Abstract:
PURPOSE: An electric device using a two-dimensional sheet material, and a manufacturing method thereof are provided to produce a gate electrode, an insulation layer, and an active channel with the two-dimensional sheet material. CONSTITUTION: An electric device using a two-dimensional sheet material comprises successively laminated first, second, and third elements formed with the two-dimensional sheet material. The second element has the insulating property, and includes either a graphene oxide or a hexagonal boron nitride. The first and third elements include the metallic property and the semiconductor property, respectively.
Abstract:
PURPOSE: A stack structure comprising epitaxial graphene, method of forming the stack structure and electronic device comprising the stack structure are provided to obtain the dual gate structure having the top gate and bottom gate. CONSTITUTION: The underlying layer is formed on the Si substrate(SUB1). At least one epitaxial graphene(GP1) is included on the underlying layer. The underlying layer is an h- BN(hexagonal boron nitride)(0001) layer. The Ni(111) layer is formed between the Si substrate and underlying layer. The Cu(111) layer is formed between the Si substrate and Ni(111) layer. The Si substrate is the Si(111) substrate or the Si(110) substrate.
Abstract:
A schottky diode and memory device comprising the same is provided to realize a schottky diode with a PN diode or MOSFET by using contact of Nb oxide layer and metal layer. A schottky diode includes a first metal layer(10) and a Nb oxide layer(20). A Nb oxide layer is formed on the first metal layer, and the second metal layer(30) is formed on the Nb oxide layer. A memory device comprises a storage node and the switching element connected to the storage node. The storage node includes a data storage layer which is composed of resistance change layer, phase change layer, ferroelectric layer or magnetic layer.
Abstract:
The infrared emitting diode of the nano size using graphene of two-dimensional layer material are provided to improve the luminous efficiency by making same the transition speed of hole and electrons. The infrared emitting diode comprises the light-emitting layer, and the gate electrode and the isolation layer. The light-emitting layer(120) comprises the light emission region(123), the source region(121) and drain region(122). The gate electrode(114) is formed in the light emission region. The insulating layer(112) isolates the gate electrode from the light-emitting layer. The light-emitting layer is formed with at least one among the group consisting of the graphene, boron nitride, cadmiumtellurium, molybdenum disulfide, niobium die selenide into selected a one.
Abstract:
A charge detector using graphene is provided to operate in the room temperature by using material stabilized in the room temperature including grapheme. A charge detector(100) using graphene comprises a tip(122), and a charge detecting device(110). The tip detects electric charge. The charge detecting device is formed on the tip. The charge detecting device comprises barriers(112, 113), an area-source(114) and drain region(115). The barrier is formed in both side of the electric charge detection area. Area-source and drain region are formed in the side of the barrier. The charge detecting device is integrately formed.
Abstract:
A cross-point latch and method of operating the same is provided to shorten latch time and be manufacture easily while having excellent reliability of the latch. A cross-point latch includes a signal line(1), a control line(2, 3) crossing the signal line and unipolar switch(4, 5) at the crossing of the signal line and the control line. A bipolar unipolar switch comprises the resistance changing material. The resistance changing material is one of the niO, feO, coO, nbO2, zrO2, hfO2, znO, tbO, YO and WO3. The bipolar unipolar switch is at the crossing of the first and the second control line. Different voltages are supplied to the first and the second control line with supplying the input voltage to the signal line. One of the unipolar switches is closed and the other is opened.
Abstract:
A system for implanting plasma ions is provided to generate only the ions and polymer radicals necessary for an ion implantation process and easily control implanted plasma ions by generating plasma having an characteristic advantageous for an ion implantation process as compared with an ICP(inductively coupled plasma) process. A process target(501) is positioned in a vacuum chamber(500) having a reaction space in which plasma is generated. A first gas supply apparatus supplies reaction gas to the vacuum chamber. A second gas supply apparatus supplies cleaning gas to the vacuum chamber. Upper and lower electrodes(502,553) are installed in the vacuum chamber, confronting each other. A conductive ring(551) is installed in the periphery of the process target. An RF supply apparatus supplies RF power to the upper electrode to generate plasma. A high voltage supply apparatus supplies a high voltage to the process target, the lower electrode and the conductive ring. The first and second gas supply apparatuses can be installed in the sidewall(504) of the vacuum chamber, confronting each other.
Abstract:
A semiconductor package is provided to minimize the degradation of reliability due to integrated circuits during forming a printed circuit board by integrating the integrated circuits in the state that the printed circuit board is manufactured. A groove is formed on an upper surface of a printed circuit board(110). The printed circuit board includes a dielectric(112) and a conductive pattern layer(111), which are stacked in turn. A first integrated circuit(120) is located in the groove. A first molding unit(122) is applied to cover the first integrated circuit. A second integrated circuit(130) is received on an upper portion of the printed circuit board. A second molding unit(132) is formed on the printed circuit board so that it covers the second integrated circuit to shield electromagnetic wave. A first line(121) connects the first integrated circuit to the conductive pattern layer. The second line(131) connects the second integrated circuit to the conductive pattern layer.