이방 도전성 페이스트, 필름 및 이를 포함하는 회로접속구조체
    2.
    发明公开
    이방 도전성 페이스트, 필름 및 이를 포함하는 회로접속구조체 有权
    各向异性导电胶片和电路,连接包括其的结构体

    公开(公告)号:KR1020110074321A

    公开(公告)日:2011-06-30

    申请号:KR1020090131246

    申请日:2009-12-24

    Abstract: PURPOSE: An anisotropic conductive paste and an anisotropic conductive film are provided to improve current resistance in connection. CONSTITUTION: An anisotropic conductive film(100) comprises an insulating binder(110), and conductive particles(120) which are dispersed in the insulating binder. The conductive particles contain copper core particles and a metal layer coated on the surface of the copper core particles. The anisotropic conductive film contains 99.9-80 weight parts of binder and 0.1-20 weight parts of organic resin and conductive particles. The coated metal layer contains silver-coated layer.

    Abstract translation: 目的:提供各向异性导电膏和各向异性导电膜以提高连接中的电流电阻。 构成:各向异性导电膜(100)包括绝缘粘合剂(110)和分散在绝缘粘合剂中的导电颗粒(120)。 导电颗粒含有铜芯颗粒和涂覆在铜芯颗粒表面上的金属层。 各向异性导电膜含有99.9-80重量份的粘合剂和0.1-20重量份的有机树脂和导电颗粒。 涂覆的金属层包含银涂层。

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