Abstract:
PURPOSE: A positive type photo-sensitive resin composition is provided to improve patter shapes by including polybenzoxazole precursors, photo-sensitive diazoquinone compounds, silane compounds, phenol compounds, and a solvent. CONSTITUTION: A positive type photo-sensitive resin composition includes polybenzoxazole precursors, photo-sensitive diazoquinone compounds, silane compounds, phenol compounds, and a solvent. The polybenzoxazole precursors include repeating units represented by chemical formula 1. In chemical formula 1, X1 and X2 are respectively aromatic organic groups or tetravalent to hexavalent aliphatic organic groups; Y1 is an aromatic organic group or a divalent to hexavalent organic group; R1 and R2 are respectively C1 to C6 alkylene groups; and R3 is a C1 to C6 alkyl group.
Abstract:
PURPOSE: A positive type photo-sensitive resin composition, a photo-sensitive resin film, and a semiconductor device using the same are provided to obtain the resin film with the superior heat resistance characteristic and maintain the mechanical characteristic of the resin film regardless of hardening temperature. CONSTITUTION: A positive type photo-sensitive resin composition includes polybenzoxazole precursor, a photo-sensitive diazoquinone compound, a bis-benzocyclobutene compound or a polymer obtained from a thermal cross-linking process with respect to the bis-benzocyclobutene compound, and a solvent. The polybenzoxazole precursor includes a repeating unit represented by chemical formula 1 and a repeating unit represented by chemical formula 2. The bis-benzocyclobutene compound is represented by chemical formula 3. In the chemical formulas 1 and 2, the X1 and the X2 are respectively aromatic organic groups. The Y1 is an alicyclic organic group with the double bond or an aliphatic organic group with the double bond. The Y2 is alicyclic organic group or an aliphatic organic group. In the chemical formula 3, the X3 is selected from a group including hetero atom substituted or non-substituted aromatic organic group, alicyclic organic group, aliphatic organic group, and the combination of the same.
Abstract:
PURPOSE: A positive type photosensitive resin composition is provided to improve the pattern forming property and the sensitivity by including a polyimide precursor, a photo-sensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. CONSTITUTION: A positive type photosensitive resin composition includes a polyimide precursor, a photo-sensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. The polyimide precursor includes a repeating unit represented by chemical formula 1 and a repeating unit represented by chemical formula 2. In the polyimide precursor, the 5 to 50 mol% of the repeating unit represented by chemical formula 1 and 50 to 95 mol% of the repeating unit represented by chemical formula 2.
Abstract:
수분흡수력을 억제할 수 있고, 분자 내 다중산의 농도를 줄일 수 있으며, 분자간의 응집현상을 줄여 박막 특성 및 저장안정성이 우수할 뿐만 아니라 유기 광전소자의 효율 특성 및 수명 특성을 향상시킬 수 있는 전도성 고분자 중합체가 제공된다. 본 발명에 따른 전도성 고분자 중합체는 전도성 고분자에 하기 화학식 1로 표시되는 다중산 공중합체가 도핑되어 있는 것을 특징으로 한다.
또한, 이를 이용한 전도성 고분자 공중합체 조성물, 유기광전소자도 함께 제공된다. 전도성, 고분자, 다중산, 도핑, 조성물
Abstract:
(A) 하기 화학식 1로 표시되는 반복단위, 하기 화학식 2로 표시되는 반복단위, 또는 이들의 조합을 포함하고, 적어도 한 쪽의 말단 부분에 열중합성 관능기를 갖는 폴리벤조옥사졸 전구체, (B) 감광성 디아조퀴논 화합물, (C) 실란 화합물, (D) 가교성 관능기를 가지는 페놀 화합물 및 (E) 용매를 포함하는 포지티브형 감광성 수지 조성물을 제공한다. [화학식 1]
[화학식 2]
상기 화학식 1 및 2에서, X 1 , X 2 , Y 1 및 Y 2 는 명세서에서 정의한 바와 같다.
Abstract:
하기 화학식 1로 표시되는 반복 단위 및 하기 화학식 2로 표시되는 반복 단위를 포함하는 폴리벤조옥사졸 전구체(polybenzoxazole precursor); 감광성 디아조퀴논 화합물; 하기 화학식 3으로 표시되는 비스-벤조시클로부텐 화합물 또는 비스-벤조시클로부텐 화합물을 열가교한 중합체; 및 용매를 포함하는 포지티브형 감광성 수지 조성물을 제공한다. [화학식 1]
[화학식 2]
[화학식 3]
(상기 화학식 1 내지 3에서, X 1 , X 2 , X 3 , Y 1 및 Y 2 는 상세한 설명에 기재된 바와 같다.) 비스-벤조시클로부텐 화합물, 페놀 화합물, 실란 화합물, 디아조퀴논 화합물, 포지티브형, 감광성 수지 조성물