Abstract:
PURPOSE: A method for preparing organic and inorganic nanocomposites is provided to ensure simple process and good profitability and to control thermal characteristics of organic and inorganic nanocomposites by differing from the kind of primary amines. CONSTITUTION: A method for preparing organic and inorganic nanocomposites comprises a resin represented by chemical formulas 1-3 and at least one kind of metal particles in which metal particles are uniformly dispersed within the resin. In chemical formulas, R^1, R^2, R^3, R^4 and R^5 are hydrogen or C1-20 linear or branched saturated or unsaturated hydrocarbon; E is C1-20 linear or branched saturated or unsaturated hydrocarbon-based chain; and n and m are an integer of 1 or more and less than 1,000,000.
Abstract:
PURPOSE: A manufacturing method of a conductive film and the conductive film are provided to simply manufacture the conductive film by mixing carbon nanotubes and a metal wire, and to improve the conductivity and the durability of the film. CONSTITUTION: A manufacturing method of a conductive film(100) comprises the following steps: pre-treating carbon nanotubes(121) by cutting with a ultrasonic wave or reacting with acid; dispersing the carbon nanotubes to a solvent; mixing a metal wire(122) with the carbon nanotube dispersed solution; and forming an electrode layer(120) by coating the carbon nanotube dispersed solution to a substrate(110).
Abstract:
본 발명은 하이브리드 필러를 이용한 전도성 접착제 및 이의 제조방법에 관한 것으로 고분자 매트릭스, 전도성 필러 및 비전도성 필러를 포함하는 것으로서, 상기 전도성 필러의 함량은 전도성 필러 총 부피부에 대하여 1 부피부의 비전도성 필러를 함유한 상태를 기준으로 전도성이 발현되지 않는 시점인 1x10 4 Ω㎝의 저항값을 갖는 함량보다 미만인 함량이며, 상기 비전도성 필러의 함량은 상기 전도성 함량 내에서 전도성이 발현되는 1x10 -2 Ω㎝이하의 저항값을 갖는 함량을 포함함으로써, 전도성 필러를 단독으로 사용하여 제조된 종래의 전도성 접착제에 비하여 적은 함량의 전도성 필러를 포함함에도 불구하고 종래의 전도성 접착제와 유사한 전도성을 갖는다.
Abstract:
The present invention relates to a conductive adhesive using hybrid fillers and a fabrication method thereof. The conductive adhesive comprises a polymer matrix, a conductive filer and a non-conductive filer. The content of the conductive filer based on a condition, in which 1 parts by volume of the non-conductive filer is contained on the basis of the total parts by volume of the conductive filer, is less than the content having the resistance value of 1x104Ωcm, wherein conductivity is not expressed. The content of the non-conductive filer is less than the content having the resistance value of 1x10-2Ωcm, wherein conductivity is expressed within the content of the conductive filer. Accordingly, the conductive adhesive has conductivity similar to the existing conductive adhesive despite containing the conductive filer of the content which is less in comparison with the existing conductive adhesive manufactured by using the conductive filer alone. [Reference numerals] (AA,BB) Resistance value (廓cm);(CC) Content of silver;(DD) Example 1;(EE) Example 2;(FF) Example 3;(GG) Example 4;(HH) Content of silica particles (SiO_2)
Abstract:
An epoxy resin - barium titanate composite is provided to suppress the percolation due to the contact between batio3 molecules by mixing ceramic particle surface-treated with an organic dispersing agent and a polymer resin. An epoxy resin - barium titanate composite comprises barium titanate surface-treated with an organic dispersing agent. The organic dispersing agent is selected from the group consisting of polystyrene having a maleic anhydride or acrylic acid at the end, a block type copolymer of maleic anhydride or acrylic acid and polystyrene, and sulfonated polystyrene at a main chain.
Abstract:
본 발명은 비전도성 필러를 이용한 공간 제어에 의해 전도성 필러의 함량을 낮추는 전기전도성 접착제 및 그 제조방법에 관한 것이다. 본 발명에 따른 접착제는 전도성 필러와 열적 또는 물리적 특성을 갖는 비전도성 필러를 같이 분산시켜 낮은 농도의 전도성 필러를 함유하면서도 높은 전기전도성을 갖고 더불어 비전도성 필러에 의한 열적 또는 물리적 특성을 추가로 갖는 것을 특징으로 한다. 또한 비전도성 필러가 고가의 전도성 필러의 함량을 낮추는 역할을 함으로써 최종적으로 접착제의 단가를 낮추는데 기여하기도 한다.
Abstract:
PURPOSE: A conductive adhesive is provided to reduce content of conductive filler which is relatively expensive, to have excellent conductivity and thermal properties by adding non-conductive filler to the conductive composite. CONSTITUTION: A conductive adhesive polymer matrix, conductive filler dispersed in the polymer matrix, silica particle non-conductive filler dispersed in the polymer matrix. The content of the conductive filler is less than a conductive critical point. The content of the non-conductive filler is higher than the conductive critical point. A manufacturing method of the conductive adhesive comprises: a step of obtaining a filler dispersion by dispersing the conductive filler and the non-conductive filler; a step of mixing the filler dispersion and the polymer matrix; and a step of removing the solvent.