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公开(公告)号：KR1020130010667A
公开(公告)日：2013-01-29
申请号：KR1020110071441
申请日：2011-07-19
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/48091 , H01L2224/8592 , H01L33/56 , H01L33/502 , H01L33/58 , H01L33/62 , H01L2924/00014
Abstract: PURPOSE: A light emitting diode package is provided to prevent a disconnection of a bonding wire or the crack and separation of a lens unit. CONSTITUTION: A light emitting diode chip(110) is electrically connected to a first lead frame(120a) and a second lead frame(120b). A lens unit(140) is made of transparent resins to cover the light emitting diode chip. The lens unit includes a flat plate(140a) and a convex part(140b). The flat plate and the convex part change the distribution of light emitted from the light emitting diode chip. A concave groove part(140c) is formed on the upper side of the convex part of the lens unit. A wavelength converting unit(130) converts light emitted from the light emitting diode chip to a specific wavelength.
Abstract translation: 目的：提供发光二极管封装，以防止接合线断裂或裂纹和透镜单元的分离。 构成：发光二极管芯片（110）电连接到第一引线框架（120a）和第二引线框架（120b）。 透镜单元（140）由透明树脂制成以覆盖发光二极管芯片。 透镜单元包括平板（140a）和凸部（140b）。 平板和凸部改变从发光二极管芯片发出的光的分布。 在透镜单元的凸部的上侧形成凹槽部（140c）。 波长转换单元（130）将从发光二极管芯片发射的光转换成特定波长。
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公开(公告)号：KR1020120068642A
公开(公告)日：2012-06-27
申请号：KR1020100130345
申请日：2010-12-17
Applicant: 삼성전자주식회사
Inventor： 한태헌
IPC: H05K7/20 , H05K1/02 , F21Y101/02
Abstract: PURPOSE: A printed circuit board and a light emitting device including the same are provided to effectively releases heat of a light emitting unit installed on an insulating film by directly exposing a metal heat dissipation film formed between insulating foils to the outside. CONSTITUTION: A printed circuit board comprises a plurality of insulating plates(10) and a core unit(20). An adhesive film(30) is formed in the insulating plate and the core unit. The insulating plate is made of an organic resin material and other resin materials which include polyimide, silicon, triazine, and epoxy which have insulating properties. The insulating plate is comprised of a lower insulating plate(12) connected to the substrate and an upper insulating plate(11) in which a light emitting device(40) is mounted. The core unit provides a heat sink function for releasing heat from the light emitting device between the insulating plates to the outside.
Abstract translation: 目的：提供一种印刷电路板和包括该印刷电路板的发光装置，通过将形成在绝缘箔之间的金属散热膜直接暴露于外部来有效地释放安装在绝缘膜上的发光单元的热量。 构成：印刷电路板包括多个绝缘板（10）和芯单元（20）。 在绝缘板和芯单元中形成粘合膜（30）。 绝缘板由有机树脂材料和其它具有绝缘性能的聚酰亚胺，硅，三嗪和环氧树脂等树脂材料制成。 绝缘板由连接到基板的下绝缘板（12）和安装有发光装置（40）的上绝缘板（11）组成。 核心单元提供散热功能，用于将绝热板之间的发光器件的热释放到外部。
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公开(公告)号：KR1020120085039A
公开(公告)日：2012-07-31
申请号：KR1020110006424
申请日：2011-01-21
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: PURPOSE: A manufacturing method of a light emitting diode package is provided to change a directional angle of emitted light since only a thickness of a flat portion is controlled without changing the shape of the flat portion by forming a convex portion on the flat portion. CONSTITUTION: A light emitting diode chip(10) is connected to a first lead frame(20a) and a second lead frame(20b). The first and second lead frames are electrically insulated for electrical connection. A lens(20) is formed in order to receive the light emitting diode chip. The lens includes a plate portion(30a) having a fixed thickness and a convex portion(30b) integrally formed on the plate portion. A concave groove portion(30c) is formed on the upper end of the convex portion of the lens.
Abstract translation: 目的：提供一种发光二极管封装的制造方法，以便通过在平坦部分上形成凸部来仅改变平坦部分的形状，从而仅控制平坦部分的厚度，从而改变发射光的方向角度。 构成：发光二极管芯片（10）连接到第一引线框架（20a）和第二引线框架（20b）。 第一和第二引线框架是电绝缘的，用于电连接。 形成透镜（20）以接收发光二极管芯片。 透镜包括具有固定厚度的板部分（30a）和一体形成在板部分上的凸部（30b）。 在透镜的凸部的上端形成凹槽部（30c）。
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