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公开(公告)号：WO2006032611A1
公开(公告)日：2006-03-30
申请号：PCT/EP2005/054419
申请日：2005-09-07
Applicant: 3D PLUS , VAL, Christian , LIGNIER, Olivier , BOCAGE, Régis
Inventor： VAL, Christian , LIGNIER, Olivier , BOCAGE, Régis
IPC: H05K1/02
CPC classification number: H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L2224/32145 , H01L2224/48227 , H01L2224/49113 , H01L2225/06562 , H01L2924/00014 , H01L2924/01087 , H01L2924/15311 , H01L2924/181 , H05K1/0201 , H05K1/111 , H05K1/112 , H05K3/4641 , H05K2201/09718 , H05K2201/09745 , H05K2201/09781 , H05K2203/165 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: La présente invention concerne un dispositif électronique intégrant un répartiteur de chaleur. Il s'applique plus particulièrement aux dispositifs de type boîtiers plastiques, à un ou plusieurs niveaux de composants. Selon l'invention, le dispositif électronique, par exemple de type boîtier, est muni pour sa connexion externe de plots (11) répartis sur une surface de connexion (22), II comprend une plaque (23) conductrice de la chaleur, disposée parallèlement à la dite surface de connexion, et présentant une structure non uniforme permettant, lorsque le dispositif est soumis à une température extérieure donnée, un apport de chaleur contrôlée au niveau de chaque plot de connexion externe, en fonction de sa position sur la surface dé connexion. Dans le cas où le dispositif serait un boîtier comprenant un support (20) de type circuit imprimé, la plaque conductrice formera avantageusement une couche interne dudit support.
Abstract translation: 本发明涉及一种设置有散热器的电子设备，特别涉及包括一个或多个部件级的塑料盒状设备。 本发明的电子设备（例如盒状）设置有分布在连接表面（22）上的外部连接焊盘（11），包括导热板（23），该导热板相对于 对于所述连接表面并且其不均匀结构，当器件暴露于给定的外部温度时，可以根据其在连接表面上的位置对每个外部连接焊盘进行受控的热供应。 当装置以包括印刷电路形式的支撑件（20）的盒子的形式实施时，导电板有利地形成其内层。
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公开(公告)号：EP1792526B1
公开(公告)日：2009-07-15
申请号：EP05782605.9
申请日：2005-09-07
Applicant: 3D Plus
Inventor： VAL, Christian , LIGNIER, Olivier , BOCAGE, Régis
CPC classification number: H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L2224/32145 , H01L2224/48227 , H01L2224/49113 , H01L2225/06562 , H01L2924/00014 , H01L2924/01087 , H01L2924/15311 , H01L2924/181 , H05K1/0201 , H05K1/111 , H05K1/112 , H05K3/4641 , H05K2201/09718 , H05K2201/09745 , H05K2201/09781 , H05K2203/165 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: The invention relates to an electronic device provided with a heat spreader, in particular to plastic box-like devices comprising one or several stages of components. The inventive electronic device, for example a box-like, is provided with external connection pads (11) which are distributed on a connecting surface (22), comprises a heat-conductive plate (23) which is disposed in a parallel position with respect to said connecting surface and whose non-uniform structure, when the device is exposed to a given external temperature, makes it possible to carry out a controlled heat supply to each external connection pad according to the position thereof on the connecting surface. When the device is embodied in the form of a box comprising a support (20) in the form of a printed circuit, the conductive plate advantageously forms the internal layer thereof.
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公开(公告)号：EP1792526A1
公开(公告)日：2007-06-06
申请号：EP05782605.9
申请日：2005-09-07
Applicant: 3D Plus
Inventor： VAL, Christian , LIGNIER, Olivier , BOCAGE, Régis
CPC classification number: H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L2224/32145 , H01L2224/48227 , H01L2224/49113 , H01L2225/06562 , H01L2924/00014 , H01L2924/01087 , H01L2924/15311 , H01L2924/181 , H05K1/0201 , H05K1/111 , H05K1/112 , H05K3/4641 , H05K2201/09718 , H05K2201/09745 , H05K2201/09781 , H05K2203/165 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: The invention relates to an electronic device provided with a heat spreader, in particular to plastic box-like devices comprising one or several stages of components. The inventive electronic device, for example a box-like, is provided with external connection pads (11) which are distributed on a connecting surface (22), comprises a heat-conductive plate (23) which is disposed in a parallel position with respect to said connecting surface and whose non-uniform structure, when the device is exposed to a given external temperature, makes it possible to carry out a controlled heat supply to each external connection pad according to the position thereof on the connecting surface. When the device is embodied in the form of a box comprising a support (20) in the form of a printed circuit, the conductive plate advantageously forms the internal layer thereof.
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