公开(公告)号：KR1020080023249A

公开(公告)日：2008-03-12

申请号：KR1020087000441

申请日：2006-06-28

Applicant: 아토테크더치랜드게엠베하

Inventor： 메이어하인리히 ,  쿠르츠올라프 ,  헤르버랄프 ,  마드리크리스티안 ,  에츠콘요한네 ,  바고토마스

IPC: B23K20/02 ,  B23K20/00 ,  B23K20/227 ,  B23K20/22

CPC classification number: B23K20/023 ,  F28F2260/00 ,  F28F2260/02 ,  F28F2275/04

Abstract: For forming very strong bond joints suited for manufacturing micro-structured components consisting of a plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement is heated to a bonding temperature below the melting temperature of the at least one bonding layer. In accordance with the invention, the at least one bonding layer is deposited using a chemical or electrolytic method. ® KIPO & WIPO 2008

Abstract translation: 为了形成适合于制造由多个单独层组成的微结构部件的非常牢固的接合接头，提出了一种接合方法，通过该接合方法形成工件的接合装置，其包括至少一个介于其间的金属接合层， 将所述接合装置加热到低于所述至少一个结合层的熔融温度的接合温度。 根据本发明，使用化学或电解方法沉积至少一个结合层。 ®KIPO＆WIPO 2008