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公开(公告)号：KR100483332B1
公开(公告)日：2005-04-15
申请号：KR1020030026651
申请日：2003-04-28
Applicant: 전자부품연구원
IPC: H01L21/60
CPC classification number: H01L2224/48091 , H01L2224/48227 , H01L2924/16152 , H01L2924/00014
Abstract: 본 발명은 고주파 통신 모듈의 패키징 장치 및 그 제조 방법에 관한 것으로서, 본딩 와이어를 통해 고주파 통신 모듈의 상면에 형성된 패드와 전기적으로 연결되는 패키징 장치의 급전선 하부에 상호 이격된 한 쌍의 금속 단자를 형성하여 본딩 와이어로 인한 고주파 기생 인덕턴스를 커패시턴스의 임피던스 매칭으로 감소시켜 고주파 영역에서 급전선의 전송 특성을 향상시킬 수 있도록 한다.
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公开(公告)号：KR1020040095379A
公开(公告)日：2004-11-15
申请号：KR1020030026651
申请日：2003-04-28
Applicant: 전자부품연구원
IPC: H01L21/60
CPC classification number: H01L2224/48091 , H01L2224/48227 , H01L2924/16152 , H01L2924/00014
Abstract: PURPOSE: A packaging apparatus of an RF communication module and a fabricating method thereof are provided to improve a transmitting characteristic of a feeding line within an RF band by reducing RF parasitic capacitance due to a bonding wire. CONSTITUTION: The first sheet structure(23) is fabricated by forming the first cavity(21) on a predetermined region of the first sheet, printing a couple of metal terminals(22) on both sides of the first cavity, and forming a ground side on a bottom face of the first sheet. The second sheet structure(33) is fabricating by forming the second cavity(31) on the predetermined region of the second sheet and printing a feeding line on both sides of the second cavity. The third sheet structure(43) is fabricated by forming the third cavity on the predetermined region of the third sheet and forming the fourth cavity on both sides of the third cavity. The first to the third structures are formed with one body. The ground side of the first sheet is bonded to a plated metal body.
Abstract translation: 目的：提供RF通信模块的包装装置及其制造方法，通过降低由于接合线引起的RF寄生电容来提高RF频带内的馈线的发送特性。 构成：第一片结构（23）通过在第一片的预定区域上形成第一空腔（21），在第一腔的两侧印刷一对金属端子（22）并形成接地侧 在第一张纸的底面上。 第二片结构（33）通过在第二片的预定区域上形成第二腔（31）并在第二腔的两侧上印刷馈送线来制造。 第三片结构（43）通过在第三片的预定区域上形成第三腔并在第三腔的两侧形成第四腔来制造。 第一至第三结构形成一体。 第一片的接地侧与镀金属体接合。
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