成：真空控制系统（20）包括具有灯和石英窗的灯模块（21）和配置在灯模块（21）内部以控制真空压力的适配器（22）。 灯发出辐射光以将热量施加到室中的晶片，并且石英窗口防止辐射光之间的干扰。 适配器（22）通过具有用于测量气体管线（24）内的真空度的真空计（25）的气体管线（24）连接到负载锁（23）。 真空压力的测量数据被传送到控制器（26），并且控制器（26）控制低于15托的真空压力。 气体管线（24）由手动三通阀（27）分支，然后连接到由控制器（26）控制的真空截止阀（28）和气氛截止阀（29）。 为了拆卸适配器（22），根据控制器（26）的输出信号，关闭真空截止阀（28）并且大气截止阀（29）缓慢打开。 因此，适配器（22）和大气之间的压力差被缓慢地减小。

公开(公告)号：KR1020000008055A

公开(公告)日：2000-02-07

申请号：KR1019980027701

申请日：1998-07-09

Applicant: 삼성전자주식회사

Inventor： 장대근 ,  문수민 ,  이용위 ,  홍상균

IPC: H01L21/324

Abstract: PURPOSE: A semiconductor wafer annealing apparatus is provided to improve a uniformity of heat treatment of the wafer by heating sides of wafer using a side heating ramp. CONSTITUTION: The annealing apparatus comprises an upper heating ramp(4) for heating an upper surface of a wafer(2) loaded in an annealing chamber(1) by irradiating lights; and a side heating ramp(5) for heating both sides of the wafer(2) by irradiating lights. The wafer(2) is horizontally rotating by a spinner(3). The side heating ramp(5) is made of a pair of halogen ramp. The upper heating ramp(4) includes a plurality of unit ramps(6).

Abstract translation: 目的：提供半导体晶片退火装置，通过使用侧面加热斜面加热晶片的侧面来提高晶片的热处理的均匀性。 构成：退火装置包括用于通过照射光来加载装载在退火室（1）中的晶片（2）的上表面的上加热斜面（4） 和用于通过照射光来加热晶片（2）两侧的侧面加热斜面（5）。 晶片（2）由旋转器（3）水平旋转。 侧加热斜面（5）由一对卤素斜面制成。 上加热斜坡（4）包括多个单位斜坡（6）。

公开(公告)号：KR1020030072870A

公开(公告)日：2003-09-19

申请号：KR1020020012139

申请日：2002-03-07

Applicant: 삼성전자주식회사

Inventor： 문수민

IPC: H01L21/68

Abstract: PURPOSE: A semiconductor wafer transfer apparatus is provided to be capable of preventing the deterioration of packing characteristic due to high temperature heat and minimizing the generation of particles by forming a packing using ceramic. CONSTITUTION: A semiconductor wafer transfer apparatus is provided with the first arm, the second arm, a blade, the first and second connection part having a circular bearing part(250), connected with the first and second arm, respectively, a connection part cover connected to one end of the blade for covering the first and second connection part, and a sealing part(270) having a packing(275), installed between the first and second connection part, and the connection part cover. Preferably, the packing is made of ceramic. Preferably, a grease-free bearing is used as the bearing part.

Abstract translation: 目的：提供半导体晶片转印装置，以能够防止由于高温热导致的包装特性的劣化，并且通过使用陶瓷形成包装来最小化颗粒的产生。 构成：半导体晶片传送装置设置有第一臂，第二臂，叶片，第一和第二连接部分分别具有与第一和第二臂连接的圆形支承部分（250），连接部分盖 连接到叶片的一端以覆盖第一和第二连接部分，以及密封部分（270），其具有安装在第一和第二连接部分之间的密封件（275）和连接部件盖。 优选地，包装由陶瓷制成。 优选地，使用无油脂轴承作为轴承部件。

公开(公告)号：KR1019990031284A

公开(公告)日：1999-05-06

申请号：KR1019970051938

申请日：1997-10-10

Applicant: 삼성전자주식회사

Inventor： 장대근 ,  이용위 ,  조풍연 ,  문수민

IPC: H01L21/324

Abstract: 본 발명은 가열램프의 용량을 개선한 RTP (Rapid Thermal Process)장비에 관한 것으로서, 웨이퍼를 어닐링(annealing)하는 RTP장비의 가열램프들에 있어서, 가열램프부의 가장자리에 구성되는 가열램프들은 가장자리에 존재하기 때문에, 열손실이 생기고, 그를 보충하기 위한 높은 전원 공급에 의해 가열램프들의 손상이 일어나게 된다. 그러므로 가열램프부의 가장자리에 구성되는 가열램프들의 용량을 기존에 사용된 가열램프들보다 큰 것으로 사용해줌으로써, 가열램프의 수명을 길게 할 수 있으며, 그 만큼 작업효율이 증가하는 이점이 있다.