Abstract:
Disclosed is a metal oxide composition containing a dispersing agent (A) represented by the general formula (1) below and a metal oxide having an average primary particle diameter of 5-100 nm. [chemical formula 1] (1) (In the formula, R1-R4 independently represent a hydrogen atom or a methyl group; R5-R8 independently represent an unsubstituted or substituted straight or branched chain alkyl group or alkylene oxyalkylene group; and R9 represents a tetravalent aromatic group or aliphatic group.) Also disclosed are a cured film obtained by curing this metal oxide composition, and a laminate thereof.
Abstract:
PURPOSE: A photosensitive resin composition, a manufacturing method of cured products, photo solder resist ink, a dry film style photo solder resist, and a photosensitive resin are provided to enhance photosensitivity for an active energy ray. CONSTITUTION: A photosensitive resin composition comprises a photosensitive resin, an epoxy group-containing compound, a deblocking isocyanate group-containing compound, one or more a compound selected from a group consisting of beta-hydroxyalkyl amide group-containing compound and a blocking isocyanate group-containing compound, and a photopolymerization initiator. The photosensitive resin is a hydroxyl group containing photosensitive resin.
Abstract:
하기 일반식 (1)로 표시되는 분산제(A), 및 평균 일차 입자지름이 5~100nm인 금속산화물을 함유하는 것을 특징으로 하는 금속산화물 조성물; 일반식 (1): [화학식 1]
(식 중, R 1 ~R 4 는 각각 독립적으로 수소원자 또는 메틸기를 나타내고, R 5 ~R 8 은 각각 독립적으로 비치환 혹은 치환의, 직쇄 혹은 분기쇄의 알킬렌기 또는 알킬렌옥시알킬렌기를 나타내고, R 9 는 4가의 방향족기 또는 지방족기를 나타낸다.) 및 이 금속산화물 조성물을 경화하여 이루어지는 경화막과 그 적층체를 개시한다. 분산제, 금속산화물, 조성물, 경화막, 적층체, 반도체 소자 밀봉재, 분산체