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公开(公告)号：KR1020100051467A
公开(公告)日：2010-05-17
申请号：KR1020080110640
申请日：2008-11-07
Applicant: 제일모직주식회사
IPC: C08K5/3467 , C08K5/46 , C08L63/00 , C08K3/00
CPC classification number: C08K5/3467 , C08K3/013 , C08K3/36 , C08K5/13 , C08K5/46 , C08L63/00 , H01L23/29
Abstract: PURPOSE: An epoxy resin composition and the semiconductor device using thereof are provided to improve the reliability of a semiconductor package by enhancing the adhesion force with various lead frames. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor device contains an epoxy resin, a hardener, a curing accelerator, an inorganic filler, and an adhesion increaser. The adhesion increaser contains a triazole system compound marked as chemical formula 1, and a thiadiazole system compound marked as chemical formula 2. In the chemical formula 1, R1 is selected from the group consisting of a hydrogen atom, an amino group, a hydroxyl group, and a hydrocarbon group with the carbon number of 1~8.
Abstract translation: 目的：提供一种环氧树脂组合物及其使用的半导体器件，以通过增强与各种引线框架的粘附力来提高半导体封装的可靠性。 构成：用于封装半导体器件的环氧树脂组合物含有环氧树脂，硬化剂，固化促进剂，无机填料和增粘剂。 粘附增加剂含有标记为化学式1的三唑系化合物和标记为化学式2的噻二唑系化合物。在化学式1中，R 1选自氢原子，氨基，羟基 ，碳数为1〜8的烃基。
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公开(公告)号：KR1020090068443A
公开(公告)日：2009-06-29
申请号：KR1020070136055
申请日：2007-12-24
Applicant: 제일모직주식회사
IPC: H01L23/29
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: An epoxy resin composition for encapsulating a semiconductor device is provided to improve adhesion with various members such as semiconductor chips and lead frames by using glycol di(3-mercaptopropionate) as an adhesive strength improver and to improve crack resistance in mounting an substrate. An epoxy resin composition for encapsulating a semiconductor device comprises an epoxy resin, hardener, curing accelerator, adhesive strength improver and inorganic filler. The adhesive strength improver is glycol di(3-mercaptopropionate) represented by chemical formula 1: HSCH2CH2COOCH2CH2COOCH2CH2SH. The glycol di(3-mercaptopropionate) is used in the amount of 0.001~0.5 weight% based on the whole epoxy resin composition.
Abstract translation: 提供一种用于封装半导体器件的环氧树脂组合物，以通过使用二醇二（3-巯基丙酸酯）作为粘合强度改进剂来提高与诸如半导体芯片和引线框架的各种部件的粘合性，并提高了在安装基板时的抗裂纹性。 用于封装半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，固化促进剂，粘合强度改进剂和无机填料。 粘合强度改进剂是由化学式1表示的二醇二（3-巯基丙酸酯）：HSCH2CH2COOCH2CH2COOCH2CH2SH。 二醇二（3-巯基丙酸酯）的使用量相对于全部环氧树脂组合物为0.001〜0.5重量％。
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公开(公告)号：KR100882541B1
公开(公告)日：2009-02-12
申请号：KR1020070141347
申请日：2007-12-31
Applicant: 제일모직주식회사
Abstract: An epoxy resin composition for encapsulating a semiconductor device is provided to ensure excellent flame retardancy without the use of a halogen-based flame retardant, and to improve moldability and reliability by using a deoxybenzoin-based polyarylate as a flame retardant. An epoxy resin composition for encapsulating a semiconductor device comprises epoxy resin, curing agent, curing accelerator, inorganic filler and flame retardant. The flame retardant is a deoxybenzoin-based polyarylate indicated as the chemical formula 1. In the chemical formula 1, the average of n is 10-100. The deoxybenzoin-based polyarylate has the average molecular weight of 10,000~30,000 and is used in the amount of 0.01~10 weight% based on the total epoxy resin composition.
Abstract translation: 提供用于封装半导体器件的环氧树脂组合物，以确保优异的阻燃性而不使用卤素系阻燃剂，并且通过使用脱氧苯偶姻系聚芳酯作为阻燃剂，提高成型性和可靠性。 用于封装半导体器件的环氧树脂组合物包括环氧树脂，固化剂，固化促进剂，无机填料和阻燃剂。 阻燃剂是以化学式1表示的基于脱氧苯偶姻的多芳基化合物。在化学式1中，n的平均值为10-100。 基于脱氧苯偶姻的多芳基化合物的平均分子量为10,000〜30,000，相对于总环氧树脂组合物，其使用量为0.01〜10重量％。
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公开(公告)号：KR100826105B1
公开(公告)日：2008-04-29
申请号：KR1020060134135
申请日：2006-12-26
Applicant: 제일모직주식회사
Abstract: 본 발명은 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것으로, 보다 상세하게는 사전 도금된 프레임(Pre-Plated frame) 및 은 도금된(Ag plated) 패드 면에 대한 부착력을 향상시키기 위하여 화학식 1의 구조를 갖는 트리아졸(triazole)계 화합물을 사용하는 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것이다.
본 발명의 에폭시 수지 조성물은 사전 도금된 프레임 및 은 도금된 패드 면에 있어서의 부착력을 향상시켜 신뢰도를 높임과 동시에 별도의 할로겐계, 삼산화 안티몬 등의 난연제를 사용하지 않아도 우수한 난연성이 확보되므로 수지 밀봉형 반도체 소자 제조에 유용하다.
트리아졸계 화합물, 사전 도금, 은 도금, 부착력, 신뢰도, 난연성, 반도체 소자Abstract translation: 本发明涉及一种用于半导体器件中，为了提高预镀帧（预镀帧）和粘附于镀垫密封，更具体地说，涉及上述通式（1）的结构表面的环氧树脂组合物（镀银） 使用具有含环氧基的环氧基的三唑类化合物。
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公开(公告)号：KR1020070068298A
公开(公告)日：2007-06-29
申请号：KR1020060134172
申请日：2006-12-26
Applicant: 제일모직주식회사
Abstract: Provided is an epoxy resin composition for encapsulating a semiconductor, which improves an adhesion to a pre-plated frame, ensures excellent flame retardancy even if a separate flame retardant is not used, and thus is useful for manufacturing resin-sealed semiconductor devices. The epoxy resin composition for encapsulating a semiconductor comprises a coupling agent having a structure of a formula 1 of (R_1O)_n-M-(OMR_2Y)_4-n and a triazole-based compound having a structure of a formula 2. In the formula 1, M is a tetravalent titanium or zirconium, R1 is a C1-12 alkyl group, R2 is any one selected from -(CH2)n-(wherein, n is an integer of 1-8), a formula 3, X and Y are any one selected from acryl, methacryl, mercapto, and amino groups, and n is an integer of 1-3. R1 is any one selected from a hydrogen atom, a mercapto group, an amino group, a hydroxyl group, and C1-8 hydrocarbon chains.
Abstract translation: 本发明提供一种用于密封半导体的环氧树脂组合物，即使不使用单独的阻燃剂，也能够提高对预镀框架的粘合性，因此可用于制造树脂密封型半导体装置。 用于封装半导体的环氧树脂组合物包括具有式（1）的（R 1 O）n-M-（OMR 2 Y）4-n的结构的偶联剂和具有式2的结构的三唑基化合物。在式 1，M为四价钛或锆，R1为C1-12烷基，R2为选自 - （CH2）n-（其中n为1-8的整数），式3，X及 Y是选自丙烯酰基，甲基丙烯酰基，巯基和氨基的任何一个，n是1-3的整数。 R1是选自氢原子，巯基，氨基，羟基和C1-8烃链中的任意一种。
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Patent Agency Ranking
公开(公告)号：KR100611457B1
公开(公告)日：2006-08-09
申请号：KR1020030100330
申请日：2003-12-30
Applicant: 제일모직주식회사
IPC: C08L63/04
Abstract: 본 발명은 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것으로, 보다 상세하게는 (1) 에폭시 수지, (2) 경화제, (3) 경화 촉진제 및 (4) 무기 충전제를 포함하는 에폭시 수지 조성물에 있어서, 상기 (1) 에폭시 수지로서 분자 중에 노볼락 구조의 페놀류 화합물과 4,4'-디히드록시 비페닐(dihydroxy biphenyl)의 혼합물을 글리시딜 에테르화시켜 얻어지는 변성 에폭시 수지를 사용하는 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것이다. 본 발명의 에폭시 수지 조성물은 반도체 소자 패키지 성형시 고유동 특성을 나타내며, 수분의 흡수가 낮고 내열성이 우수할 뿐만 아니라 별도의 할로겐계, 삼산화 안티몬 등의 난연제를 사용하지 않아도 우수한 난연성이 확보되므로 수지 밀봉형 반도체 소자 제조에 유용하다.
반도체 소자, 비페닐(biphenyl) 유도체, 변성 에폭시 수지, 난연성, 고유동성-
公开(公告)号：KR101266534B1
公开(公告)日：2013-05-23
申请号：KR1020080110640
申请日：2008-11-07
Applicant: 제일모직주식회사
IPC: C08K5/3467 , C08K5/46 , C08L63/00 , C08K3/00
Abstract: 본발명의에폭시수지조성물은사전도금된프레임(Pre-Plated frame) 및은 도금된(Ag plated) 패드면에있어서의부착력을향상시켜반도체소자의신뢰도를높임과동시에별도의할로겐계, 삼산화안티몬등의난연제를사용하지않아도우수한난연성이확보되므로수지밀봉형반도체소자제조에유용하다.
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公开(公告)号：KR1020090070138A
公开(公告)日：2009-07-01
申请号：KR1020070138033
申请日：2007-12-26
Applicant: 제일모직주식회사
IPC: H01L23/29
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: An epoxy resin composition for encapsulating a semiconductor device is provided to maintain excellent fluidity and heat conductivity, to improve adhesive property with various lead frames, and to secure high reliability. An epoxy resin composition for encapsulating a semiconductor device includes an epoxy resin, hardener, curing accelerator, adhesion improver and inorganic filler. The adhesion improver uses a triazole-based compound represented by chemical formula I. The inorganic filler comprises spherical crystalline silica. The triazole-based compound is used in the amount of 0.01~2 weight% based on the whole epoxy resin composition. The epoxy resin comprises a phenol aralkyl type epoxy resin represented by chemical formula II or a biphenyl type epoxy resin represented by chemical formula III.
Abstract translation: 提供用于封装半导体器件的环氧树脂组合物以保持优异的流动性和导热性，以改善各种引线框架的粘合性能，并确保高可靠性。 用于封装半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，固化促进剂，粘合改进剂和无机填料。 粘合改进剂使用由化学式I表示的三唑类化合物。无机填料包括球形结晶二氧化硅。 基于全部环氧树脂组合物，三唑类化合物的使用量为0.01〜2重量％。 环氧树脂包括由化学式II表示的苯酚芳烷基型环氧树脂或由化学式III表示的联苯型环氧树脂。
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公开(公告)号：KR100686886B1
公开(公告)日：2007-02-26
申请号：KR1020050130742
申请日：2005-12-27
Applicant: 제일모직주식회사
Abstract: An epoxy resin composition for sealing semiconductor device is provided to accomplish excellent flame retardancy, moldability and reliability while not generating by-products harmful to human and environment. The epoxy resin composition for sealing a semiconductor device comprises an epoxy resin, a curing agent, a curing accelerator, an inorganic filling agent and a flame retardant, wherein the flame retardant comprises a muscovite-containing compound represented by the formula 1: K(OHF2)2A13Si3O10. Preferably, the epoxy resin comprises a poly-aromatic epoxy resin represented by the formula 2, and the curing agent comprises a poly-aromatic phenol resin represented by the formula 3, wherein an average of n is 1 to 7.
Abstract translation: 提供一种用于密封半导体器件的环氧树脂组合物，以实现优异的阻燃性，成型性和可靠性，同时不产生对人体和环境有害的副产物。 用于密封半导体器件的环氧树脂组合物包含环氧树脂，固化剂，固化促进剂，无机填充剂和阻燃剂，其中所述阻燃剂包含由式1表示的含白云母的化合物：K（OHF 2 ）2A13Si3O10。 优选地，环氧树脂包含由式2表示的聚芳族环氧树脂，并且固化剂包含由式3表示的多芳族酚树脂，其中n的平均值为1至7。
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公开(公告)号：KR100673630B1
公开(公告)日：2007-01-24
申请号：KR1020050135935
申请日：2005-12-30
Applicant: 제일모직주식회사
Abstract: Provided is an epoxy resin composition for encapsulating semiconductor devices, which improves adhesiveness with a pre-plated lead frame, and thus enhances reliance of semiconductor package. The epoxy resin composition for encapsulating semiconductor devices comprises a cyanurate-based silane coupling agent represented by the following formula 1, wherein R1 is a C1-3 alkoxy group. A content of the epoxy resin composition is 0.01-1wt% based on the total epoxy resin composition. The cyanurate-based silane coupling agent is used in combination with at least one selected from the group consisting of an epoxy silane coupling agent, a mercapto silane coupling agent, an amine-based silane coupling agent, and a methyl trimethoxy silane coupling agent.
Abstract translation: 提供了一种用于封装半导体器件的环氧树脂组合物，其改善了与预镀引线框架的粘合性，从而增强了半导体封装的依赖性。 用于封装半导体器件的环氧树脂组合物包括由下式1表示的基于氰脲酸酯的硅烷偶联剂，其中R1是C1-3烷氧基。 环氧树脂组合物的含量相对于总环氧树脂组合物为0.01〜1重量％。 氰尿酸酯系硅烷偶联剂与选自环氧硅烷偶联剂，巯基硅烷偶联剂，胺类硅烷偶联剂和甲基三甲氧基硅烷偶联剂中的至少一种组合使用。
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