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公开(公告)号：KR101689274B1
公开(公告)日：2016-12-23
申请号：KR1020100088407
申请日：2010-09-09
Applicant: 삼성전자주식회사
CPC classification number: F21V17/02 , F21K9/20 , F21K9/69 , F21V5/04 , F21V5/045 , F21V14/06 , F21V17/12 , F21V29/504 , F21V29/507 , F21Y2115/10
Abstract: 조명장치가제공된다. 본발명에따른조명장치는, 기판상에장착되는광원모듈; 상기광원모듈상에구비되며, 상기광원을수용하는수용홈을구비하는렌즈부; 상기렌즈부를내부에수용하여상기렌즈부를외부로부터보호하는하우징부; 상기기판상에고정되며, 상기하우징부가체결되는결합홀을구비하여상기하우징부를지지하는지지부; 및상기하우징부가상기지지부에상하이동가능하도록체결시켜상기렌즈부의높이가가변되도록조절하는높이조절부;를포함한다.
Abstract translation: 提供照明装置。 照明装置包括：安装在基板上的光源模块; 透镜单元，设置在所述光源模块上并且包括容纳所述光源模块的容纳槽; 将透镜单元容纳在其中以将透镜单元从外部保护的壳体单元; 支撑单元，其固定到所述基板并且包括联接孔，所述联接孔具有联接到其上的所述壳体单元，从而支撑所述壳体单元; 以及高度调节单元，其允许所述壳体单元可垂直移动地联接到所述支撑单元并且调节所述透镜单元的高度，使得所述透镜单元的高度变化。
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公开(公告)号：KR1020130081470A
公开(公告)日：2013-07-17
申请号：KR1020120002467
申请日：2012-01-09
Applicant: 삼성전자주식회사
CPC classification number: B05B1/304 , B05B1/3046 , B05B15/18
Abstract: PURPOSE: A fluorescent substance dispenser is provided to overcome the abrasion problem of a tappet and a nozzle which are abraded by fluorescent substances in a fluorescent liquid during a dispensing process. CONSTITUTION: A fluorescent substance dispenser comprises a nozzle (110) and a tappet (140). The nozzle includes a space for a fluorescent liquid. An opening (112) is exposed to the space and dispenses the fluorescent liquid. The tappet allows the nozzle to dispense the fluorescent liquid by linearly reciprocating toward the nozzle. The tappet comprises a cylinder part (144) and a hemispherical convex part (142). The hemispherical convex part (142) which is convex from the cylinder part toward the nozzle. The convex part is based on polycrystalline diamond.
Abstract translation: 目的：提供荧光物质分配器以克服在分配过程中由荧光物质中的荧光物质磨损的挺杆和喷嘴的磨损问题。 构成：荧光物质分配器包括喷嘴（110）和挺杆（140）。 喷嘴包括用于荧光液体的空间。 一个开口（112）暴露在该空间并分配荧光液体。 挺杆允许喷嘴通过向喷嘴线性往复地分配荧光液体。 挺杆包括圆筒部（144）和半球形凸部（142）。 从圆筒部朝向喷嘴凸起的半球形凸部（142）。 凸部是基于多晶金刚石。
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公开(公告)号：KR1020100042065A
公开(公告)日：2010-04-23
申请号：KR1020080101188
申请日：2008-10-15
Applicant: 삼성전자주식회사
Inventor： 박헌용
IPC: H01L33/60
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: PURPOSE: An LED package including a reflector cup formed by a folding method is provided to improve the brightness of the LED package with a reflective surface by forming the reflective surface with a metal material. CONSTITUTION: An LED chip device(110) emits light according to electrical signal. A first lead frame(120) electrically connects to the LED chip device. A second lead frame(130) is formed to be corresponded to the first lead frame. A folding unit(140) is integrally connected to the second lead frame and includes a sub-base. A base is arranged to be adjacent to the first lead frame and the surface of the base are folded to form the sub-base.
Abstract translation: 目的：提供一种包括通过折叠方法形成的反射杯的LED封装，通过用金属材料形成反射表面来提高具有反射表面的LED封装的亮度。 构成：LED芯片装置（110）根据电信号发光。 第一引线框架（120）电连接到LED芯片器件。 第二引线框架（130）形成为对应于第一引线框架。 折叠单元（140）一体地连接到第二引线框架并且包括子基座。 基部布置成与第一引线框架相邻并且基部的表面被折叠以形成子基座。
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公开(公告)号：KR101761637B1
公开(公告)日：2017-07-27
申请号：KR1020100117586
申请日：2010-11-24
Applicant: 삼성전자주식회사
CPC classification number: H01L33/58 , H01L33/486 , H01L2224/45139 , H01L2224/48091 , H01L2224/48247 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
Abstract: 발광다이오드패키지의제조방법이개시된다. 본발명의실시예에따른발광다이오드패키지의제조방법은, 캐비티의바닥면의일측에노출되도록삽입된제1 리드프레임과, 타측에노출되도록삽입된제2 리드프레임을포함하는패키지본체를마련하는단계, 캐비티의바닥면에발광다이오드칩을실장하고발광다이오드칩과제1 리드프레임및 제2 리드프레임을전기적으로연결하는단계, 발광다이오드칩이실장된캐비티내부에몰딩수지를충진하여몰딩부를형성하는단계, 몰딩부에대응하는위치에형성되고내부면이선형또는비선형으로경사진형태를갖는관통홀을포함하는제1 금형을패키지본체의상부면에결합하는단계, 관통홀에대응하는위치에형성된금형패턴을포함하는제2 금형을제1 금형의상부면에결합하는단계, 투명수지를제1 금형의관통홀및 제2 금형의금형패턴에충진시켜몰딩부상에렌즈부를형성하는단계및 패키지본체로부터제1 금형및 제2 금형을분리하는단계를포함한다.
Abstract translation: 公开了一种制造发光二极管封装的方法。 制造根据本发明的一个实施例的发光二极管封装件的方法，并且所述第一引线插入，以便在所述腔的底表面的一侧被暴露，提供包括插入，从而在另一侧上暴露的第二引线框的封装体 步骤，在安装腔体的底表面上的LED芯片，以形成LED芯片指派第一引线框架和电连接的引线框的第二步骤的步骤中，所述发光二极管芯片yisiljang通过填充成型树脂模制部内的腔体 在在对应于所述步骤的位置形成对应于模具图案的成型部分的位置处形成，贯通孔到第一模具组合包括在所述封装主体的服装面的通孔具有在其内表面双线性或非线性的倾斜形状 用透明树脂填充第一模具的通孔和第二模具的模具图案以在模塑部分上形成透镜部分;以及 它包括分离从封装体的第一模具和第二模具的步骤。
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公开(公告)号：KR1020170051004A
公开(公告)日：2017-05-11
申请号：KR1020150153258
申请日：2015-11-02
Applicant: 삼성전자주식회사
CPC classification number: H01L33/505 , H01L33/30 , H01L33/382 , H01L33/486 , H01L33/504 , H01L33/56 , H01L2933/0041
Abstract: 본발명의기술적사상에의한발광소자패키지는, 발광소자(Light Emitting Device; LED) 칩; 상기발광소자칩의상에부착된형광체필름; 및상기발광소자칩의측면을덮도록형성되는몰딩형광체;를포함할수 있다.
Abstract translation: 根据本发明的技术思想的发光器件封装包括发光器件（LED）芯片; 附着在发光器件芯片上的荧光膜; 并且模制荧光体被形成为覆盖发光器件芯片的侧表面。
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Patent Agency Ranking
公开(公告)号：KR1020170006945A
公开(公告)日：2017-01-18
申请号：KR1020150098410
申请日：2015-07-10
Applicant: 삼성전자주식회사
CPC classification number: H01L33/60 , H01L33/486 , H01L33/50 , H01L33/505 , H01L33/58 , H01L2224/16 , H01L2924/181 , H01L2933/0041 , H01L2933/0066 , H01L2924/00012
Abstract: 상술한과제를해결하기위하여본 발명의기술적사상의일 실시예에의한발광장치는상면및 하면을관통하는캐비티가형성된반사층, 상기캐비티내에배치되며, 발광적층체, 및상기발광적층체의하면에서상기발광적층체와연결되는전극을포함하는발광소자, 및상기캐비티를채우며, 상기발광소자의상면및 측면을덮는파장변환부를포함하며, 상기파장변환부는상기전극의적어도일부를외부로노출시키는것을특징으로한다.
Abstract translation: 发光装置包括反射层，反射层包括从反射层的顶表面到底表面穿透反射层的空腔; 设置在所述空腔中的发光器件，所述发光器件包括发光叠层和在所述发光叠层的底表面处连接到所述发光叠层的电极; 以及波长转换层，其填充所述空腔并覆盖所述发光器件的顶表面和侧表面，其中所述波长转换层将所述电极的至少一部分暴露于外部。
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公开(公告)号：KR1020120068627A
公开(公告)日：2012-06-27
申请号：KR1020100130325
申请日：2010-12-17
Applicant: 삼성전자주식회사
CPC classification number: H01L33/58 , H01L33/486 , H01L33/60 , H01L2224/48091 , Y10S362/80 , H01L2924/00014
Abstract: PURPOSE: A light emitting device package is provided to prevent a filling member from being easily separated by improving adhesion between the filling member and a package body. CONSTITUTION: A plurality of lead frames(20) are electrically connected to a light emitting device. A package body(30) includes a receiving groove for receiving the light emitting device and a plurality of support units which are protruded from the inner side of the receiving groove. A filling member(40) includes a combination groove combined with the support unit and is formed in the receiving groove. A support unit(50) is extended from the bottom of the receiving groove to the upper side of the package body opened by the receiving groove.
Abstract translation: 目的：提供一种发光器件封装，以防止填充构件通过改善填充构件与封装体之间的粘附而容易地分离。 构成：多个引线框架（20）电连接到发光器件。 封装体（30）包括用于接收发光器件的接收槽和从接收槽的内侧突出的多个支撑单元。 填充构件（40）包括与支撑单元组合的组合凹槽，并形成在容纳槽中。 支撑单元（50）从容纳槽的底部延伸到由容纳槽打开的包装体的上侧。
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公开(公告)号：KR1020140129749A
公开(公告)日：2014-11-07
申请号：KR1020130048440
申请日：2013-04-30
Applicant: 삼성전자주식회사
IPC: F21V5/04 , F21S2/00 , G02F1/13357
CPC classification number: G02F1/133603 , F21K9/233 , F21V5/04 , F21Y2115/10 , G02B19/0014 , G02B19/0028 , G02B19/0061 , G02F2001/133607
Abstract: 본 발명의 일 실시 형태에 따른 광원 유닛은, 빛을 방출하는 발광소자; 및 상기 빛이 입사되는 입사면을 갖는 제1면 및 상기 입사면을 통해 입사된 상기 빛을 외부로 방출하는 제2면을 갖는 광학소자를 포함하며, 상기 제1면은 상기 제2면을 향해 함몰되어 상기 입사면을 형성하는 리세스를 가지며, 상기 제2면은 상기 제1면의 가장자리로부터 돔 형태로 돌출되되 중심이 상기 평면부를 향해 함몰된 오목부를 가지며, 상기 입사면은 상기 리세스의 정점을 이루는 평면부 및 상기 평면부로부터 상기 제1면까지 연장되어 개구를 형성하는 곡면부를 포함한다.
Abstract translation: 根据本发明的实施例，光源单元包括：发光的发光器件; 以及具有第一表面的光学器件，其具有透射光的入射表面，以及通过入射表面将光透射到外部的第二表面。 第一表面包括凹陷，该凹陷朝向第二表面凹陷并形成入射表面。 第二表面包括从第一表面的边缘突出并且具有朝向平坦表面部分凹陷的凹陷部分。 入射表面包括：作为凹部的最高部分的平坦表面部分; 以及从平坦部分延伸到第一表面并形成开口的弯曲部分。
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公开(公告)号：KR1020130127838A
公开(公告)日：2013-11-25
申请号：KR1020120051650
申请日：2012-05-15
Applicant: 삼성전자주식회사
CPC classification number: H01L33/46 , H01L33/48 , H01L33/483 , H01L33/486 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00014
Abstract: A light emitting device package is disclosed. The disclosed light emitting device package comprises an upper body including an inclined surface and a lower body having a concave part by providing an upper surface which meets the inclined surface at the lower part. A pre-mold in which multiple vertical holes are formed and a molding member filled in the concave part are formed on the inclined surface. The bonding force between the molding member and the pre-mold is increased by filling the vertical hole with the molding member. Therefore, it prevents the molding member from being separated from the pre-mold.
Abstract translation: 公开了一种发光器件封装。 所公开的发光器件封装包括通过提供与下部的倾斜表面相遇的上表面的包括倾斜表面的上体和具有凹部的下体。 形成有多个垂直孔的预模具和填充在凹部中的模制构件形成在倾斜表面上。 通过用模制构件填充垂直孔来增加模制构件和预模具之间的结合力。 因此，防止模制构件与预模具分离。
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公开(公告)号：KR1020120056068A
公开(公告)日：2012-06-01
申请号：KR1020100117586
申请日：2010-11-24
Applicant: 삼성전자주식회사
CPC classification number: H01L33/58 , H01L33/486 , H01L2224/45139 , H01L2224/48091 , H01L2224/48247 , H01L2933/0058 , H01L33/56 , H01L33/62 , H01L2924/00014 , H01L2924/00
Abstract: PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to reduce a stripping or separation between components using a mold which has a structure with reduced physical strength with a lens part. CONSTITUTION: A package main body(210) comprises a first lead frame(221) and a second lead frame(222). A light emitting diode chip(230) is mounted on the first lead frame. The light emitting diode chip and the second lead frame are bonded with a wire(240). A lens part(260) is formed using a first mold(310) and a second mold(320). The first mold comprises a penetration hole(311) which is formed at a position corresponding to a molding part(250).
Abstract translation: 目的：提供一种发光二极管封装及其制造方法，以减少使用具有透镜部件的具有降低的物理强度结构的模具的部件之间的剥离或分离。 构成：包装主体（210）包括第一引线框架（221）和第二引线框架（222）。 发光二极管芯片（230）安装在第一引线框架上。 发光二极管芯片和第二引线框架用导线（240）接合。 使用第一模具（310）和第二模具（320）形成透镜部件（260）。 第一模具包括形成在对应于成型部件（250）的位置处的贯通孔（311）。
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