Abstract:
PURPOSE: A semiconductor device and a manufacturing method thereof are provided to improve applicability of a high speed operation element by forming an inter layer dielectric and a gate insulating layer by using different material. CONSTITUTION: A gate electrode(12) is formed on a substrate(10). The gate electrode comprises a projected gate finger. A gate insulating layer(13) is formed on the gate electrode. An inter-layer insulating film(11) is formed on the side of the gate insulating layer and the gate electrode. The inter-layer insulating film comprises a material having dielectric permittivity lower than the gate insulating layer. A graphene layer(14) is formed on the gate insulating layer and the inter-layer insulating film. A source(15a) and a drain(15b) are formed on the graphene layer. Graphene is formed in the lower side of the graphene layer between the source and drain.
Abstract:
Disclosed is a graphene switching device having a tunable barrier. The disclosed graphene switching device includes a first electrode and an insulating layer which are respectively arranged in a first region and a second region which are separated from each other on a conductive semiconductor substrate, a graphene layer which is extended from the insulating layer to the first electrode on the substrate and is separated from the first electrode, a second electrode which faces the insulating layer on the graphene layer, a gate electrode above the graphene layer, and a first well which has a region of the substrate which touches the lower part of the graphene layer which is doped with impurity. The first wall has an energy barrier which is between the graphene layer and the first electrode.
Abstract:
The present invention relates to a high-performance field effect transistor including a graphene channel layer. According to one embodiment of the present invention, the field effect transistor includes: a substrate; a grapheme channel layer which is placed on the substrate and includes a slit; a source electrode and a drain electrode which apply a voltage to the graphene channel layer and are placed at an interval; a gate electrode which forms an electric field in the graphene channel layer; and a gate insulation layer which is placed between the graphene channel layer and the gate electrode.
Abstract:
PURPOSE: A graphene electric component equipped with a plurality of graphene channel layers is provided to increase current transition speed between a drain electrode and a source electrode by forming the plurality of graphene channel layers into a double layer structure. CONSTITUTION: A gate electrode(120) is formed on a substrate(110). A first gate insulating layer(131) covering the gate electrode is formed on the substrate. A first graphene channel layer(141) is formed on the first gate insulating layer. A second gate insulating layer(132) is formed on the first graphene channel layer. A second graphene channel layer(142) is formed on the second gate insulating layer. A source electrode(150) and a drain electrode(160) are formed on the first graphene channel layer and the second graphene channel layer.
Abstract:
PURPOSE: A 3D vertical type memory cell string with shield electrode surrounded by a isolation insulating layer stack, a memory array using the same and a manufacturing method thereof are provided to solve the threshold voltage dissemination problem of stacks by injecting charges into the charge storage node in the isolation insulating layer stack as well as completely eliminate electrical interference which occurs in semiconductor bodies in both sides of each trench. CONSTITUTION: Two or more electrode stacks are separated by one or more trenches at a certain distance on a semiconductor substrate(1) and are formed by repeatedly laminating an insulating layer and a conductive material layer(10) to the vertical direction by turns. A gate insulating layer stack includes a charge storage layer which is formed on the top and the side of each electrode stack and the separated space of the substrate. A semiconductor body(5) is formed on the gate insulating layer stack. A shield electrode(27) is formed by placing the isolation insulating layer for each trench on the semiconductor body. The isolation insulating layer includes the charge storage node.
Abstract:
PURPOSE: A memory cell string stack and a memory array using the same are provided to cut off charge transfer between a top cell unit and a bottom cell unit by not connecting charge storage nodes between cell units which are formed in the top part and the bottom part. CONSTITUTION: A semiconductor stack(40) is formed by alternatively laminating an insulating layer(2) and a semiconductor layer(3) on a semiconductor substrate(1). A gate insulating layer stack(7) includes a plurality of charge storage layers(5). An isolation insulating layer(9) is filled between the control electrodes and between the gate insulating layer stacks. A storing layer for each charge of the gate insulating layer stack is formed in a recess.