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    씨엠피장비의 슬러리 공급 노즐
    1.
    发明授权
    씨엠피장비의 슬러리 공급 노즐 失效
    씨엠피장비의슬러리공급급

    公开(公告)号：KR100744099B1

    公开(公告)日：2007-08-01

    申请号：KR1020060033371

    申请日：2006-04-12

    Applicant: 조선대학교산학협력단

    Inventor： 이우선 ,  고필주 ,  김남훈 ,  서용진

    IPC: H01L21/02 ,  H01L21/304

    Abstract: A slurry supply nozzle for chemical mechanical polishing equipment is provided to enhance the polishing rate of an object by using the hot slurry. A slurry supply nozzle(10) is communicated with a pump for circulating slurry so that it supplies the slurry onto a pad. A temperature sensor(12) is mounted on the nozzle to detect a temperature of the slurry supplied to the nozzle, and a heat coil(14) is wound around an outer periphery of the nozzle to heat the slurry so that the hot slurry is supplied on the pad attached to a polishing table(30). The temperature sensor and the heat wire are controlled by a controller(16).

    Abstract translation: 提供用于化学机械抛光设备的浆料供应喷嘴，以通过使用热浆料来提高物体的抛光速率。 浆料供应喷嘴（10）与用于循环浆料的泵连通，以便将浆料供应到垫上。 温度传感器（12）安装在喷嘴上以检测供应到喷嘴的浆液的温度，并且加热线圈（14）缠绕在喷嘴的外周边上以加热浆液，从而供应热浆液 在连接到抛光台（30）的垫上。 温度传感器和加热丝由控制器（16）控制。

    스핀코터용 진공척
    3.
    发明授权
    스핀코터용 진공척 失效
    스핀코터용진공척

    公开(公告)号：KR100744102B1

    公开(公告)日：2007-08-01

    申请号：KR1020060033370

    申请日：2006-04-12

    Applicant: 조선대학교산학협력단

    Inventor： 이우선 ,  고필주 ,  김남훈

    IPC: H01L21/687 ,  H01L21/208

    Abstract: A vacuum chuck for a spin coater is provided to suck a wafer by distributing vacuum and deposit various sizes of waves by using one vacuum chuck. A plate-type vacuum suction plate(20) is provided on a rotary plate(10) which is fixed to a shaft of a vacuum chuck. The vacuum suction plate has at least one vacuum port(22) at its center portion, and a pair of auxiliary vacuum suction ports(24) penetrating the plate. A vacuum adjusting plate(30) is installed in the rotary plate to open/close an auxiliary suction port(24) of the vacuum suction plate. The vacuum adjusting plate has an opening surface(32), a first closing surface and a second closing surface(36).

    Abstract translation: 提供用于旋涂机的真空卡盘以通过使用一个真空吸盘分配真空并沉积各种尺寸的波来吸附晶片。 在固定在真空卡盘的轴上的旋转盘（10）上设置有板状的真空吸附板（20）。 真空吸板在其中心部分具有至少一个真空口（22），以及穿透该板的一对辅助真空抽吸口（24）。 真空调节板（30）安装在旋转板中以打开/关闭真空吸板的辅助吸入口（24）。 真空调节板具有开口表面（32），第一封闭表面和第二封闭表面（36）。

    화학적 기계 연마장치용 웨이퍼 홀더
    4.
    发明公开
    화학적 기계 연마장치용 웨이퍼 홀더 无效
    CMP机床用保持架

    公开(公告)号：KR1020100137278A

    公开(公告)日：2010-12-30

    申请号：KR1020090055620

    申请日：2009-06-22

    Applicant: 조선대학교산학협력단

    Inventor： 이우선 ,  고필주

    IPC: H01L21/683 ,  H01L21/304

    CPC classification number: B24B41/06 ,  B24B37/04 ,  H01L21/68714

    Abstract: PURPOSE: A water holder for a CMP machine is provided to polish a plurality of wafers and suppress wafer waste by holding and polishing a smaller wafer than an absorption area required in an absorption head. CONSTITUTION: A base substrate is held by the absorption of an absorption head. A wafer holder(10) is used by the absorption of an absorption head(120) of a chemical and mechanical polishing device. An absorption head has an absorption path on the bottom and vacuum-absorbs the wafer holder. The wafer holder includes a base substrate(11), an adhesive pad(13), and a restriction plate(15).

    Abstract translation: 目的：提供一种用于CMP机器的保持器，用于抛光多个晶片并通过保持和抛光比吸收头中所需的吸收区域更小的晶片来抑制晶片废料。 构成：通过吸收头的吸收来保持基底。 通过吸收化学和机械抛光装置的吸收头（120）来使用晶片保持器（10）。 吸收头在底部具有吸收路径，并且真空吸收晶片保持器。 晶片保持器包括基底（11），粘合垫（13）和限制板（15）。

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