公开(公告)号：KR1020090039082A

公开(公告)日：2009-04-22

申请号：KR1020070104507

申请日：2007-10-17

Applicant: 삼성전자주식회사

Inventor： 오수찬 ,  부재필 ,  김익주

IPC: H01L21/00 ,  H01L21/02

CPC classification number: H01L21/67242 ,  H01L21/67207

Abstract: A magnetic cylinder is provided to reduce an installation space of a cylinder by performing a position control of an object with one cylinder. A housing(110) includes a first side wall(110a), a second side wall(110b), and a body(110c) of a tube shape. The second side wall is faced with the first side wall. The body of the tube shape is arranged between the first side wall and the second side wall. The first side wall and the second side wall include a magnetic field generating part(150). The magnetic field generating part generates a first magnetic field. A plate(120) is formed inside the housing, and is flowed between the first side wall and the second side wall. The plate includes a first surface(120a) having a first magnetic pole and a second surface(120b) having a second magnetic pole different from the first magnetic pole. A plate stopper(140) is arranged in an outer part of the housing, is flowed according to the body of the tube shape, and generates a second magnetic field.

Abstract translation: 提供一个磁性气缸，通过用一个气缸执行物体的位置控制来减小气缸的安装空间。 壳体（110）包括第一侧壁（110a），第二侧壁（110b）和管状体（110c）。 第二侧壁面对第一侧壁。 管状体设置在第一侧壁和第二侧壁之间。 第一侧壁和第二侧壁包括磁场产生部分（150）。 磁场产生部分产生第一磁场。 板壳（120）形成在壳体内部，并且在第一侧壁和第二侧壁之间流动。 板包括具有第一磁极的第一表面（120a）和具有不同于第一磁极的第二磁极的第二表面（120b）。 在壳体的外部设置有板状止动件（140），其根据管状体流动，并产生第二磁场。

公开(公告)号：KR1020080013161A

公开(公告)日：2008-02-13

申请号：KR1020060074296

申请日：2006-08-07

Applicant: 삼성전자주식회사

Inventor： 조찬우 ,  오수찬

IPC: B24B37/11 ,  B24B37/04 ,  H01L21/304

CPC classification number: B24B37/04 ,  B24B37/30 ,  B24B41/06 ,  B24B49/16

Abstract: A polishing head of a chemical mechanical polishing apparatus is provided to prevent operating rate from decreased by having a wafer sensing member to sense whether a wafer is chucked. A polishing head of a chemical mechanical polishing apparatus comprises a head main body, a porous plate, a membrane, and a wafer detecting member(150). The porous plate is located under the head main body, and provided with a plurality of vacuum holes. The membrane coats the outside of the porous plate. The wafer detecting member is configured to detect whether a wafer(W) is chucked to the membrane. The wafer detecting member includes a driven pin and a pressure measuring member(159). A first pressure feeding space(142) and a second pressure feeding space(144) are connected or disconnected by the driven pin. The pressure measuring member senses change of pressure in the first pressure feeding space through the vertical movement of the driven pin. The driven pin includes a sealing unit(153a) and an opening unit(153b). The sealing unit shuts off the space between the first and second pressure feeding spaces, in removing chucking of the wafer. The opening unit opens the space between the first and second pressure feeding spaces, in chucking the wafer.

Abstract translation: 提供化学机械抛光装置的抛光头，以通过使晶片感测构件感测是否夹紧晶片来防止工作速率降低。 化学机械抛光装置的抛光头包括头主体，多孔板，膜和晶片检测构件（150）。 多孔板位于头主体下方，并具有多个真空孔。 膜覆盖多孔板的外部。 晶片检测部件被配置为检测晶片（W）是否卡在膜上。 晶片检测部件包括从动销和压力测量部件（159）。 第一压力供给空间（142）和第二供压空间（144）由被驱动销连接或断开。 压力测量构件通过从动销的垂直运动来感测第一供压空间中的压力变化。 从动销包括密封单元（153a）和开启单元（153b）。 密封单元在去除夹紧晶片时切断第一和第二压力供给空间之间的空间。 打开单元在夹紧晶片时打开第一和第二供压空间之间的空间。