公开(公告)号：KR1020050110699A

公开(公告)日：2005-11-23

申请号：KR1020057018001

申请日：2004-03-16

Applicant: 아토테크더치랜드게엠베하

Inventor： 말코브하르트무트 ,  슈파링크리스티안

IPC: C23F1/18 ,  C23F3/06 ,  H01L21/3213

CPC classification number: C23C18/1844 ,  C23C18/31 ,  C23C18/50 ,  C23F1/18 ,  C23F3/06 ,  H01L2924/0002 ,  H05K3/244 ,  H05K3/383 ,  H01L2924/00

Abstract: A solution for etching copper or a copper alloy for producing a copper surface having the brightest possible finish for a metallization that is to follow is described. The solution has a pH on the order of 4 or less and is free of sulfate ions. It comprises: a) at least one oxidizing agent selected from the group comprising hydrogen peroxide and peracids, b) at least one substance selected from the group comprising aromatic sulfonic acids and salts of the aromatic sulfonic acids and optionally c) at least one N-heterocyclic compound. Further a method for depositing metal onto the surface of copper or a copper alloy is described. Said method comprises the following method steps: a) contacting the surface with the solution in accordance with the invention and b) coating the surface with at least one metal. The solution and the method are especially suited in the production of electric circuit carriers, more specifically for semiconductor manufacturing.

Abstract translation: 描述了用于蚀刻铜或铜合金的方法，用于制造具有尽可能光亮的用于金属化的精加工的铜表面。 溶液的pH值在4以下，不含硫酸根离子。 它包括：a）至少一种选自过氧化氢和过酸的氧化剂，b）至少一种选自芳族磺酸和芳族磺酸盐的物质，以及任选的c）至少一种N- 杂环化合物。 另外描述了一种将金属沉积在铜或铜合金表面上的方法。 所述方法包括以下方法步骤：a）使表面与根据本发明的溶液接触，以及b）用至少一种金属涂覆表面。 该方案和方法特别适用于生产电路载体，更具体地说用于半导体制造。

公开(公告)号：KR101059707B1

公开(公告)日：2011-08-29

申请号：KR1020057018001

申请日：2004-03-16

Applicant: 아토테크더치랜드게엠베하

Inventor： 말코브하르트무트 ,  슈파링크리스티안

IPC: C23F1/18 ,  C23F3/06 ,  H01L21/3213

CPC classification number: C23C18/1844 ,  C23C18/31 ,  C23C18/50 ,  C23F1/18 ,  C23F3/06 ,  H01L2924/0002 ,  H05K3/244 ,  H05K3/383 ,  H01L2924/00

Abstract: A solution for etching copper or a copper alloy for producing a copper surface having the brightest possible finish for a metallization that is to follow is described. The solution has a pH on the order of 4 or less and is free of sulfate ions. It comprises: a) at least one oxidizing agent selected from the group comprising hydrogen peroxide and peracids, b) at least one substance selected from the group comprising aromatic sulfonic acids and salts of the aromatic sulfonic acids and optionally c) at least one N-heterocyclic compound. Further a method for depositing metal onto the surface of copper or a copper alloy is described. Said method comprises the following method steps: a) contacting the surface with the solution in accordance with the invention and b) coating the surface with at least one metal. The solution and the method are especially suited in the production of electric circuit carriers, more specifically for semiconductor manufacturing.

Abstract translation: 描述了一种用于蚀刻铜或铜合金的解决方案，用于生产具有尽可能明亮的用于接下来的金属化的铜表面的铜表面。 该溶液具有约4或更小的pH并且不含硫酸根离子。 它包含：a）至少一种选自过氧化氢和过酸的氧化剂，b）至少一种选自芳香族磺酸和芳香族磺酸盐的物质和任选的c）至少一种N- 杂环化合物。 另外描述了用于将金属沉积到铜或铜合金表面上的方法。 所述方法包括以下方法步骤：a）使表面与根据本发明的溶液接触，和b）用至少一种金属涂覆表面。 该解决方案和方法特别适用于电路载体的生产，更具体地说，用于半导体制造。

公开(公告)号：KR1020050029220A

公开(公告)日：2005-03-24

申请号：KR1020057000834

申请日：2002-09-06

Applicant: 아토테크더치랜드게엠베하

Inventor： 슈라이어한스-위르겐 ,  말코브하르트무트

IPC: C23C18/42

CPC classification number: H05K3/244 ,  C23C18/42

Abstract: The problem in forming solderable and bondable layers on printed circuit boards is that the surfaces tarnish after storage of the boards prior to further processing (mounting of the electrical components), thus affecting solderability and bondability. In order to overcome this problem it is suggested to deposit, in a first method step, a first metal which is more noble than copper to the printed circuit board and to plate silver in a second method step with the proviso that the first metal be deposited at a rate that is at most half the rate of plating of silver in the second method step when the first metal is silver.

Abstract translation: 在印刷电路板上形成可焊接和可粘合层的问题是在进一步处理（安装电气部件）之前，表面在储存电路板之后变亮，从而影响可焊性和可粘合性。 为了克服这个问题，建议在第一种方法步骤中，在第二种方法步骤中，将沉积在铜上的第一种金属沉积到印刷电路板上，并在第二种方法步骤中沉积银，其条件是第一种金属被沉积 当第一金属是银时，在第二方法步骤中银的镀覆速率的一半以上的速率。

公开(公告)号：KR1020050016512A

公开(公告)日：2005-02-21

申请号：KR1020047019782

申请日：2003-05-27

Applicant: 아토테크더치랜드게엠베하

Inventor： 슈파링크리스티안 ,  말코브하르트무트

IPC: C23C18/42

CPC classification number: C23C18/42 ,  H05K3/244 ,  H05K2203/072

Abstract: 종래 기술의 용액 및 방법과는 대조적으로, 변색 방지 화합물이 사용되지 않고, 저장 이후에도 열화되지 않는 특성을 가지는 땜납가능하고 결합가능한 은 층의 제조를 위해 사용되는 처리 용액 및 방법이 사용된다. 은 증착용 산성 용액은 은 이온 및 하나 이상의 구리(I) 착화제를 함유하고, 상기 구리(I) 착화제는 하기의 화학식 I을 가지는 화합물을 함유하는 군으로부터 선택된다: