-
Patent Agency Ranking
公开(公告)号：KR1020060128394A
公开(公告)日：2006-12-14
申请号：KR1020050049818
申请日：2005-06-10
Applicant: 삼성전자주식회사
IPC: H01L23/48
CPC classification number: H01L23/4952 , H01L21/565 , H01L23/28 , H01L24/11 , H01L24/12 , H01L24/43
Abstract: A lead grid array package using a lead frame and its manufacturing method are provided to prevent cracks at an outer connection terminal of a semiconductor by using a plurality of leads as the outer connection terminals. A lead frame(70) comprises plural leads(72) having a base lead(74), a connecting lead(73), and a projecting lead(75). The base lead is coated with an insulating material(76). The connecting lead is horizontally extended from an end of the base lead to be extended to the outside of an end of the insulating material. The projecting lead is vertically extended from the other end of the base lead to be projected to the outside of the insulating material. An integrated chip(60) having plural electrode pads(62) is attached to the insulating material coating the base lead. The electrode pad of the integrated circuit chip and the connecting lead are electrically connected by a bonding wire(80). The electrode pad, the connecting lead, and the bonding wire are encapsulated by a molding resin to form a resin encapsulation unit(90).
Abstract translation: 提供使用引线框架的引线栅阵列封装及其制造方法，以通过使用多个引线作为外部连接端子来防止半导体的外部连接端子处的裂纹。 引线框架（70）包括具有基部引线（74），连接引线（73）和突出引线（75）的多个引线（72）。 基部引线涂有绝缘材料（76）。 连接引线从基部引线的端部水平延伸，延伸到绝缘材料端部的外侧。 突出的引线从基部引线的另一端垂直延伸以被突出到绝缘材料的外部。 具有多个电极焊盘（62）的集成芯片（60）附着在涂覆基极的绝缘材料上。 集成电路芯片的电极焊盘和连接引线通过接合线（80）电连接。 电极焊盘，连接引线和接合线被模塑树脂包封以形成树脂封装单元（90）。
-
公开(公告)号：KR1020100089254A
公开(公告)日：2010-08-12
申请号：KR1020090008428
申请日：2009-02-03
Applicant: 삼성전자주식회사
CPC classification number: H05K1/181 , H05K2201/09227 , H05K2201/09254 , H05K2201/10159 , Y02P70/611 , H05K1/02 , H05K1/18
Abstract: PURPOSE: An electric element module is provided to be cost-effectively manufactured by reducing the number of layers required to supply signals to the electric element module. CONSTITUTION: A first contact-pad region(110) and a second contact-pad region(120) are arranged on both sides of a module board. The arrangement of both contact-pad regions has a mirror shape. The first contact-pad region and the second contact-pad region include a plurality of contact-pads(P11' to P16'). A first via region includes a plurality of vias(V1 to V6) which is formed between the first contact-pad region and the second contact-pad region.
Abstract translation: 目的：提供一种电元件模块，通过减少向电气元件模块提供信号所需的层数来经济高效地制造。 构成：在模块板的两侧布置有第一接触焊盘区域（110）和第二接触焊盘区域（120）。 两个接触垫区域的布置具有镜子形状。 第一接触焊盘区域和第二接触焊盘区域包括多个接触焊盘（P11'至P16'）。 第一通孔区域包括形成在第一接触焊盘区域和第二接触焊盘区域之间的多个通孔（V1至V6）。
-
公开(公告)号：KR1020090070226A
公开(公告)日：2009-07-01
申请号：KR1020070138154
申请日：2007-12-27
Applicant: 삼성전자주식회사
IPC: G11C7/10
CPC classification number: G11C7/10 , G11C5/06 , G11C11/401
Abstract: A layout structure of receivers and transmission lines is provided to reduce a difference of loading capacitance and a difference of a signal delay between receiver groups. A first receiver group and a second receiver group include a plurality of receivers. A plurality of receivers is connected through a first fixing transmission line to an eighth fixing transmission line(T1~T8). The second receiver group additionally includes a first variable transmission line to an eighth variable transmission line(T11~T88). The variable transmission lines are parallel arranged in the fixing transmission lines. The variable transmission lines have the same or different impedance as the fixing transmission lines. The variable transmission lines are arranged on the same or different wiring layer as the fixing transmission lines.
Abstract translation: 提供接收机和传输线的布局结构，以减少负载电容的差异和接收器组之间的信号延迟差。 第一接收机组和第二接收机组包括多个接收机。 多个接收器通过第一固定传输线连接到第八固定传输线（T1〜T8）。 第二接收机组另外包括到第八可变传输线（T11〜T88）的第一可变传输线。 可变传输线平行布置在固定传输线中。 可变传输线具有与固定传输线相同或不同的阻抗。 可变传输线布置在与固定传输线相同或不同的布线层上。
-
公开(公告)号：KR101639618B1
公开(公告)日：2016-07-15
申请号：KR1020090008428
申请日：2009-02-03
Applicant: 삼성전자주식회사
CPC classification number: H05K1/181 , H05K2201/09227 , H05K2201/09254 , H05K2201/10159 , Y02P70/611
Abstract: 전자소자모듈이개시된다. 전자소자모듈은두 개의레이어들을이용하여모듈기판의양면에실장된제1 전자소자쌍을연결하고, 두개의레이어들을이용하여제1 전자소자쌍과그에인접한제2 전자소자쌍을연결할수 있다. 여기서두 개의레이어들각각은전자소자쌍들에신호를인가하기위한레이어일수 있다.
-
-
-
-
Search Results
5
records
(took 0.015 seconds)
