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公开(公告)号：KR100611448B1
公开(公告)日：2006-08-09
申请号：KR1019990065844
申请日：1999-12-30
Applicant: 제일모직주식회사
IPC: C08L69/00
Abstract: 본 발명은
폴리카보네이트계 수지 40 - 70 중량부,
아크릴로니트릴-부타디엔-스티렌 공중합체 30 - 60 중량부,
비스페놀 A 계열의 인계 화합물 10 - 30 중량부,
붕소계 화합물 1 - 10 중량부,
메틸 메타크릴레이트계 화합물 0.5 - 5 중량부
를 함유하는 것을 특징으로 하는 폴리카보네이트/아크릴로니트릴-부타디엔-스티렌 공중합체 수지 조성물에 관계하는 것으로, 본 발명의 폴리카보네이트/아크릴로니트릴-부타디엔-스티렌 공중합체 수지 조성물은 유동성 및 난연도가 개선되어 컴퓨터 모니터, 노트북 본체, 핸드폰, CD-ROM 등의 전자 재료 부품등의 제조에 유용하게 사용될 수 있다.
폴리카보네이트, 아크릴로니트릴-부타디엔-스티렌, 유동성, 난연도, 비스페놀A 계열의 인계 난연제Abstract translation: 本发明
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公开(公告)号：KR100382517B1
公开(公告)日：2003-08-02
申请号：KR1019970051222
申请日：1997-10-06
Applicant: 제일모직주식회사
Abstract: PURPOSE: A thermoplastic resin composition is provided, to obtain a resin composition which has an excellent elongation and is suitable for vacuum forming or blow molding. CONSTITUTION: The thermoplastic resin composition comprises 20-50 parts by weight of (I) a graft copolymer obtained by copolymerizing a rubbery polymer with a cyano vinyl compound(A) and an aromatic vinyl compound(S) or a monomer(E) copolymerizable with the compounds (A) and (S); and 50-80 parts by weight of (II) a copolymer which comprises the compounds (A) and (S) or (A), (S) and (E), and (II-1) a copolymer which comprises the compounds (A) and (S) or (A), (S) and (E), and 0.01-3 parts by weight of a mixture of 1-99 wt% of a multifunctional mercaptan and 1-99 wt% of a vinyl benzene-based compound. The copolymer (II) has a weight average molecular weight of 120,000-600,000; the copolymer (II-1) has a polystyrene-reduced weight average molecular weight by gel permeation chromatography of 180,000 or more and an intrinsic viscosity of 0.6 or more in tetrahydrofuran; and the amount of the copolymer (II-1) is 30-60 % of the total amount of the copolymers (II) and (II-1).
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公开(公告)号：KR1020030057132A
公开(公告)日：2003-07-04
申请号：KR1020010087509
申请日：2001-12-28
Applicant: 제일모직주식회사
IPC: C08L63/00
CPC classification number: C08K5/5399 , C08K3/38 , C08L63/04 , C08L2201/22 , H01L23/295
Abstract: PURPOSE: Provided is an epoxy resin composition for semiconductor sealant, which has little effect on moldability, and does not degrade the reliability of semiconductor package owing to forming of hydrolyzed product, and uses an eco-friendly phosphagen-based flame retardant. CONSTITUTION: The composition comprises (1) an epoxy resin, (2) a curing agent, (3) a curing accelerator, (4) an inorganic filler, and (5) a phosphagen-based phosphorus-nitrogen compound. The epoxy resin is an epoxy resin of ortho-cresol novolac type and/or a biphenyl epoxy resin, and the curing agent is at least one selected from the group consisting of phenol novolac resin, xyloc resin, and dicyclopentadiene resin. The phosphagen-based phosphorus-nitrogen compound has a structure represented by any one of formulas 1-3. In the formulas, each R1 is independently alkyl group, aryl group, alkyl-substituted aryl group, aralkyl group, alkoxy group, aryloxy group, amino group, or hydroxy group, R2 is C1-C30 dioxy arylene or alkyl-substituted, C6-C30 dioxy arylene derivative, each of k and m is independently 0, or an integer of 1-10, and an average value of n is a real number of 0.3-3.
Abstract translation: 目的：提供一种用于半导体密封剂的环氧树脂组合物，其对成型性影响不大，并且由于形成水解产物而不会降低半导体封装的可靠性，并且使用环保型磷酸基阻燃剂。 构成：组合物包含（1）环氧树脂，（2）固化剂，（3）固化促进剂，（4）无机填料和（5）基于磷酸盐的磷 - 氮化合物。 环氧树脂是邻甲酚酚醛清漆型和/或联苯型环氧树脂的环氧树脂，固化剂为选自苯酚酚醛清漆树脂，木酮树脂和二环戊二烯树脂中的至少一种。 磷酸酯类磷 - 氮化合物具有式1-3中任一项所示的结构。 式中，R 1独立地为烷基，芳基，烷基取代芳基，芳烷基，烷氧基，芳氧基，氨基或羟基，R2为C1-C30二氧基亚芳基或烷基取代C6- C30二氧基亚芳基衍生物，k和m各自独立地为0或1-10的整数，n的平均值为0.3-3的实数。
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公开(公告)号：KR100600597B1
公开(公告)日：2006-07-13
申请号：KR1020010087509
申请日：2001-12-28
Applicant: 제일모직주식회사
IPC: C08L63/00
Abstract: 본 발명은 성형성 및 신뢰성이 우수하고 일정 수준의 난연성을 갖는 반도체 봉지재용 에폭시 수지 조성물에 관한 것으로, 보다 상세하게는 (1) 에폭시 수지, (2) 경화제, (3) 경화촉진제, (4) 무기충전제, (5) 포스파젠계 인-질소 화합물, 및 (6) 기타 첨가제를 필수성분으로 포함하는 반도체 봉지재용 에폭시 수지 조성물에 관한 것이며, 본 발명에 의하면 우수한 성형성과 신뢰성을 유지하면서도 UL94 VO의 난연성이 확보된, 할로겐계 난연제를 함유하지 않는 환경 친화적 반도체 봉지재를 제공할 수 있다.
반도체 봉지재, 에폭시 수지, 포스파젠계 화합물, 붕산아연계 화합물, 난연성, 환경Abstract translation: （1）环氧树脂，（2）固化剂，（3）固化促进剂，（4）环氧树脂，和 的无机填料，（5）基于磷腈 - 磷 - 氮化合物，和（6）其它添加剂涉及一种半导体密封阻尼器的环氧树脂组合物包括作为主要组分，保持根据本发明优异的成形性和可靠性，而UL94 VO 有可能提供阻燃且不含卤素基阻燃剂的环保型半导体封装剂。
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公开(公告)号：KR1020040049707A
公开(公告)日：2004-06-12
申请号：KR1020020077553
申请日：2002-12-07
Applicant: 제일모직주식회사
IPC: C08L63/00
CPC classification number: C08L63/00 , C08K3/34 , C08K5/5419 , C08L91/00 , H01L23/295
Abstract: PURPOSE: Provided is an epoxy resin composition for sealing a semiconductor element, which is excellent in an adhesive property to a metal, an absorption property, a high temperature crack-resistance, a curing property, and a mechanical property, therefore can be used for forming a semiconductor element package in a high reliability. CONSTITUTION: The epoxy resin composition contains 0.01-5.0wt% of a coupling agent, 3.0-25.0wt% of an epoxy resin, 2.0-10.5wt% of a curing agent, 0.1-0.3wt% of a curing accelerator, 0.5-1.5wt% of a modified silicon oil, and 73.0-90.0wt% of an inorganic filler, wherein the coupling agent is an oligomer epoxy silanol coupling agent represented by the formula 1.
Abstract translation: 目的：提供一种用于密封半导体元件的环氧树脂组合物，其具有优异的金属粘合性，吸收性，耐高温裂纹性，固化性和机械性能，因此可用于 以高可靠性形成半导体元件封装。 构成：环氧树脂组合物含有0.01-5.0重量％的偶联剂，3.0-25.0重量％的环氧树脂，2.0-10.5重量％的固化剂，0.1-0.3重量％的固化促进剂，0.5-1.5 wt％的改性硅油和73.0-90.0wt％的无机填料，其中偶联剂是由式1表示的低聚物环氧硅烷醇偶联剂。
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Patent Agency Ranking
公开(公告)号：KR1020000055347A
公开(公告)日：2000-09-05
申请号：KR1019990003917
申请日：1999-02-05
Applicant: 제일모직주식회사
Inventor： 김익흠
Abstract: PURPOSE: Polycarbonate/styrene thermoplastic resin compositions, which are excellent in molding properties and elongation when vacuum molding or blow molding, are provided by adding non-linear structured cyanided vinyl/aromatic vinyl co-polymer to a mixture of polycarbonate and styrene. CONSTITUTION: A resin compositions are produced by adding 0.01-5 parts by weight of co-polymer of non-linear structured aromatic vinyl compounds and cyanide vinyl compounds to 100 parts by weight of mixtures of 50-95wt% of polycarbonate resin and 5-50wt% of rubber enhanced styrene resin. The polycarbonate resin is prepared by reacting divalent phenol compounds and phosgene or diester carboxylate, and the rubber enhanced styrene resin is prepared by mixing 20-100wt% of styrene containing graft co-polymer obtained from graft copolymerization of monomer mixture consisting of 10-50wt% of cyanide vinyl compounds and 50-90wt% of aromatic vinyl compounds and 80-100wt% of styrene containing graft copolymer including 10-50wt% of cyanide vinyl compounds, wherein the rubber enhanced styrene resin is dispersed in polycarbonate resin. The cyanide vinyl/aromatic vinyl co-polymer is consisted of 10-50 parts by weight of cyanide vinyl compounds and 50-90 parts by weight of aromatic vinyl compounds.
Abstract translation: 目的：通过在聚碳酸酯和苯乙烯的混合物中添加非线性结构化氰化乙烯基/芳族乙烯基共聚物来提供真空成型或吹塑成型时成型性和伸长性优异的聚碳酸酯/苯乙烯热塑性树脂组合物。 构成：通过将0.01-5重量份的非线性结构芳族乙烯基化合物和氰化乙烯基化合物的共聚物加入到100重量份的50-95重量％的聚碳酸酯树脂和5-50重量％的混合物中来制备树脂组合物 ％的橡胶增强苯乙烯树脂。 聚碳酸酯树脂通过使二价酚化合物与光气或二酯羧酸酯反应制备，橡胶增强苯乙烯树脂通过混合20-100重量％的含苯乙烯的接枝共聚物制备，所述接枝共聚物由单体混合物的接枝共聚获得，所述单体混合物由10-50wt％ 的氰化乙烯基化合物和50-90重量％的芳族乙烯基化合物和80-100重量％的含苯乙烯的接枝共聚物，包括10-50重量％的氰化乙烯基化合物，其中橡胶增强苯乙烯树脂分散在聚碳酸酯树脂中。 氰化乙烯基/芳族乙烯基共聚物由10-50重量份氰化物乙烯基化合物和50-90重量份芳族乙烯基化合物组成。
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公开(公告)号：KR100548825B1
公开(公告)日：2006-02-02
申请号：KR1019990003919
申请日：1999-02-05
Applicant: 제일모직주식회사
Inventor： 김익흠
Abstract: 본 발명의 열가소성 수지조성물은 50∼95 중량%의 폴리카보네이트 수지와 5∼50 중량%의 고무강화 스티렌계 수지의 혼합물 100 중량부에 대하여 아크릴계 화합물/시안화비닐 화합물/방향족비닐 화합물의 삼원공중합체 0.01∼5 중량부를 첨가하여 제조된다. 상기 폴리카보네이트 수지는 2가의 페놀화합물과 포스겐(phosgene) 또는 탄산디에스테르와의 반응에 의하여 제조된 방향족 폴리카보네이트 수지이고, 고무강화 스티렌계 수지는 고무의 존재하에서 10∼50 중량%의 시안화비닐 화합물과 50∼90 중량%의 방향족비닐 화합물로 구성된 단량체 혼합물을 그라프트 공중합시켜 얻은 스티렌 함유 그라프트 공중합체 수지 20∼100 중량%와 시안화비닐 화합물의 함유량이 10∼50 중량%인 스티렌 함유 공중합체 80∼0 중량%를 혼합한 수지이며, 이들의 혼합물은 폴리카보네이트 수지에 고무강화 스티렌계 수지가 분산되어 있는 형태로 존재한다. 상기 아크릴계 화합물/시안화비닐 화합물/방향족비닐 화합물 삼원공중합체는 시안화비닐 화합물, 방향족비닐 화합물 및/또는 이들과 공중합가능한 다른 단량체를 랜덤 공중합하여 제조된 스티렌 함유 공중합체 수지 60∼40 중량%와 아크릴계 화합물 40∼60 중량%를 중합하여 제조된 아크릴계 폴리머와 스티렌 함유 공중합체 수지를 불록 공중합체이다.
Abstract translation: 本发明的热塑性树脂组合物是相对于橡胶增强苯乙烯类树脂0.01的丙烯酸系化合物/乙烯基氰化物化合物/相对于100重量份芳族乙烯基化合物重量的50-95％的混合物的重量的聚碳酸酯树脂和5％至50％的三元共聚物 至5重量份。 聚碳酸酯树脂是通过与光气（光气），或碳酸二酯的二价酚化合物的反应而制造的芳香族聚碳酸酯树脂，橡胶增强的苯乙烯系树脂是乙烯基氰化合物的10〜50％（重量）在橡胶的存在下 和共聚物80含苯乙烯的由50至90％的芳族乙烯基化合物的按重量计的接枝共聚物含苯乙烯接枝共聚物树脂的含量和20至100％（重量）得到的10乙烯基氰化合物的单体混合物中以50重量％的 该树脂是通过混合重量〜0％，以及它们的混合物是在将橡胶增强苯乙烯类树脂分散在聚碳酸酯树脂中的形式。 丙烯酸类化合物/氰化乙烯基化合物/芳族乙烯基化合物的三元共聚物是乙烯基氰化合物，芳香族乙烯基化合物和/或它们的混合物与其他的单体与含有由（重量）的丙烯酸系化合物的树脂60-40％所得到的苯乙烯共聚物的无规共聚物共聚 丙烯酸类聚合物和含苯乙烯的共聚物树脂由（重量）的共聚物布洛克聚合40〜60％产生的。
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公开(公告)号：KR100543092B1
公开(公告)日：2006-01-20
申请号：KR1020020077553
申请日：2002-12-07
Applicant: 제일모직주식회사
IPC: C08L63/00
Abstract: 본 발명은 (1) 커플링제, (2) 에폭시 수지, (3) 경화제, (4) 경화촉진제, (5) 변성 실리콘 오일 또는 실리콘 파우더, 및 (6) 무기 충전제를 포함하는 에폭시 수지 조성물에 있어서, 상기 성분 (1)이 특정 구조를 갖는 올리고머 에폭시 실라놀 커플링제이고, 상기 성분 (6)의 함량이 조성물 전체에 대해 80~90중량%로 고충전된 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것으로, 본 발명의 에폭시 수지 조성물은 금속소지와의 부착특성, 흡습특성, 고온 내크랙특성, 경화특성 및 기계적 특성 등이 우수하여 고신뢰성의 반도체 소자 패키지 성형에 유용하다.
반도체 소자, 패키지, 에폭시 수지, 금속소지, 올리고머 에폭시 실라놀 커플링제, 부착특성, 신뢰성, 성형성-
公开(公告)号：KR1020010058505A
公开(公告)日：2001-07-06
申请号：KR1019990065841
申请日：1999-12-30
Applicant: 제일모직주식회사
IPC: C08L69/00
Abstract: PURPOSE: A polycarbonate/styrene(PC/ABS) resin composition such as polycarbonate/acrylonitrile-butadiene-styrene copolymer is provided to increase fluidity and fire-retardant property efficient in the production of electronic material parts including computer monitor, main body of notebook, mobile phone or CD-ROM. CONSTITUTION: The PC/ABS resin composition comprises 40-70 weight parts of polycarbonate resin containing less than 20 weight parts of comonomer; 30-60 weight parts of acrylonitrile-butadiene-styrene copolymer; 5-20 weight parts of red phosphorus compound; 1-10 weight parts of boronic compound; and 0.5-5 weight parts of methylmethacrylate compound. The methyl methacrylate compound is at least one or two selected from a group consisting of methyl methacrylate homopolymer, methyl methacrylate grafted butadiene copolymer or methyl methacrylate-styrene grafted butadiene copolymer.
Abstract translation: 目的：提供聚碳酸酯/苯乙烯（PC / ABS）树脂组合物如聚碳酸酯/丙烯腈 - 丁二烯 - 苯乙烯共聚物，以提高电子材料部件的生产中的流动性和阻燃性能，包括电脑显示器，笔记本主机， 手机或CD-ROM。 构成：PC / ABS树脂组合物包含40-70重量份含有少于20重量份共聚单体的聚碳酸酯树脂; 30-60重量份丙烯腈 - 丁二烯 - 苯乙烯共聚物; 5-20重量份红磷化合物; 1-10份硼酸化合物; 和0.5-5重量份的甲基丙烯酸甲酯化合物。 甲基丙烯酸甲酯化合物是选自甲基丙烯酸甲酯均聚物，甲基丙烯酸甲酯接枝的丁二烯共聚物或甲基丙烯酸甲酯 - 苯乙烯接枝的丁二烯共聚物中的至少一种或两种。
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公开(公告)号：KR1020000055348A
公开(公告)日：2000-09-05
申请号：KR1019990003919
申请日：1999-02-05
Applicant: 제일모직주식회사
Inventor： 김익흠
Abstract: PURPOSE: Polycarbonate/styrene thermoplastic resin compositions are provided which are excellent in molding property, fluidity, and appearance of the molded products therefrom, and are easy to control the properties thereof. CONSTITUTION: A resin compositions are produced by adding 0.01-5 pts. by wt. of copolymers of acryl compounds/cyanide compounds/aromatic vinyl compounds to 100 pts. by wt. of mixtures of i) 50-95 wt% of polycarbonate resin, which is prepared by reacting divalent phenol compounds and phosgene or diester carboxylate, and ii) 5-50 wt% of rubber enhanced styrene resin, which is prepared by mixing 20-100 wt% of styrene containing graft copolymers obtained from graft copolymerization of monomer mixture consisting of 10-50 wt% of cyanide vinyl compounds and 50-90wt% of aromatic vinyl compounds and 80-100wt% of styrene containing graft copolymers including 10-50wt% of cyanide vinyl compounds, wherein the rubber enhanced styrene resin is dispersed in polycarbonate resin.
Abstract translation: 目的：提供聚碳酸酯/苯乙烯热塑性树脂组合物，其成型性，流动性和模制品的外观优异，并且易于控制其性能。 构成：通过加入0.01-5重量份生产树脂组合物。 以重量计 的丙烯酸化合物/氰化物化合物/芳香族乙烯基化合物的共聚物到100个。 以重量计 的混合物，i）50-95重量％的聚碳酸酯树脂，其通过二价酚化合物和光气或二酯羧酸酯反应制备，和ii）5-50重量％的橡胶增强苯乙烯树脂，其通过混合20-100 由10-50重量％的氰化乙烯基化合物和50-90重量％的芳族乙烯基化合物组成的单体混合物和80-100重量％的含苯乙烯的接枝共聚物的接枝共聚获得的含苯乙烯的接枝共聚物的重量％包括10-50重量％ 氰化乙烯基化合物，其中橡胶增强苯乙烯树脂分散在聚碳酸酯树脂中。
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