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公开(公告)号:KR1020130052216A
公开(公告)日:2013-05-22
申请号:KR1020110117539
申请日:2011-11-11
Applicant: 한국전자통신연구원
IPC: H01L29/786
CPC classification number: H01L29/41733 , H01L29/45 , H01L29/4908 , H01L29/78606 , H01L29/7869 , H01L29/51
Abstract: PURPOSE: A thin film transistor and a manufacturing method thereof are provided to increase the life time of the thin film transistor by including a gate insulation layer with a first inorganic layer, an organic layer, and a second inorganic layer. CONSTITUTION: A source electrode(SE) is arranged on a base member. A drain electrode(DE) is separated from the source electrode on a plane. An active layer partially overlaps with the source electrode and the drain electrode on the plane. A gate electrode(GE) partially overlaps with the active layer on the plane. A gate insulation layer is arranged between the active layer and the gate electrode on a vertical surface, and includes a first inorganic layer(11), an organic layer(12), and a second inorganic layer(13) which are successively laminated.
Abstract translation: 目的:提供薄膜晶体管及其制造方法,通过包括具有第一无机层,有机层和第二无机层的栅极绝缘层来增加薄膜晶体管的寿命。 构成:源极(SE)布置在基底上。 漏电极(DE)在平面上与源电极分离。 有源层与平面上的源电极和漏电极部分重叠。 栅电极(GE)与平面上的有源层部分重叠。 栅极绝缘层设置在垂直表面上的有源层和栅电极之间,并且包括依次层叠的第一无机层(11),有机层(12)和第二无机层(13)。
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公开(公告)号:KR1020120026316A
公开(公告)日:2012-03-19
申请号:KR1020100088470
申请日:2010-09-09
Applicant: 한국전자통신연구원
IPC: G02F1/167
CPC classification number: G02F1/167 , G02F1/0107 , G02F2001/1672
Abstract: PURPOSE: A method for manufacturing an electronic paper display device is provided to realize a quick response speed and increase resolution. CONSTITUTION: A first substrate includes a thin film transistor and a pixel electrode(S11). A second substrate includes display elements. An adhesive is coated on the first substrate or the second substrate(S12). The first substrate and the second substrate are bonded each other(S13). The bonded substrates are vacuum-sealed(S14).
Abstract translation: 目的:提供一种制造电子纸显示装置的方法,以实现快速的响应速度并提高分辨率。 构成:第一衬底包括薄膜晶体管和像素电极(S11)。 第二基板包括显示元件。 在第一基板或第二基板上涂覆粘合剂(S12)。 第一基板和第二基板彼此接合(S13)。 将粘合的基材真空密封(S14)。
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