公开(公告)号：KR101181224B1

公开(公告)日：2012-09-10

申请号：KR1020110028187

申请日：2011-03-29

Applicant: 성균관대학교산학협력단

Inventor： 서수정 ,  송종석 ,  박화선

IPC: H01L33/48 ,  H01L33/64

CPC classification number: H01L33/486 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

Abstract: PURPOSE: An LED package and a manufacturing method thereof are provided to reduce a problem due to the generation of heat of an LED by minimizing the use of a wire and an adhesive while enhancing heat radiation efficiency. CONSTITUTION: A metallic board(10) in which an insulating plate(20) is combined is formed. A penetration hole(22) is formed on the insulating plate. An electrode(50) is formed by filling the penetration hole with metal. A cavity(12) is formed by eliminating a part of the metallic board. An LED chip(30) is formed within the cavity. The electrode is connected to the LED chip. The cavity is filled with sealing material by plating. Fluorescent material is dispersed to the sealing material.

Abstract translation: 目的：提供LED封装及其制造方法，以通过最小化使用导线和粘合剂同时提高散热效率来减少由于LED的发热而产生的问题。 构成：形成有绝缘板（20）组合的金属板（10）。 在绝缘板上形成贯通孔（22）。 电极（50）通过用金属填充贯通孔而形成。 通过去除金属板的一部分来形成空腔（12）。 在空腔内形成LED芯片（30）。 电极连接到LED芯片。 通过电镀填充密封材料。 将荧光材料分散到密封材料中。