公开(公告)号：KR1020080072866A

公开(公告)日：2008-08-07

申请号：KR1020087012280

申请日：2006-10-23

Applicant: 아토테크더치랜드게엠베하

Inventor： 튜스,더크 ,  스패링,크리스티안

IPC: C23F1/18 ,  C23F1/46 ,  C23F3/06 ,  C23G1/10

CPC classification number: H05K3/383 ,  C23F1/18 ,  C23F1/46 ,  C23F3/06 ,  C23G1/103 ,  H05K2203/0796 ,  H05K2203/124 ,  B05D1/02 ,  C09K13/00 ,  C23F1/02 ,  H01L21/302 ,  H05K3/0017

Abstract: The present invention relates to a method for treating copper or copper alloy surfaces for tight bonding to polymeric substrates, for example solder masks found in multilayer printed circuit boards. The substrate generally is a semiconductor-device, a lead frame or a printed circuit board.

Abstract translation: 本发明涉及一种用于处理铜或铜合金表面以紧密粘合到聚合物基材上的方法，例如在多层印刷电路板中发现的焊接掩模。 基板通常是半导体器件，引线框架或印刷电路板。