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公开(公告)号：KR1020130102746A
公开(公告)日：2013-09-23
申请号：KR1020120023817
申请日：2012-03-08
Applicant: 삼성전자주식회사
CPC classification number: H01L33/48 , H01L33/0079 , H01L2224/32225 , H01L2933/0033
Abstract: PURPOSE: A method for manufacturing a light emitting device is provided to reduce the number of components by omitting a supporting substrate for holding a semiconductor layer. CONSTITUTION: A light emitting laminate (20) is formed on a growth substrate. The light emitting laminate consists of a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The growth substrate is removed. An insulating layer (50) is formed on the lateral surface of the light emitting laminate. The first conductivity type semiconductor layer is electrically connected to one electrode terminal of a corresponding terminal part (40).
Abstract translation: 目的：提供一种制造发光器件的方法，通过省略用于保持半导体层的支撑衬底来减少部件数量。 构成：在生长基板上形成发光层叠体（20）。 发光层叠体由第一导电型半导体层，有源层和第二导电型半导体层构成。 去除生长底物。 绝缘层（50）形成在发光层压板的侧表面上。 第一导电型半导体层电连接到相应的端子部分（40）的一个电极端子。
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公开(公告)号：KR1020140103513A
公开(公告)日：2014-08-27
申请号：KR1020130016971
申请日：2013-02-18
Applicant: 삼성전자주식회사
CPC classification number: H01L33/62 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/97 , H01L33/08 , H01L33/54 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83385 , H01L2224/83805 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/0133 , H01L2924/12041 , H01L2924/12042 , H01L2924/15151 , H01L2924/181 , H01L2933/0066 , H05B33/0842 , H01L2224/45099 , H01L2924/0105 , H01L2924/01028 , H01L2924/01032 , H01L2924/01049 , H01L2924/01029 , H01L2924/01079 , H01L2924/01013 , H01L2924/01047 , H01L2924/00 , H01L2924/00012
Abstract: A light emitting device package is provided. The light emitting device package includes: a package substrate which includes at least one via hole; a light emitting device which is mounted to be overlapped with the via hole on the package substrate; and a bonding layer which is formed between the light emitting device and the package substrate and includes an eutectic bonding material.
Abstract translation: 提供发光器件封装。 发光器件封装包括：封装衬底，其包括至少一个通孔; 安装成与封装基板上的通孔重叠的发光器件; 以及形成在发光器件和封装衬底之间并包含共晶接合材料的接合层。
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Patent Agency Ranking
公开(公告)号：KR1020140075351A
公开(公告)日：2014-06-19
申请号：KR1020120143601
申请日：2012-12-11
Applicant: 삼성전자주식회사
CPC classification number: H01L33/508 , H01L25/0753 , H01L33/486 , H01L33/60
Abstract: A method of manufacturing a light emitting diode package comprises the steps of attaching a plurality of light emitting diode chips which are separated from each other on a mount substrate; forming light reflection patterns which are spaced apart from the light emitting diode chips at a substrate level and located on both sides; and forming a phosphor layer on the light reflection patterns and the light emitting diode chips.
Abstract translation: 制造发光二极管封装的方法包括以下步骤：在安装基板上安装彼此分离的多个发光二极管芯片; 形成在发光二极管芯片处于衬底水平并位于两侧上的光反射图案; 以及在光反射图案和发光二极管芯片上形成荧光体层。
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公开(公告)号：KR1020170006945A
公开(公告)日：2017-01-18
申请号：KR1020150098410
申请日：2015-07-10
Applicant: 삼성전자주식회사
CPC classification number: H01L33/60 , H01L33/486 , H01L33/50 , H01L33/505 , H01L33/58 , H01L2224/16 , H01L2924/181 , H01L2933/0041 , H01L2933/0066 , H01L2924/00012
Abstract: 상술한과제를해결하기위하여본 발명의기술적사상의일 실시예에의한발광장치는상면및 하면을관통하는캐비티가형성된반사층, 상기캐비티내에배치되며, 발광적층체, 및상기발광적층체의하면에서상기발광적층체와연결되는전극을포함하는발광소자, 및상기캐비티를채우며, 상기발광소자의상면및 측면을덮는파장변환부를포함하며, 상기파장변환부는상기전극의적어도일부를외부로노출시키는것을특징으로한다.
Abstract translation: 发光装置包括反射层，反射层包括从反射层的顶表面到底表面穿透反射层的空腔; 设置在所述空腔中的发光器件，所述发光器件包括发光叠层和在所述发光叠层的底表面处连接到所述发光叠层的电极; 以及波长转换层，其填充所述空腔并覆盖所述发光器件的顶表面和侧表面，其中所述波长转换层将所述电极的至少一部分暴露于外部。
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公开(公告)号：KR1020140105295A
公开(公告)日：2014-09-01
申请号：KR1020130019376
申请日：2013-02-22
Applicant: 삼성전자주식회사
CPC classification number: H01L33/62 , H01L27/153 , H01L33/46 , H01L33/502 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/0002 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
Abstract: According to the present invention, a light emitting device package includes a package substrate on which via holes are formed; an electrode layer which penetrates the via holes and is extended to surfaces of both sides of the package substrate; a light emitting device which is arranged on the package substrate and is electrically connected to the electrode layer; and a fluorescent film which includes a first portion filling in at least a portion of an inner space of the via holes, and a second portion covering at least a portion of the light emitting device.
Abstract translation: 根据本发明，发光器件封装包括其上形成有通孔的封装基板; 穿过所述通孔并延伸到所述封装基板的两侧的表面的电极层; 发光器件，其布置在所述封装衬底上并电连接到所述电极层; 以及荧光膜，其包括填充所述通孔的内部空间的至少一部分的第一部分和覆盖所述发光器件的至少一部分的第二部分。
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公开(公告)号：KR1020150042362A
公开(公告)日：2015-04-21
申请号：KR1020130120760
申请日：2013-10-10
Applicant: 삼성전자주식회사
CPC classification number: H01L33/50 , H01L33/005 , H01L33/0095 , H01L33/505 , H01L33/54 , H01L33/58 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/181 , H01L2933/0041 , H01L2924/00012 , H01L2924/00
Abstract: 본발명은발광다이오드패키지에관한것으로서, 패키지본체; 상기패키지본체상에실장된발광다이오드칩; 상기발광다이오드칩의측면을둘러싸도록배치되며광투과성을포함하고, 상부를향하는경사면을갖는측면경사부; 및상기경사면및 상기발광다이오드칩의상면에배치된파장변환층;을포함하여,발광다이오드패키지의색온도편차가감소되고색품질이향상되는효과가있다.
Abstract translation: 本发明涉及发光二极管封装。 根据本发明的发光二极管封装包括封装体，安装在封装主体上的发光二极管芯片，设置成围绕发光二极管芯片的侧面的横向倾斜部分具有透光率 并且包括面向上的倾斜表面和布置在发光二极管芯片和倾斜表面的上侧上的波长转换层。 发光二极管封装的色温偏差降低，颜色质量提高。
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