公开(公告)号：KR1020090106046A

公开(公告)日：2009-10-08

申请号：KR1020080031536

申请日：2008-04-04

Applicant: 전자부품연구원

Inventor： 임영민 ,  장진석 ,  김회경

IPC: H01P3/02 ,  H05K1/09

CPC classification number: H01P3/02 ,  H01P5/028 ,  H05K1/09

Abstract: PURPOSE: A CPWG transmission line and a printed circuit board including the same are provided to implement impedance matching by maintaining a CPWG transmission method between the signal lines by forming a dummy solder ball in a ground line of the CPWG transmission line. CONSTITUTION: A ground line(150) is positioned between signal lines(110,120) using a CPWG(Coplanar Waveguide with Ground) transmission method. A solder ball(115,125,151) is formed in each signal line. A metal structure is additionally in the same position as the solder ball. The metal structure is a dummy solder ball or dummy pad.

Abstract translation: 目的：通过在CPWG传输线的地线中形成虚拟焊球，提供CPWG传输线和包括该CPWG传输线的印刷电路板，以通过在信号线之间维持CPWG传输方法来实现阻抗匹配。 构成：使用CPWG（共面波导与地面）传输方法将地线（150）定位在信号线（110,120）之间。 在每个信号线中形成焊球（115,125,151）。 金属结构另外位于与焊球相同的位置。 金属结构是虚拟焊球或虚拟焊盘。