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公开(公告)号：KR101281949B1
公开(公告)日：2013-07-03
申请号：KR1020110078897
申请日：2011-08-09
Applicant: 성균관대학교산학협력단
Abstract: 본 발명은 ENEPIG 표면 처리에 있어서 팔라듐 함유량에 따른 신뢰성의 변화에 관한 것으로서, 더욱 구체적으로는 ENEPIG 표면 처리시 최적의 팔라듐 함유량에 관한 것이다. 본 발명에 따르면, 상기 팔라듐의 함유량이 솔더 볼의 중량 대비 0.04wt% 이하인 경우에 최고의 신뢰성을 나타내었다.
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公开(公告)号：KR1020130016784A
公开(公告)日：2013-02-19
申请号：KR1020110078897
申请日：2011-08-09
Applicant: 성균관대학교산학협력단
Abstract: PURPOSE: An optimum palladium content in ENEPIG(electroless nickel / electroless palladium / immersion gold) surface treatment for enhancing mechanical properties is provided to obtain the maximum reliability of the surface treatment by maintaining palladium content to be 0.04 wt% or less. CONSTITUTION: An ENEPIG surface treatment comprises a step of plating electroless nickel on a printed circuit board; a step of plating palladium on the electroless nickel plating; and a step of plating gold on the palladium plating. The content of palladium is 0.04 wt% or less. An ENEPIG surface treatment comprises a step of plating electroless nickel on a printed circuit board; a step of plating electroless palladium on the electroless nickel plating; and a step of plating gold on the electroless palladium plating. Solder ball may be welded on the gold plating. After welding the solder ball put on component side through reflow, the substrate put on the substrate of the board side is weld again through reflow. [Reference numerals] (AA,DD,II) Solder ball; (BB) Plating process layer; (CC) Printed circuit board(PCB); (EE) Gold planting; (FF) Pd planting(0.02,0.04,0.06 wt%); (GG) Nickel planting; (HH) Copper circuit surface(PCB); (JJ) Cross-sectional diagram of binding the solder ball after planting nickel, palladium and gold on the PCB copper circuit surface
Abstract translation: 目的：提供用于增强机械性能的ENEPIG（无电镍/无电镀钯/浸金）表面处理中的最佳钯含量，以通过将钯含量保持在0.04重量％以下来获得表面处理的最大可靠性。 构成：ENEPIG表面处理包括在印刷电路板上电镀无电镀镍的步骤; 在化学镀镍上镀钯的步骤; 以及在镀钯上镀金的步骤。 钯的含量为0.04重量％以下。 ENEPIG表面处理包括在印刷电路板上电镀无电镀镍的步骤; 在化学镀镍上电镀无电镀钯的步骤; 以及在无电镀钯电镀上镀金的步骤。 焊球可以焊接在镀金上。 在通过回流焊焊接在组件侧的焊球之后，通过回流再次焊接放置在基板侧的基板上的基板。 （附图标记）（AA，DD，II）焊球; （BB）电镀工艺层; （CC）印刷电路板（PCB）; （EE）金种植; （FF）Pd种植（0.02,0.04,0.06重量％）; （GG）镍种植; （HH）铜电路表面（PCB）; （JJ）在PCB铜电路表面上种植镍，钯和金之后结合焊球的横截面图
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