公开(公告)号：KR1020100103362A

公开(公告)日：2010-09-27

申请号：KR1020100018588

申请日：2010-03-02

Applicant: 스미토모덴키고교가부시키가이샤

Inventor： 야마모토마사미치 ,  나카츠기쿄우이치로우 ,  가리야아야오 ,  사토우카츠히로 ,  오쿠다야스히로

IPC: H05K1/14 ,  C08J5/18

CPC classification number: H05K3/323 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/104 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: PURPOSE: A connection structure of a print circuit board, a method for connecting the printed circuit board, and an adhesive with anisotropic conductivity are provided to improve the reliability of an electrical connection between a first electrode and a second electrode by forming a cavity between the first and second electrodes. CONSTITUTION: A plurality of first electrodes(12,13) are formed on a first substrate(11). A plurality of second electrodes(22,23) are formed on a second substrate(21). An adhesive layer(30a) is formed between the first and second substrates and is comprised of the adhesive including conductive particles. A cavity is formed between the first and second electrodes. The pitch of the first electrode and the pitch of the second electrode are 10 um to 300 um.

Abstract translation: 目的：提供印刷电路板的连接结构，用于连接印刷电路板的方法和具有各向异性导电性的粘合剂，以通过在第一电极和第二电极之间形成空腔来提高第一电极和第二电极之间的电连接的可靠性 第一和第二电极。 构成：在第一基板（11）上形成多个第一电极（12,13）。 多个第二电极（22,23）形成在第二基板（21）上。 在第一和第二基底之间形成粘合剂层（30a），并由包括导电颗粒的粘合剂构成。 在第一和第二电极之间形成空腔。 第一电极的间距和第二电极的间距为10μm至300μm。