公开(公告)号：KR1020060019883A

公开(公告)日：2006-03-06

申请号：KR1020040068566

申请日：2004-08-30

Applicant: 삼성전자주식회사

Inventor： 우정환 ,  이병준 ,  노승기 ,  김상윤 ,  선용균 ,  김현호

IPC: H01L21/52

Abstract: 본 발명은 일반적인 형태의 패키지 제조를 위한 다이 본딩과 LOC 형태의 패키지 제조를 위한 다이 본딩을 모두 수행할 수 있도록 하는 다이 본딩 장치에 관한 것으로서, 서브스트레이트의 탑재 및 이동을 안내하는 인덱스 레일과; 소잉이 완료된 웨이퍼가 탑재되는 웨이퍼 스테이지와; 웨이퍼 스테이지에 탑재된 웨이퍼로부터 다이를 픽업하는 픽커와 그 픽커를 회전시키는 회전 구동 수단을 포함하는 픽커 셔틀 픽커 셔틀을 가지며 그 상기 픽커 셔틀을 수직 및 수평으로 이동시키는 다이 트랜스퍼와; 다이 트랜스퍼의 상기 픽커 셔틀 이동 경로 상에 위치하며 다이 트랜스퍼에 의해 이송되는 다이가 놓여지는 다이 스테이지와, 그 다이 스테이지를 소정 거리만큼 후진 동작 후에 후진 동작과 더불어 하강 동작이 이루어지도록 안내하는 안내 슬릿이 형성된 구동 안내판을 가지는 다이 스테이지 유닛; 및 다이 스테이지에 놓여진 다이에 대한 위치 정렬 상태를 검사하는 비전 카메라;를 포함하는 것을 특징으로 한다. 이에 따르면, 다양한 형태의 패키지 제조에 있어서의 다이 본딩 공정을 수행할 수 있다. 따라서, 패키지 종류에 따른 각각의 다이 본딩 장치의 구비가 필요하지 않아 공간적, 비용적 손실이 크게 줄어들 수 있다.
다이 본딩, 다이 어태치, 칩 마운트, 반도체 칩, 서브스트레이트

公开(公告)号：KR1020040022926A

公开(公告)日：2004-03-18

申请号：KR1020020054519

申请日：2002-09-10

Applicant: 삼성전자주식회사

Inventor： 안승철 ,  우정환

IPC: H01L21/68

Abstract: PURPOSE: A tape attaching apparatus for a thin wafer is provided to decrease the number of processes and prevent a process defect caused by the warpage of the thin wafer by removing the necessity of an additional wafer cassette and by supplying the wafer as it is received in a receptacle. CONSTITUTION: The receptacle(13) receiving the wafer(10) is mounted in a receiving space formed by the open upper portion of a wafer loading unit for supplying the wafer. A vacuum absorption hole(142) to which vacuum absorption force for absorbing the wafer is applied is formed in an absorption plate(131). The absorption plate has such a size to be inserted into the receiving space through the open upper portion. A transfer unit vertically and horizontally transfers a wafer detecting sensor(133) installed in the absorption plate and the absorption plate. The wafer is fixed to a wafer holder. An align jig(143) moves to the center to center the wafer and the wafer holder, installed in the peripheral of the wafer holder. A wafer flat zone detecting sensor detects the wafer flat zone placed on the wafer holder. A wafer fixing frame for supporting the wafer is supplied to a frame supply unit. The wafer fixing frame supplied from the frame supply unit is fixed to a mounting table that absorbs and fixes the wafer supplied from a wafer align unit(140). A roller attaches tape to a surface of the wafer. A tape cutter cuts the tape. An unloading unit unloads the tape attached wafer.

Abstract translation: 目的：提供用于薄晶片的胶带附着装置，以减少工艺数量并防止由于薄晶片的翘曲而导致的工艺缺陷，通过消除附加晶片盒的需要并通过将晶片接收在 一个容器 构成：接收晶片（10）的插座（13）安装在由用于供应晶片的晶片加载单元的开放上部形成的接收空间中。 在吸收板（131）中形成有用于吸收晶片的真空吸收力的真空吸收孔（142）。 吸收板具有通过开口上部插入到容纳空间中的尺寸。 传送单元垂直和水平地传送安装在吸收板和吸收板中的晶片检测传感器（133）。 晶片固定在晶片固定器上。 对准夹具（143）移动到中心，使晶片和晶片保持器居中，安装在晶片保持器的周边。 晶片平坦区域检测传感器检测放置在晶片保持器上的晶片平坦区域。 用于支撑晶片的晶片固定框架被提供给框架供应单元。 从框架供应单元供应的晶片固定框架固定到吸收并固定从晶片对准单元（140）提供的晶片的安装台。 辊将胶带附着到晶片的表面。 磁带切割机切割胶带。 卸载单元卸载附带的胶带。

公开(公告)号：KR1020070012968A

公开(公告)日：2007-01-30

申请号：KR1020050067252

申请日：2005-07-25

Applicant: 삼성전자주식회사

Inventor： 우정환

IPC: H01L21/50

Abstract: An apparatus for transferring a semiconductor material is provided to prevent physical impact from being directly applied to the semiconductor material by transferring the semiconductor material while the semiconductor material is received in a transfer unit. A semiconductor material(10) is received in transfer units(120). The transfer units having the semiconductor material are mounted on a front rail(111) which transfers a plurality of process regions for performing a process on the semiconductor material by a unit of a process region. A rear rail(112) returns an empty transfer unit from which a processed semiconductor material is exhausted, disposed in parallel with the front rail and having a conveyor structure of a belt type. A right rail(114) transfers a transfer unit receiving the processed semiconductor material from the front rail to the rear rail. A semiconductor material is mounted on the empty transfer rail, and the semiconductor material which is mounted on the transfer unit is transferred from the rear rail to the front rail by a left rail(113).

Abstract translation: 提供一种用于传送半导体材料的装置，以通过在将半导体材料接收在转印单元中的同时转移半导体材料来防止物理冲击直接施加到半导体材料。 半导体材料（10）被接收在传送单元（120）中。 具有半导体材料的转印单元安装在前轨（111）上，该前轨（111）通过处理区域单位传送用于对半导体材料进行处理的多个处理区域。 后导轨（112）返回空出的转印单元，经处理的半导体材料从其排出，与前轨平行设置并具有带式输送机结构。 右轨道（114）将接收经处理的半导体材料的转移单元从前轨传送到后轨道。 半导体材料安装在空的传送轨道上，并且安装在传送单元上的半导体材料通过左轨道（113）从后轨道传递到前轨道。

公开(公告)号：KR100670589B1

公开(公告)日：2007-01-17

申请号：KR1020050088583

申请日：2005-09-23

Applicant: 삼성전자주식회사

Inventor： 이병준 ,  우정환 ,  김추호 ,  고윤성 ,  노승기 ,  김상윤 ,  신재봉 ,  변호재

IPC: H01L21/52

Abstract: A die attach apparatus is provided to perform a variety of package processes and to restrain the generation of failure in a package by using a pre-baker with a variable rail. A die attach apparatus is used for attaching a die(3) on a substrate. The die attach apparatus comprises a die supply unit for supplying dies, a die transfer(22) with a holding part for holding the die and at least one or more reverse transfer parts, a die attach unit(23) with an attach holding part and an attach driving part, and a pre-baker. The pre-baker is used for performing a heat treatment on the substrate. The pre-baker includes a variable rail capable of being varied according to the size of the substrate.

Abstract translation: 提供了一种管芯附接装置，用于执行各种包装处理并且通过使用具有可变导轨的预烘房来限制包装中的故障的产生。 使用管芯附着装置将模具（3）附着在基板上。 模具附着装置包括用于供给模具的模具供给单元，具有用于保持模具的保持部和至少一个以上的反向转印部的模具转印部（22），具有附着保持部的模具附接部（23） 连接驱动部分和预烘烤器。 预烘焙机用于在基材上进行热处理。 预烘烤器包括能够根据基底的尺寸而变化的可变轨道。

公开(公告)号：KR1020050005241A

公开(公告)日：2005-01-13

申请号：KR1020030044252

申请日：2003-07-01

Applicant: 삼성전자주식회사

Inventor： 김태현 ,  선용균 ,  김현호 ,  우정환

IPC: H01L21/50

CPC classification number: H01L24/85 ,  H01L21/677 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/92 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: PURPOSE: An apparatus for fabricating an inline integrated circuit chip package for packaging a dual-sided stack multi chip is provided to reduce the number of manual processes and shorten an interval of TFT(turn around time) by simplifying a double-sided stack multi chip packaging process. CONSTITUTION: A loader part(110) supplies a leadframe from a magazine receiving the leadframe having the first surface and the second surface opposite to the first surface wherein the first surface of the leadframe faces upward. The first package fabricating apparatus(120) performs a process for mounting the first semiconductor chip on the first surface of the leadframe supplied from the loader part. The second package fabricating apparatus(130) performs a process for mounting the second semiconductor chip on the second surface of the leadframe. A buffer(140) includes an inversion unit(150) for inverting the leadframe to make the second surface face upward before the leadframe unloaded from the first package fabricating apparatus is supplied to the second package fabricating apparatus, installed between the first and second package fabricating apparatuses. An unloader part(180) makes the magazine filled with the leadframe unloaded from the second package fabricating apparatus to unload the magazine.

Abstract translation: 目的：提供一种用于制造用于封装双面堆叠多芯片的在线集成电路芯片封装的装置，以通过简化双面堆叠多芯片来减少手动工艺的数量并缩短TFT的间隔（转向时间） 包装过程。 构成：装载器部件（110）从容纳具有第一表面的引线框的盒的第一表面和与第一表面相反的第二表面提供引线框架，其中引线框架的第一表面面向上。 第一封装制造装置（120）执行用于将第一半导体芯片安装在从装载器部件提供的引线框架的第一表面上的处理。 第二封装制造装置（130）执行用于将第二半导体芯片安装在引线框架的第二表面上的处理。 缓冲器（140）包括反转单元（150），用于在从第一封装制造装置卸载的引线框架被提供给安装在第一和第二封装制造之间的第二封装制造装置之前使引线框架反转以使第二表面面向上 设备。 卸载器部件（180）使得从第二包装制造装置卸载引线框的料盒被装载以卸载料盒。

公开(公告)号：KR1020160072414A

公开(公告)日：2016-06-23

申请号：KR1020140179984

申请日：2014-12-15

Applicant: 삼성전자주식회사

Inventor： 김태현 ,  김유찬 ,  우정환

IPC: H01L21/02

CPC classification number: H01L21/02 ,  H01L21/02002 ,  H01L21/02005

Abstract: 화학물질자동충전장치는화학물질저장용기에저장된화학물질을화학물질중앙공급시스템의화학물질공급탱크에충전하기위한작업공간을제공하고일측면에는내부로화학물질저장용기를반입하기위한도어가구비된챔버, 챔버하부에설치되며화학물질저장용기를지지하는지지대, 챔버의상부에설치되며상부벽을관통해설치된흡입배관및 흡입배관과화학물질저장용기의배출구를연결시키기위한커플러및 커플러를배출구로이동시키기위한제1 암을구비하는연결부, 및흡입배관을통해화학물질저장용기로부터화학물질을흡입하여화학물질공급탱크를충전하기위한펌프를포함한다.

Abstract translation: 自动化学注射装置包括：一个室，用于提供一个工作空间，用于将存储在化学品储存容器中的化学品注入中央化学品供应系统的化学品供应罐，该化学品供应系统具有将化学品储存容器吸入内部的门 在侧面 安装在室底部以支撑化学品储存容器的支撑件; 连接单元，其安装在所述室的顶部，并且包括通过穿过所述顶壁安装的吸入管，连接所述吸入管和所述化学存储容器的排出孔的联接器，以及将所述联接器移动到所述第一臂 排放孔; 以及通过吸管从化学品储存容器吸取化学物质并将化学品注入化学品供应罐的泵。 本发明提供了一种将化学品自动注入中央化学品供应系统的装置，并提供一种通过使用该化学品自动将化学品注入中央化学品供应系统的方法。

公开(公告)号：KR1020060101686A

公开(公告)日：2006-09-26

申请号：KR1020050023229

申请日：2005-03-21

Applicant: 삼성전자주식회사

Inventor： 박병국 ,  고윤성 ,  우정환

IPC: H01L21/68

Abstract: 본 발명은 칩 접착 설비의 기판 공급 장치에 관한 것으로, 인쇄회로기판(PCB)이나 리드프레임(lead frame)과 같은 기판을 인덱스 레일(index rail)로 공급하는 기판 공급 장치의 설치공간을 최소화하기 위해서, 인쇄회로기판을 공급하는 매거진(magazine) 유닛에 리드프레임을 공급하는 스태커(stacker) 유닛이 결합된 칩 접착 설비의 기판 공급 장치를 제공한다.
컨베이어, 리프트, 승강기, 폭 가변 레일, 픽 앤 플레이스, 푸셔

公开(公告)号：KR1020050020205A

公开(公告)日：2005-03-04

申请号：KR1020030057955

申请日：2003-08-21

Applicant: 삼성전자주식회사

Inventor： 우정환 ,  선용균 ,  김현호 ,  양희상 ,  김태현 ,  고윤성

IPC: H01L21/68

Abstract: PURPOSE: A tape mounting apparatus is provided to move smoothly a tape in a tape mounting process by using an enhanced tape feed roller. CONSTITUTION: A tape mounting apparatus includes a wafer table for loading a wafer, a tape feed roller for feeding a tape to the wafer, a tape cutter, a ring frame for guiding the tape and a tension retaining roller. The tape feed roller(20) includes a first region(21), a second region(22) and a third region(23) between the first and second regions. A first adhesive force between the first and second regions and the tape is different from a second adhesive force between the third region and the tape.

Abstract translation: 目的：提供一种胶带安装装置，通过使用增强的胶带进给辊在胶带安装过程中平稳地移动胶带。 构成：带式安装装置包括用于装载晶片的晶片台，用于将晶片馈送到晶片的带馈送辊，带切割器，用于引导带的环形框架和张力保持辊。 送带辊（20）包括在第一和第二区域之间的第一区域（21），第二区域（22）和第三区域（23）。 第一和第二区域和带之间的第一粘合力不同于第三区域和带之间的第二粘合力。

公开(公告)号：KR1020040023888A

公开(公告)日：2004-03-20

申请号：KR1020020055332

申请日：2002-09-12

Applicant: 삼성전자주식회사

Inventor： 우정환 ,  안승철

IPC: H01L21/304

Abstract: PURPOSE: An apparatus for polishing the back surface of a wafer is provided to omit the process of attaching and removing tape and save a time interval for the attaching and removing process by making the active surface of the wafer come in contact with a chuck table by a non-contact method. CONSTITUTION: A grinder(21) polishes the back surface of the wafer(20). A groove having a predetermined depth from the upper surface of a cylindrical body of a chuck case is formed to make the body have an edge. Holes are formed on the bottom surface formed by the groove, connecting the outside with a space formed by the groove inside the body. Vacuum holes(24) to which vacuum is applied are formed in the upper end of the edge, penetrating through the bottom surface of the groove of a predetermined depth and the bottom surface of the body. A porous member(22) is formed in the groove formed at the upper end of the edge, having a height not lower than the upper surface of the body. The respective holes(26,27) are connected to an air supply regulator or an air exhaust regulator so that the air pressure of the space formed by the groove of the chuck case can be the pressure at which the grinder presses the wafer.

Abstract translation: 目的：提供一种用于抛光晶片背面的设备，以省去附着和移除胶带的过程，并通过使晶片的有效表面与卡盘台相接触来保存附着和去除过程的时间间隔 非接触式方法。 构成：研磨机（21）抛光晶片（20）的背面。 形成具有从卡盘壳体的圆筒体的上表面的预定深度的凹槽，以使主体具有边缘。 孔形成在由凹槽形成的底表面上，将外部与由主体内的凹槽形成的空间连接。 在边缘的上端形成有真空的真空孔（24），穿过预定深度的槽的底面和主体的底面。 在形成在边缘的上端的槽中形成多孔构件（22），其高度不低于主体的上表面。 相应的孔（26,27）连接到空气供应调节器或排气调节器，使得由卡盘壳体的凹槽形成的空间的空气压力可以是研磨机压在晶片上的压力。

公开(公告)号：KR1020110037646A

公开(公告)日：2011-04-13

申请号：KR1020090095174

申请日：2009-10-07

Applicant: 삼성전자주식회사

Inventor： 박병국 ,  고석 ,  조경복 ,  이동수 ,  우정환

IPC: H01L21/58

CPC classification number: H01L24/83 ,  H01L24/75 ,  H01L2224/83 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  Y10T156/1707 ,  Y10T156/1744

Abstract: PURPOSE: A die bonding apparatus of a semiconductor is provided to increase the productivity by including two bonding heads for die-bonding semiconductor chips in one substrate alternately to reduce a cycle time. CONSTITUTION: In a die bonding apparatus of a semiconductor, a first bonding head(11) transfers a first semiconductor chip(1) along a transfer path to a bonding point on a substrate. A first transfer unit(13) moves the first bonding head and a second bonding head(12) transfers a second semiconductor chip to the bonding point along the transfer path. A second transfer unit(14) moves a second bonding head. A controller(15) applies a transfer signal and a return signal to the first and second transfer unit.

Abstract translation: 目的：提供一种半导体的管芯接合装置，通过包括两个用于将一个衬底中的半导体芯片芯片接合的结合头来交替地降低循环时间来提高生产率。 构成：在半导体的管芯接合装置中，第一接合头（11）将第一半导体芯片（1）沿着传输路径传送到基板上的接合点。 第一传送单元（13）移动第一接合头，第二接合头（12）沿着传送路径将第二半导体芯片传送到接合点。 第二转印单元（14）移动第二粘合头。 控制器（15）将传送信号和返回信号应用于第一和第二传送单元。