公开(公告)号：KR1019960008357B1

公开(公告)日：1996-06-24

申请号：KR1019890014853

申请日：1989-10-16

Applicant: 파나소닉 주식회사

Inventor： 카베시타아끼라 ,  하마네도쿠히토 ,  키타야마요시후미

IPC: H01L21/50 ,  H05K1/18 ,  H01G4/12 ,  H01C1/012

CPC classification number: H01G2/065 ,  H01C17/006 ,  H01G4/232 ,  H05K3/3442 ,  H05K3/4092 ,  H05K2201/09154 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A chip type electronic component includes a main body having opposite first and second end surfaces and a lower surface defining a first plane. First and second electrode portions are respectively connected to the first and second end surfaces of the main body. Each of the first and second electrode portions includes a lower surface. Each lower surface of the first and second electrode portions includes a first planar face extending adjacent the main body in a second plane which is parallel to the first plane defined by the main body, and a second planar face extending adjacent the first planar face in a third plane which extends upwardly at an angle relative the second plane away from the main body. Accordingly, upon mounting of the chip type electronic component to a planar circuit board, a space is provided between the second planar face of each of the first and second electrode portions for accommodating solder materials.

公开(公告)号：KR1019900007096A

公开(公告)日：1990-05-09

申请号：KR1019890014853

申请日：1989-10-16

Applicant: 파나소닉 주식회사

Inventor： 카베시타아끼라 ,  하마네도쿠히토 ,  키타야마요시후미

IPC: H01L21/50 ,  H05K1/18 ,  H01G4/12 ,  H01C1/012

公开(公告)号：KR100107338B1

公开(公告)日：1996-11-06

申请号：KR1019890014853

申请日：1989-10-16

Applicant: 파나소닉 주식회사

Inventor： 카베시타아끼라 ,  하마네도쿠히토 ,  키타야마요시후미

IPC: H01L21/50 ,  H05K1/18 ,  H01G4/12 ,  H01C1/012