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公开(公告)号：KR101281949B1
公开(公告)日：2013-07-03
申请号：KR1020110078897
申请日：2011-08-09
Applicant: 성균관대학교산학협력단
Abstract: 본 발명은 ENEPIG 표면 처리에 있어서 팔라듐 함유량에 따른 신뢰성의 변화에 관한 것으로서, 더욱 구체적으로는 ENEPIG 표면 처리시 최적의 팔라듐 함유량에 관한 것이다. 본 발명에 따르면, 상기 팔라듐의 함유량이 솔더 볼의 중량 대비 0.04wt% 이하인 경우에 최고의 신뢰성을 나타내었다.
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公开(公告)号：KR101278097B1
公开(公告)日：2013-06-24
申请号：KR1020110053767
申请日：2011-06-03
Applicant: 성균관대학교산학협력단
IPC: B23K20/12
Abstract: 본 발명은 마찰교반 접합방법 및 이를 이용한 접합 구조체에 관한 것이다. 본 발명은 마찰교반 접합을 위해 서로 밀착된 접합재의 일면에 삽입홈을 형성하는 단계; 삽입홈에 접합 물질을 삽입하는 단계; 접합 물질을 덮도록 상기 접합재 일면에 테이프를 부착하는 단계; 삽입홈이 형성된 접합재 일면의 반대면을 마찰교반하는 단계를 포함한다. 이와 같은 본 발명에 의하면, 접합부의 복합소재 및 합금화가 가능한 마찰교반 접합방법을 이용하여 접합 시에 삽입된 접합 물질이 외부로 유출되지 않고 접합부의 결함 또한 방지할 수 있다.
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3.发明公开
公开(公告)号：KR1020130016761A
公开(公告)日：2013-02-19
申请号：KR1020110078863
申请日：2011-08-09
Applicant: 성균관대학교산학협력단
IPC: B23K20/12 , B23K103/18
Abstract: PURPOSE: A friction stir process method capable of producing composition or alloy and composition or alloy produced by said method are provided to produce a composition or an alloy from a desired portion of a material. CONSTITUTION: A friction stir process method capable of producing composition or alloy comprises a step of generating a groove in a structure(100); a step of sticking a tape(130) on the filled groove after filling the groove with a different material(120) from the structure; a step of turning over the structure for the taped portion to face down; a step of performing a friction stir process on the opposite side of the taped portion along the groove on the structure. The tape may be made of the same material of the structure or a similar material of the structure. A step of removing burr on the surface of the structure may be included following the friction stir process.
Abstract translation: 目的：提供能够产生由所述方法制备的组合物或合金和组合物或合金的摩擦搅拌工艺方法以从材料的所需部分制备组合物或合金。 构成：能够生产组合物或合金的摩擦搅拌工艺方法包括在结构（100）中产生凹槽的步骤; 在用所述结构的不同材料（120）填充所述凹槽之后，将带（130）粘贴在所述填充凹槽上的步骤; 将带状部分的结构翻转成朝下的步骤; 沿着结构体上的凹槽在带状部分的相对侧进行摩擦搅拌处理的步骤。 带可以由结构的相同材料或结构的相似材料制成。 在摩擦搅拌过程之后可以包括去除结构表面上的毛刺的步骤。
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公开(公告)号：KR1020120134678A
公开(公告)日：2012-12-12
申请号：KR1020110053767
申请日：2011-06-03
Applicant: 성균관대학교산학협력단
IPC: B23K20/12
Abstract: PURPOSE: A friction stir welding method and a coupling structure using the same are provided to prevent the leakage of a filler material and defects in a weld zone. CONSTITUTION: A friction stir welding method comprises the steps of: forming an insertion groove(14) on one side of welded materials(10) butte against each other, inserting a filler material to the insertion groove, attaching tape(30) to one side of the welded materials to cover the filler material, and friction-stir-welding the opposite side of the welded materials to the insertion groove, wherein the filler material is different from the welded materials and the tape is the same material as the filler material.
Abstract translation: 目的：提供一种摩擦搅拌焊接方法和使用该摩擦搅拌焊接方法的联接结构，以防止填充材料的泄漏和焊接区域中的缺陷。 构成：摩擦搅拌焊接方法包括以下步骤：在焊接材料（10）的一侧上形成插入槽（14），将填充材料插入到插入槽中，将带（30）连接到一侧 的焊接材料覆盖填充材料，并且将焊接材料的相对侧摩擦搅拌焊接到插入槽，其中填充材料与焊接材料不同，并且带是与填充材料相同的材料。
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公开(公告)号：KR1020120056942A
公开(公告)日：2012-06-05
申请号：KR1020100118431
申请日：2010-11-26
Applicant: 성균관대학교산학협력단
IPC: B23K20/12
Abstract: PURPOSE: A friction stir welding apparatus and method for controlling the maximum temperature and cooling speed of a junction part are provided to control the phase transition of welded materials by stopping the operation of a cooler and operating a resistance wire to control the cooling speed of the welded materials after welding. CONSTITUTION: A friction stir welding apparatus comprises a tool(10), a backing plate(30), a contact plate(32), and a cooler(38). The tool is inserted to a junction part between welded materials(20,22) and implements friction stir welding on the welded materials. The backing plate supports the welded material. The contact plate is inserted to the backing plate. The cooler is inserted to the backing plate.
Abstract translation: 目的：提供一种用于控制接合部件的最高温度和冷却速度的摩擦搅拌焊接装置和方法，通过停止冷却器的操作并操作电阻丝来控制焊接材料的相变，以控制焊接材料的冷却速度 焊接后的焊接材料。 构成：摩擦搅拌焊接装置包括工具（10），背板（30），接触板（32）和冷却器（38）。 该工具插入到焊接材料（20,22）之间的接合部分，并在焊接材料上实施摩擦搅拌焊接。 背板支撑焊接材料。 接触板插入背板。 冷却器插入背板。
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Patent Agency Ranking
公开(公告)号：KR1020130016784A
公开(公告)日：2013-02-19
申请号：KR1020110078897
申请日：2011-08-09
Applicant: 성균관대학교산학협력단
Abstract: PURPOSE: An optimum palladium content in ENEPIG(electroless nickel / electroless palladium / immersion gold) surface treatment for enhancing mechanical properties is provided to obtain the maximum reliability of the surface treatment by maintaining palladium content to be 0.04 wt% or less. CONSTITUTION: An ENEPIG surface treatment comprises a step of plating electroless nickel on a printed circuit board; a step of plating palladium on the electroless nickel plating; and a step of plating gold on the palladium plating. The content of palladium is 0.04 wt% or less. An ENEPIG surface treatment comprises a step of plating electroless nickel on a printed circuit board; a step of plating electroless palladium on the electroless nickel plating; and a step of plating gold on the electroless palladium plating. Solder ball may be welded on the gold plating. After welding the solder ball put on component side through reflow, the substrate put on the substrate of the board side is weld again through reflow. [Reference numerals] (AA,DD,II) Solder ball; (BB) Plating process layer; (CC) Printed circuit board(PCB); (EE) Gold planting; (FF) Pd planting(0.02,0.04,0.06 wt%); (GG) Nickel planting; (HH) Copper circuit surface(PCB); (JJ) Cross-sectional diagram of binding the solder ball after planting nickel, palladium and gold on the PCB copper circuit surface
Abstract translation: 目的：提供用于增强机械性能的ENEPIG（无电镍/无电镀钯/浸金）表面处理中的最佳钯含量，以通过将钯含量保持在0.04重量％以下来获得表面处理的最大可靠性。 构成：ENEPIG表面处理包括在印刷电路板上电镀无电镀镍的步骤; 在化学镀镍上镀钯的步骤; 以及在镀钯上镀金的步骤。 钯的含量为0.04重量％以下。 ENEPIG表面处理包括在印刷电路板上电镀无电镀镍的步骤; 在化学镀镍上电镀无电镀钯的步骤; 以及在无电镀钯电镀上镀金的步骤。 焊球可以焊接在镀金上。 在通过回流焊焊接在组件侧的焊球之后，通过回流再次焊接放置在基板侧的基板上的基板。 （附图标记）（AA，DD，II）焊球; （BB）电镀工艺层; （CC）印刷电路板（PCB）; （EE）金种植; （FF）Pd种植（0.02,0.04,0.06重量％）; （GG）镍种植; （HH）铜电路表面（PCB）; （JJ）在PCB铜电路表面上种植镍，钯和金之后结合焊球的横截面图
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公开(公告)号：KR101199660B1
公开(公告)日：2012-11-08
申请号：KR1020110069910
申请日：2011-07-14
Applicant: 성균관대학교산학협력단
IPC: H01J17/16 , H01J17/49 , G02F1/1333 , B23K20/12
Abstract: PURPOSE: A reinforcement frame for a display panel and a manufacturing method thereof are provided to effectively emit heat generated in an LED and to shorten a mechanical processing time. CONSTITUTION: A reinforcement frame for a display panel comprises four bar type frame members. The four bar type frame members are fixed in the form of a square frame. A cross section of the four bar type frame members is bent into a shape corresponding to the corners of the display panel. End portions of the four bar type frame members which are overlapped with each other are welded by a friction stir junction method. The friction stir junction method uses a welding head(23) which rotates at a high speed.
Abstract translation: 目的：提供一种用于显示面板的加强框架及其制造方法，以有效地发射LED中产生的热量并缩短机械处理时间。 构成：用于显示面板的加强框架包括四个条形框架构件。 四杆式框架构件以方形框架的形式固定。 四个杆型框架构件的横截面弯曲成与显示面板的角部相对应的形状。 通过摩擦搅拌接合方法焊接彼此重叠的四个杆型框架构件的端部。 摩擦搅拌接合法使用高速旋转的焊接头（23）。
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公开(公告)号：KR101307634B1
公开(公告)日：2013-09-12
申请号：KR1020120021706
申请日：2012-03-02
Applicant: 성균관대학교산학협력단
IPC: B23K20/12 , B23K20/227
Abstract: 본 발명은 금속 부재 및 세라믹 부재를 접합하는 방법에 관한 것으로서, 구체적으로는 마찰 교반 접합 방식에 의해 금속 부재 및 세라믹 부재를 접합하는 방법에 관한 것이다.
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公开(公告)号：KR1020130100481A
公开(公告)日：2013-09-11
申请号：KR1020120021706
申请日：2012-03-02
Applicant: 성균관대학교산학협력단
IPC: B23K20/12 , B23K20/227
Abstract: PURPOSE: A method for bonding a metal member and a ceramic member is provided to bond the metal member and the ceramic member in an atmospheric condition without an insertion metal or an adhesive. CONSTITUTION: A method for bonding a metal member and a ceramic member includes: a step of meshing or overlapping the metal member with the ceramic member; a step of placing the tool of a milling machine on a portion in which the metal member is overlapped with the ceramic member; a step of moving the tool along the portion; and a step of removing burr at a bonding surface between the metal member and the ceramic member. The metal member includes nonferrous metal and ferrous metal, and the ceramic member includes carbonized, nitrified, and oxidized ceramics. [Reference numerals] (AA) Step of meshing or overlapping the metal member with the ceramic member; (BB) Step 110; (CC) Step of placing the tool of a milling machine on a portion in which the metal member is overlapped with the ceramic member; (DD) Step 120; (EE) Step of moving the tool along the overlapped portion; (FF) Step 130; (GG) Step of removing burr at a bonding surface; (HH) Step 140
Abstract translation: 目的：提供一种用于接合金属构件和陶瓷构件的方法，以在没有插入金属或粘合剂的情况下将金属构件和陶瓷构件在大气条件下接合。 构成：金属构件和陶瓷构件的接合方法包括：使金属构件与陶瓷构件啮合或重叠的工序; 将铣床的工具放置在金属构件与陶瓷构件重叠的部分上的步骤; 沿着该部分移动工具的步骤; 以及在金属构件和陶瓷构件之间的接合表面处去除毛刺的步骤。 金属构件包括有色金属和黑色金属，陶瓷构件包括碳化，硝化和氧化的陶瓷。 （附图标记）（AA）金属构件与陶瓷构件的啮合或重叠的步骤; （BB）步骤110; （CC）将铣床的刀具放置在金属构件与陶瓷构件重叠的部分上的步骤; （DD）步骤120; （EE）沿着重叠部分移动工具的步骤; （FF）步骤130; （GG）去除接合面上的毛刺的步骤; （HH）步骤140
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公开(公告)号：KR101199724B1
公开(公告)日：2012-11-08
申请号：KR1020110069919
申请日：2011-07-14
Applicant: 성균관대학교산학협력단
IPC: H01J17/16 , G02F1/1333 , B23K20/12 , B21D53/74
Abstract: PURPOSE: A reinforcement frame for a display panel and a manufacturing method thereof are provided to reduce costs by minimizing loss of raw materials in the reinforcement frame manufacturing process using extruded material or rolled material. CONSTITUTION: Bar type frame members(21,22) are comprised of copper alloy plate material. The bar type frame members are formed by cutting extruded material or rolled material of the copper alloy plate material. A cross section of the bar type frame members are bent as a shape corresponding to edges of a display panel. An overlapped portion of both ends of the bar type frame members is shaped to a complementary shape. Both ends of the bar type frame members are welded with a friction stir junction method.
Abstract translation: 目的：提供一种用于显示面板的加强框架及其制造方法，以通过使用挤出材料或轧制材料在增强框架制造过程中最小化原材料的损失来降低成本。 构成：杆型框架构件（21,22）由铜合金板材构成。 棒型框架构件通过切割铜合金板材料的挤出材料或轧制材料而形成。 杆型框架构件的横截面被弯曲成与显示面板的边缘相对应的形状。 杆型框架构件的两端的重叠部分成形为互补形状。 杆式框架构件的两端用摩擦搅拌接合法焊接。
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