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公开(公告)号:KR1020010009445A
公开(公告)日:2001-02-05
申请号:KR1019990027808
申请日:1999-07-09
Applicant: 학교법인연세대학교
IPC: H01L21/20
Abstract: PURPOSE: A method for forming a thin film using an interface layer is provided to be capable of prohibiting generation of silicide. CONSTITUTION: An interface layer(111) including oxide silicon is formed on the surface of a substrate(101) including silicon. Gas of deposition material is injected to grow a thin film(103) including the deposition material on the interface layer(111), with the substrate at a high vacuum state. At this time, the interface layer(111) functions as a buffer for controlling interactive reaction forces of the substrate(101) and the thin film(103).
Abstract translation: 目的:提供一种使用界面层形成薄膜的方法,以能够禁止产生硅化物。 构成:在包括硅的衬底(101)的表面上形成包括氧化物硅的界面层(111)。 注入沉积材料的气体以在基板处于高真空状态下生长包含沉积材料的界面层(111)上的薄膜(103)。 此时,界面层(111)作为用于控制基板(101)和薄膜(103)的交互反作用力的缓冲器起作用。