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公开(公告)号:KR1020140032251A
公开(公告)日:2014-03-14
申请号:KR1020120098921
申请日:2012-09-06
Applicant: 한국전자통신연구원
IPC: A63B23/03
CPC classification number: A63B23/03
Abstract: An eyeball exercise device according to an embodiment of the present invention comprises: a plurality of LEDs formed around a display at a certain interval; and an input part setting a program to make the LEDs operate according to a certain operating pattern, and the input part saves the program storing the operating pattern by a pattern number, operates the LEDs responding to the selected pattern number, sets the time when the program operates, and processes the eyeball movement at every setting time.
Abstract translation: 根据本发明的实施例的眼球训练装置包括:以一定间隔在显示器周围形成的多个LED; 以及输入部,设定程序以使得LED根据某一操作模式进行操作,并且输入部分将存储操作模式的程序保存为模式号,根据所选择的模式编号操作LED,设置时间 程序运行,并在每个设定时刻处理眼球运动。
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公开(公告)号:KR1020120124171A
公开(公告)日:2012-11-13
申请号:KR1020110041888
申请日:2011-05-03
Applicant: 한국전자통신연구원
CPC classification number: H01L2224/48091 , H01L2924/00014
Abstract: PURPOSE: A light emitting diode apparatus for output and light emission efficiency is provided to improve efficiency of the treatment of a skin ailment by enhancing the density of optical power per unit area by optimizing the number of usable LED chip per unit area. CONSTITUTION: A metal heat dissipating plate(100) is comprised of a metal plate of aluminum material. A heat dissipation insulator(200) electrically insulates the metal heat dissipating plate and a metal pad(300). The heat dissipation insulator easily transfers heat generated in an LED chip(400) to the metal heat dissipating plate. The LED chip is attached on a center part of the metal pad using die adhesive(250). The metal pad is connected to the LED chip through a bonding wire(350). [Reference numerals] (100) Metal heat dissipating plate; (200) Heat dissipation insulator; (250) Die adhesive; (300) Metal pad; (350) Bonding wire; (400) Chip
Abstract translation: 目的:提供一种用于输出和发光效率的发光二极管装置,通过优化每单位面积的可用LED芯片的数量,通过增加每单位面积光功率的密度来提高皮肤疾病的治疗效率。 构成:金属散热板(100)由铝材料的金属板构成。 散热绝缘体(200)使金属散热板和金属垫(300)电绝缘。 散热绝缘体容易将在LED芯片(400)中产生的热量传递到金属散热板。 LED芯片使用模具粘合剂(250)附接在金属垫的中心部分上。 金属焊盘通过接合线(350)连接到LED芯片。 (附图标记)(100)金属散热板; (200)散热绝缘子; (250)模具胶; (300)金属垫; (350)接合线; (400)芯片
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公开(公告)号:KR1020150138977A
公开(公告)日:2015-12-11
申请号:KR1020140066119
申请日:2014-05-30
Applicant: 한국전자통신연구원
CPC classification number: H01L33/46 , H01L33/0095 , H01L33/20 , H01L33/42 , H01L33/44 , H01L2933/0025 , H01L33/22 , H01L33/405 , H01L2933/0016 , H01L2933/0091
Abstract: 본발명은광 추출효율을높일수 있는반도체발광소자및 그의제조방법에관한것으로, 기판상에형성된버퍼층, 상기버퍼층상에형성된 n형반도체층, 상기 n형반도체층이드러나도록상기 n형반도체층의일부영역상에형성된활성층, 상기활성층상에형성된 p형반도체층, 상기 p형반도체층상에형성된투명전도성층, 상기투명전도성층의측벽으로부터상기활성층의측벽을따라형성된제1 메사면, 상기제1 메사면을따라형성된패시베이션층, 및상기패시베이션층을따라형성되어탈출광을되반사시키는금속반사막을포함함으로써탈출광을되반사시켜광 추출효율을높인다.
Abstract translation: 本发明涉及能够提高光提取效率的发光装置及其制造方法。 发光器件包括形成在衬底上的缓冲层,形成在缓冲层上的n型半导体层,形成在n型半导体层的一部分上以暴露类型半导体层的有源层,p型半导体 在所述有源层上形成的层,形成在所述p型半导体层上的透明导电层,沿着所述透明导电层的侧壁沿所述有源层的侧壁形成的第一台面表面,沿着所述第一台面表面形成的钝化层 以及沿着钝化层形成并反射逃逸光的金属反射层。 因此,通过反射逃逸光来提高光提取效率。
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