公开(公告)号：KR1020130069160A

公开(公告)日：2013-06-26

申请号：KR1020110136744

申请日：2011-12-16

Applicant: 제일모직주식회사

Inventor： 박창원 ,  최종학 ,  심재준 ,  정명학 ,  이낙원 ,  김용현

IPC: H01B1/20 ,  H01L23/52

CPC classification number: H01L24/82 ,  H01L24/73 ,  H01L2224/24 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PURPOSE: A conductive paste for bonding semiconductor chips is provided to replace wiring boding of high costs, to have excellent productivity and durability, and to have excellent reliability and coupling rate. CONSTITUTION: A conductive paste for bonding semiconductor chips comprises a conductive powder and binder. The binder includes 30-65 wt% of an epoxy-based binder, 10-50 wt% of an acrylic binder, and 5-30 wt% of an elastomer-based binder. The glass transition temperature of the elastomer-based binder is (-80) - (-10)°C. The bonding method of the semiconductor includes the chip pad and substrate pad-bonding method by forming pattern between a chip pad(10) and a substrate pad(21).

Abstract translation: 目的：提供一种用于接合半导体芯片的导电膏，以替代高成本的布线布线，具有优异的生产率和耐久性，并且具有优异的可靠性和耦合率。 构成：用于接合半导体芯片的导电膏包括导电粉末和粘合剂。 粘合剂包括30-65重量％的环氧基粘合剂，10-50重量％的丙烯酸粘合剂和5-30重量％的基于弹性体的粘合剂。 弹性体类粘合剂的玻璃化转变温度为（-80）〜（-10）℃。 半导体的接合方法包括通过在芯片焊盘（10）和衬底（21）之间形成图案的芯片焊盘和衬底焊盘接合方法。