公开(公告)号：KR1020090057654A

公开(公告)日：2009-06-08

申请号：KR1020070124328

申请日：2007-12-03

Applicant: 삼성전자주식회사

Inventor： 한일영 ,  우메모토 ,  정기권 ,  최영신 ,  윤재명

IPC: G01J1/02

CPC classification number: G01B11/272 ,  B32B37/06 ,  B32B37/1018 ,  B32B38/1841 ,  B32B41/00 ,  B32B2310/028 ,  B32B2457/08

Abstract: An alignment inspecting method and an alignment inspecting apparatus are provided to align semiconductor chips welded into the junction location on a substrate. An alignment inspecting method comprises: a step of making the light incident from a first structure to a second structure; a step of reflecting the incident light in a parallel direction of the first direction; and a step of inspecting the alignment of the second structure to the first structure by detecting the reflection light. The light is incident to the second structure along the first direction which is vertical to the first structure. The step of detecting the location of the reflection light comprises a step of detecting the deviation of the central shaft of the second structure to the first direction or the slope of the second structure to the second direction meeting at right angle to the first direction. A reflecting module(310) is at the second structure.

Abstract translation: 提供对准检查方法和对准检查装置以对准焊接到衬底上的接合位置的半导体芯片。 对准检查方法包括：使从第一结构入射的光到第二结构的步骤; 将入射光沿第一方向的平行方向反射的步骤; 以及通过检测反射光来检查第二结构与第一结构的对准的步骤。 光沿着与第一结构垂直的第一方向入射到第二结构。 检测反射光的位置的步骤包括检测第二结构的中心轴与第一方向或第二结构的斜率相对于与第一方向成直角的第二方向的偏差的步骤。 反射模块（310）处于第二结构。