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公开(公告)号：KR102230653B1
公开(公告)日：2021-03-23
申请号：KR1020130169391A
申请日：2013-12-31
Applicant: 삼성전자주식회사 , 서울대학교산학협력단
IPC: H01L29/786 , H01L21/336 , H01L29/36
CPC classification number: H01L29/78696 , H01L29/36
Abstract: 박막 트랜지스터 및 그 제조 방법이 개시된다. 개시된 박막 트랜지스터는 채널층이 게이트 전극과 상대적으로 가까운 제 1영역과 상대적으로 거리가 먼 제 2영역을 포함할 수 있으며, 채널층을 구성하는 물질 중 적어도 하나는 제 1영역보다 제 2영역에서의 농도가 더 클 수 있다. 채널층은 아연(Zn) 및 불소(F)를 포함할 수 있으며, 제 2영역에서의 불소의 농도가 제 1영역에서의 불소의 농도보다 클 수 있다.
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公开(公告)号：WO2021201587A1
公开(公告)日：2021-10-07
申请号：PCT/KR2021/003979
申请日：2021-03-31
Applicant: 삼성전자주식회사
Abstract: 조리기기가 개시된다. 개시된 조리기기는 전장실을 형성하는 본체, 상기 본체에 마련되는 가열장치, 및 상기 가열장치를 제어하도록 구성되는 컨트롤 패널을 포함하며, 상기 컨트롤 패널은 글라스 패널, 상기 글라스 패널의 일 측에 배치되는 홀더 브라켓 및 상기 글라스 패널의 상기 일 측과 반대되는 타 측에서 상기 홀더 브라켓에 결합되는 홀더 케이스를 포함하는 노브 홀더, 및 일 부분이 상기 노브 홀더에 수용 가능하도록 마련되는 노브를 포함한다.
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Patent Agency Ranking
公开(公告)号：KR1020150079274A
公开(公告)日：2015-07-08
申请号：KR1020130169391
申请日：2013-12-31
Applicant: 삼성전자주식회사 , 서울대학교산학협력단
IPC: H01L29/786 , H01L29/36 , H01L21/336
CPC classification number: H01L29/78696 , H01L29/36
Abstract: 박막트랜지스터및 그제조방법이개시된다. 개시된박막트랜지스터는채널층이게이트전극과상대적으로가까운제 1영역과상대적으로거리가먼 제 2영역을포함할수 있으며, 채널층을구성하는물질중 적어도하나는제 1영역보다제 2영역에서의농도가더 클수 있다. 채널층은아연(Zn) 및불소(F)를포함할수 있으며, 제 2영역에서의불소의농도가제 1영역에서의불소의농도보다클 수있다.
Abstract translation: 公开了一种薄膜晶体管及其制造方法。 所公开的薄膜晶体管包括其中沟道区域相对靠近栅电极的第一区域和沟道层相对于栅电极相对较远的第二区域。 形成沟道层的至少一种材料能够在第二区域中具有比在第一区域中更大的浓度。 通道层能够含有锌（Zn）和氟（F）。 第二区域的氟浓度能够比第一区域的氟浓度大。
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公开(公告)号：KR1020140087526A
公开(公告)日：2014-07-09
申请号：KR1020120157921
申请日：2012-12-31
Applicant: 삼성전자주식회사
IPC: H02J17/00
Abstract: Disclosed is a method of controlling a wireless power transmitter which transmits charging power to a wireless power receiver. The method of controlling a wireless power transmitter comprises the steps of sensing an object on the wireless power transmitter, applying dissimilar detection power having different electric energy for detecting the wireless power receiver; transmitting driving power for driving the wireless power receiver to the wireless power receiver, and receiving a signal for connection of communications from the wireless power receiver; determining whether to make the wireless power receiver subscribe to a wireless power network; transmitting a response signal for connection of communications to the wireless power receiver; and transmitting charging power to the wireless power receiver.
Abstract translation: 公开了一种控制向无线电力接收机发送充电电力的无线电力发射机的方法。 控制无线电力发射机的方法包括以下步骤：感测无线电力发射机上的对象，应用具有不同电能的不同检测功率来检测无线电力接收机; 向无线电力接收机发送用于驱动无线电力接收机的驱动力，以及从无线电力接收机接收用于连接通信的信号; 确定是否使无线电力接收机订阅无线电力网络; 发送用于将通信连接到所述无线电力接收器的响应信号; 以及向无线电力接收器发送充电电力。
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公开(公告)号：KR1020130123082A
公开(公告)日：2013-11-12
申请号：KR1020120046226
申请日：2012-05-02
Applicant: 삼성전자주식회사
CPC classification number: H02J50/12 , H02J7/0013 , H02J7/025 , H04B5/0093 , H04B5/02 , H04B2203/5425
Abstract: Disclosed is a wireless power transmitter which transmits wireless power to at least one wireless power receiver. The wireless power transmitter by the present invention comprises a power supply unit which supplies wireless power having a predetermined voltage or current value in a DC shape; a power conversion unit which converts the wireless power input from the power supply unit into an AC shape for resonance; and a resonance unit which transmits the converted power to at least one wireless power receiver by using resonance and transmits the wireless power with substantially same efficiency regardless placement, direction, and number of the wireless power receiver by being loosely coupled with the wireless power receiver.
Abstract translation: 公开了一种将无线电力发射到至少一个无线电力接收器的无线电力发射机。 本发明的无线电力变送器包括：电源单元，其以DC形状提供具有预定电压或电流值的无线电力; 电力转换单元，其将从所述电源单元输入的无线电力转换为用于谐振的AC形状; 以及谐振单元，其通过使用谐振将转换的功率发送到至少一个无线电力接收器，并且通过松散地与无线电力接收器耦合来无线放置，方向和数量而以基本上相同的效率发送无线电力。
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公开(公告)号：KR1020110105152A
公开(公告)日：2011-09-26
申请号：KR1020100024254
申请日：2010-03-18
Applicant: 삼성전자주식회사
IPC: G06F1/16 , G06K19/077
CPC classification number: H05K3/323 , H05K1/189 , H05K2201/10159 , G06F1/1683 , G06K19/0772
Abstract: A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.
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公开(公告)号：KR100849349B1
公开(公告)日：2008-07-29
申请号：KR1020070008328
申请日：2007-01-26
Applicant: 삼성전자주식회사
IPC: H01L23/12
CPC classification number: H01L25/0657 , H01L2224/48227 , H01L2924/15153 , H01L2924/15311 , H01L2924/3025 , H01L2924/00
Abstract: A semiconductor package is provided to minimize the degradation of reliability due to integrated circuits during forming a printed circuit board by integrating the integrated circuits in the state that the printed circuit board is manufactured. A groove is formed on an upper surface of a printed circuit board(110). The printed circuit board includes a dielectric(112) and a conductive pattern layer(111), which are stacked in turn. A first integrated circuit(120) is located in the groove. A first molding unit(122) is applied to cover the first integrated circuit. A second integrated circuit(130) is received on an upper portion of the printed circuit board. A second molding unit(132) is formed on the printed circuit board so that it covers the second integrated circuit to shield electromagnetic wave. A first line(121) connects the first integrated circuit to the conductive pattern layer. The second line(131) connects the second integrated circuit to the conductive pattern layer.
Abstract translation: 提供一种半导体封装件，以便在印刷电路板制造的状态下集成集成电路来最小化在形成印刷电路板期间由集成电路导致的可靠性的劣化。 凹槽形成在印刷电路板（110）的上表面上。 印刷电路板包括依次层叠的电介质（112）和导电图案层（111）。 第一集成电路（120）位于凹槽中。 第一模制单元（122）被施加以覆盖第一集成电路。 第二集成电路（130）被容纳在印刷电路板的上部。 第二成型单元（132）形成在印刷电路板上，以覆盖第二集成电路以屏蔽电磁波。 第一线（121）将第一集成电路连接到导电图案层。 第二线（131）将第二集成电路连接到导电图案层。
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