Abstract:
본 발명은 마찰교반 접합 시 접합부의 최고온도 및 피접합재의 냉각속도를 조절할 수 있는 마찰교반 접합장치 및 마찰교반 접합방법에 관한 것으로, 접합 시에는 접합부에 가해지는 열을 접촉 플레이트로 흡수하고 냉각기로 냉각시킴으로써 접합 시 최고온도를 낮추어 상변태가 일어나는 것을 막고, 접합 후에는 피접합재의 냉각속도를 조절함으로써 상변태가 일어날 수 있는 재료의 상변태를 조절하는 것을 특징으로 한다.
Abstract:
본 발명은 ENEPIG 표면 처리에 있어서 팔라듐 함유량에 따른 신뢰성의 변화에 관한 것으로서, 더욱 구체적으로는 ENEPIG 표면 처리시 최적의 팔라듐 함유량에 관한 것이다. 본 발명에 따르면, 상기 팔라듐의 함유량이 솔더 볼의 중량 대비 0.04wt% 이하인 경우에 최고의 신뢰성을 나타내었다.
Abstract:
A manufacturing method of open-celled metal hollow sphere is provided to connect inner wall and outer wall networks to pores formed within the copper base and circulate gas and liquid materials. A manufacturing method of open-celled metal hollow sphere comprises: a step for manufacturing slurry which is made of metal oxide powder, low melting point metal, solvent, and binder; a step for coating the manufactured slurry on the surface of a polymer ball or a paraffin ball; a step for evaporating solvent by drying the coated polymer ball or the coated paraffin ball; and a step for reducing metal oxide by heating the metal oxide under the hydrogen atmosphere. The low melting point metal is made of zinc and is added from 0.01 to 50 weight% based on the slurry total weight. The diameter of the metal oxide powder is 1/50 or less of the metal hollow sphere diameter. The solvent is made of water, alcohol or acetone.
Abstract:
PURPOSE: An optimum palladium content in ENEPIG(electroless nickel / electroless palladium / immersion gold) surface treatment for enhancing mechanical properties is provided to obtain the maximum reliability of the surface treatment by maintaining palladium content to be 0.04 wt% or less. CONSTITUTION: An ENEPIG surface treatment comprises a step of plating electroless nickel on a printed circuit board; a step of plating palladium on the electroless nickel plating; and a step of plating gold on the palladium plating. The content of palladium is 0.04 wt% or less. An ENEPIG surface treatment comprises a step of plating electroless nickel on a printed circuit board; a step of plating electroless palladium on the electroless nickel plating; and a step of plating gold on the electroless palladium plating. Solder ball may be welded on the gold plating. After welding the solder ball put on component side through reflow, the substrate put on the substrate of the board side is weld again through reflow. [Reference numerals] (AA,DD,II) Solder ball; (BB) Plating process layer; (CC) Printed circuit board(PCB); (EE) Gold planting; (FF) Pd planting(0.02,0.04,0.06 wt%); (GG) Nickel planting; (HH) Copper circuit surface(PCB); (JJ) Cross-sectional diagram of binding the solder ball after planting nickel, palladium and gold on the PCB copper circuit surface
Abstract:
PURPOSE: A reinforcement frame for a display panel and a manufacturing method thereof are provided to effectively emit heat generated in an LED and to shorten a mechanical processing time. CONSTITUTION: A reinforcement frame for a display panel comprises four bar type frame members. The four bar type frame members are fixed in the form of a square frame. A cross section of the four bar type frame members is bent into a shape corresponding to the corners of the display panel. End portions of the four bar type frame members which are overlapped with each other are welded by a friction stir junction method. The friction stir junction method uses a welding head(23) which rotates at a high speed.
Abstract:
PURPOSE: A tool for friction stir welding and a molding method thereof are provided to prevent the abrasion of a welding tool caused by chemical reaction to a work piece because the welding tool is made from silicon nitride sintered in a high-pressure gas atmosphere. CONSTITUTION: A tool for friction stir welding is manufactured by sintering silicon nitride powder, whose grain size is 0.3μm or less, in a high-pressure gas atmosphere. The welding tool comprises a tool body(10), a shoulder part(20) that is projected from both ends of the tool body and have a slope surface(22) inclined outward, and a fin part(30) that is projected from the center of the shoulder part to contact a welded part at the time of friction stirring.
Abstract:
PURPOSE: A device and a method for processing the surface of a metal material are provided to mold the surface of a metal member without an additional device by inclining a tool. CONSTITUTION: A device for processing the surface of a metal material comprises a turntable(10) and a tool(20). A metal sample(1) is loaded on the turntable. The turn table can be horizontally reciprocated. The tool is vertically arranged on the top of the metal sample and is vertically and horizontally reciprocated. The rotary shaft(C) of the tool is inclined to the rotary shaft of the turntable.
Abstract:
The present invention relates to a manufacturing method for a metal-graphene composite and a metal-graphene composite manufactured thereby. The manufacturing method for a metal-graphene composite according to an embodiment of the present invention comprises a step of processing a groove on a metal member; a step of inserting graphene powder into the groove; and a step of performing friction stirring process along the groove.
Abstract:
본 발명은 마찰교반 접합방법 및 이를 이용한 접합 구조체에 관한 것이다. 본 발명은 마찰교반 접합을 위해 서로 밀착된 접합재의 일면에 삽입홈을 형성하는 단계; 삽입홈에 접합 물질을 삽입하는 단계; 접합 물질을 덮도록 상기 접합재 일면에 테이프를 부착하는 단계; 삽입홈이 형성된 접합재 일면의 반대면을 마찰교반하는 단계를 포함한다. 이와 같은 본 발명에 의하면, 접합부의 복합소재 및 합금화가 가능한 마찰교반 접합방법을 이용하여 접합 시에 삽입된 접합 물질이 외부로 유출되지 않고 접합부의 결함 또한 방지할 수 있다.
Abstract:
PURPOSE: A friction stir process method capable of producing composition or alloy and composition or alloy produced by said method are provided to produce a composition or an alloy from a desired portion of a material. CONSTITUTION: A friction stir process method capable of producing composition or alloy comprises a step of generating a groove in a structure(100); a step of sticking a tape(130) on the filled groove after filling the groove with a different material(120) from the structure; a step of turning over the structure for the taped portion to face down; a step of performing a friction stir process on the opposite side of the taped portion along the groove on the structure. The tape may be made of the same material of the structure or a similar material of the structure. A step of removing burr on the surface of the structure may be included following the friction stir process.