Abstract:
PURPOSE: An electrode paste compostion is provided to have excellent adhesion, to reduce edge curl after plastification, and to minimize the generation of undercut. CONSTITUTION: An electrode paste compostion comprises a conductive material, an organic binder, glass frit, a cross linking agent, and an initiator. The organic binder comprises urethane (meth)acrylate resin. The amount of the urethane (meth)acrylate resin is 15-35 weight% in total electrode paste composition, based on solid phase. The urethane (meth)acrylate resin is a copolymer of glycol comprising bifunctional or trifunctional hydroxy groups, an isocyanate compound comprising comprising bifunctional or trifunctional hydroxy groups, and a (meth)acrylic monomer comprising a hydroxyl group and a vinyl group.
Abstract:
본 발명의 전극 형성용 조성물은 (a) 전도성 분말, (b) 유기바인더 및 (c) 유리 프릿을 포함하며, 상기 유리 프릿(c)은 (c1)알칼리가 함유되지 않은 무알칼리 유리프릿; 및 (c2) 알칼리 함유량이 0초과 3 중량% 이하인 저알칼리 유리 프릿 및 (d) 용매를 포함하는 것을 특징으로 한다. 상기 전극 형성용 조성물을 적용한 플라즈마 디스플레이 패널의 버스 전극은 황변현상 및 에지컬이 개선된다.
Abstract:
PURPOSE: A conductive paste for bonding semiconductor chips is provided to replace wiring boding of high costs, to have excellent productivity and durability, and to have excellent reliability and coupling rate. CONSTITUTION: A conductive paste for bonding semiconductor chips comprises a conductive powder and binder. The binder includes 30-65 wt% of an epoxy-based binder, 10-50 wt% of an acrylic binder, and 5-30 wt% of an elastomer-based binder. The glass transition temperature of the elastomer-based binder is (-80) - (-10)°C. The bonding method of the semiconductor includes the chip pad and substrate pad-bonding method by forming pattern between a chip pad(10) and a substrate pad(21).
Abstract:
PURPOSE: A composition for plasma display and plasma display panel including electrode which is formed there from are provided to improve discoloration and to prevent edge curl. CONSTITUTION: A composition for plasma display comprises 40-90 weight% of conductive powder, 0.1-20 weight% of organic binder, 1-20 weight% of glass frit, and remnant solvent. The glass frit comprises non-alkali fiber glass frit and low-alkali glass frit. The low-alkali glass frit contains less than 3% of alkali. In the glass frit, a ratio of the low-alkali glass frit to the non-alkali fiber glass frit is 1: 1-5. The conductive powder comprises one or more of silver (Ag), gold (Au), palladium (Pd), platinum (Pt), copper (Cu), chrome (Cr), cobalt (Co), aluminum (Al), tin (Sn), lead (Pb), zinc (Zn), iron (Fe), iridium (Ir), osmium (Os), rhodium (Rh), tungsten (W), molybdenum (Mo), nickel and ITO (indium-Tin-Oxide). The organic binder comprises one or more of urethane (meta) acrylate resin and Acryl resin.
Abstract:
본 발명은 흑색 안료; 유리 프릿; 유기 바인더; 광중합성 모노머; 광중합 개시제; 및 유기 용매;를 포함하고, 상기 유기 바인더는 비스페놀계 에폭시 아크릴레이트계 수지를 포함하는 플라즈마 디스플레이 패널 전극용 감광성 슬러리 조성물에 관한 것으로, 상기 감광성 슬러리 조성물로 제조된 흑색층의 패턴은 우수한 패턴 해상도(pattern resolution)를 가지며, 블리스터링(blistering) 효과를 최소화할 수 있다.