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Patent Agency Ranking
公开(公告)号：KR101304467B1
公开(公告)日：2013-09-04
申请号：KR1020110138507
申请日：2011-12-20
Applicant: 한국기계연구원
CPC classification number: Y02E10/50
Abstract: 본 발명은 함몰형 금속패턴 형성방법에 관한 것으로서, 본 발명에 따른 함몰형 금속패턴 형성방법은 기판 상에 광경화성 레진층을 적층하는 광경화성 레진층 적층단계; 상기 광경화성 레진 상에 열가소성 레진층을 적층하는 열가소성 레진층 적층단계; 임프린팅(Imprinting)을 이용하여 상기 열가소성 레진층을 패터닝하는 동시에 상기 광경화성 레진층에 함몰영역이 형성되도록 하는 복합 임프린팅 단계; 상기 열가소성 레진층의 상측 및 광경화성 레진층의 함몰영역 내에 금속층을 증착하는 금속층 증착단계; 상기 열가소성 레진층 및 열가소성 레진층의 상측에 적층된 금속층을 제거하는 제거단계;를 포함하는 것을 특징으로 한다.
이에 의하여, 균일한 형태의 함몰형 금속패턴을 용이하게 제작할 수 있는 함몰형 금속패턴 형성방법이 제공된다.-
公开(公告)号：KR101425192B1
公开(公告)日：2014-08-06
申请号：KR1020120090231
申请日：2012-08-17
Applicant: 한국기계연구원
CPC classification number: Y02E10/549 , Y02P70/521
Abstract: 본 발명의 태양 전지는 기판, 기판 위에 형성되어 있는 제1 전극, 제1 전극 위에 형성되어 있으며 돌출부를 포함하는 금속산화층, 금속산화층 위에 형성되어 있는 활성층, 활성층 위에 형성되어 있는 완충층, 완충층 위에 형성되어 있는 제2 전극을 포함한다.
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公开(公告)号：KR1020140023778A
公开(公告)日：2014-02-27
申请号：KR1020120090231
申请日：2012-08-17
Applicant: 한국기계연구원
CPC classification number: Y02E10/549 , Y02P70/521 , H01L51/42
Abstract: A solar cell according to the present invention includes a substrate, a first electrode which is formed on the substrate, a metal oxide layer which is formed on the first electrode and includes a protrusion part, an active layer which is formed on the metal oxide layer, a buffer layer which is formed on the active layer, and a second electrode which is formed on the buffer layer.
Abstract translation: 根据本发明的太阳能电池包括基板，形成在基板上的第一电极，形成在第一电极上并包括突出部分的金属氧化物层，形成在金属氧化物层上的有源层 形成在有源层上的缓冲层和形成在缓冲层上的第二电极。
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公开(公告)号：KR1020130071152A
公开(公告)日：2013-06-28
申请号：KR1020110138507
申请日：2011-12-20
Applicant: 한국기계연구원
CPC classification number: Y02E10/50
Abstract: PURPOSE: A recessed metal pattern forming method is provided to easily make a recessed metal pattern by successively laminating a photopolymer resin layer and a thermoplastic resin layer. CONSTITUTION: A recessed metal pattern forming method is as follows. A thermoplastic resin layer is laminated on a photopolymer resin layer(S120). The thermoplastic resin layer is patterned. A recessed area is formed on the photopolymer resin layer(S130). A metal layer is deposited on the upper side of the thermoplastic resin layer and within the recessed area of the photopolymer resin layer(S140). The metal layer, which is laminated on the thermoplastic resin layer and on the upper side of the thermoplastic resin layer, is removed(S150). [Reference numerals] (AA) Start; (BB) End; (S110) Photopolymer resin layer laminating step; (S111) Application step; (S112) Pre-hardened step; (S120) Thermoplasticity resin layer laminating step; (S130) Complex printing step; (S131) Heating/pressurizing step; (S132) Hardening step; (S140) Metal layer laminating step; (S150) Removing step
Abstract translation: 目的：提供凹陷金属图案形成方法，通过依次层压光聚合物树脂层和热塑性树脂层来容易地形成凹陷的金属图案。 构成：凹陷金属图案形成方法如下。 在光聚合物树脂层上层压热塑性树脂层（S120）。 图案化热塑性树脂层。 在光聚合物树脂层上形成凹陷区域（S130）。 在热塑性树脂层的上侧和光聚合物树脂层的凹陷区域内沉积金属层（S140）。 除去热塑性树脂层和热塑性树脂层的上侧层叠的金属层（S150）。 （附图标记）（AA）开始; （BB）结束; （S110）光聚合物树脂层层叠工序; （S111）应用步骤; （S112）预硬化工序; （S120）热塑性树脂层层叠工序; （S130）复印机步骤; （S131）加热/加压步骤; （S132）硬化步骤; （S140）金属层层叠工序; （S150）拆卸步骤
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公开(公告)号：KR101449272B1
公开(公告)日：2014-10-08
申请号：KR1020130044343
申请日：2013-04-22
Applicant: 한국기계연구원
CPC classification number: G02B5/008 , B32B37/06 , B82Y20/00 , G09F3/10 , Y10T156/1031 , Y10T156/1041
Abstract: The present invention relates to an embedded pattern manufacturing method using a transfer-based imprinting process. The embedded pattern manufacturing method using a transfer-based imprinting process comprises: an adhesion layer laminating step of laminating an adhesion layer made up of photo-curable resins on a substrate; a stamp preparing step of preparing a stamp equipped with a protrusion pattern on which a thin film layer is deposited on an external surface; a thin layer transferring step of selectively transferring the thin layer on the protrusion pattern to the adhesion layer by pressurizing the stamp in conditions in which the thin film layer of the protrusion pattern and the adhesion layer are in contact; a hardening step of irradiating ultraviolet light so that the adhesion layer is hardened; and a releasing step of releasing the stamp, and is characterized by arranging the thin film layer transferred to an area embedded by stamp and the adhesion layer which is not pressurized by the stamp in the thin film layer transferring layer on an identical plane. Accordingly, the present invention provides the embedded pattern manufacturing method using a transfer-based imprinting process capable of manufacturing the embedded pattern of a uniform shape.
Abstract translation: 本发明涉及使用基于转印的印刷方法的嵌入图案制造方法。 使用基于转印的压印方法的嵌入图案制造方法包括：将由光固化树脂构成的粘合层层压在基板上的粘合层层压步骤; 印模准备步骤，准备装有突起图案的印模，在外表面上沉积有薄膜层; 通过在突起图案和粘合层的薄膜层接触的条件下对印模进行加压来选择性地将突起图案上的薄层转移到粘合层的薄层转印步骤; 照射紫外线使得粘附层硬化的硬化步骤; 以及释放印模的释放步骤，其特征在于将薄膜层转印到由印模嵌入的区域和在薄膜层转印层中在同一平面上未被印模加压的粘合层。 因此，本发明提供了使用能够制造均匀形状的嵌入图案的基于转印的印刷工艺的嵌入图案制造方法。
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