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    POLYURETHANE/UREA SILICON CARBIDE NANOCOMPOSITE
    1.
    发明申请
    POLYURETHANE/UREA SILICON CARBIDE NANOCOMPOSITE 审中-公开
    聚氨酯/尿素碳化硅纳米复合材料

    公开(公告)号：WO2017027231A1

    公开(公告)日：2017-02-16

    申请号：PCT/US2016/044747

    申请日：2016-07-29

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： MARX, Ryan E. ,  LOMEDA, Jay R. ,  THOMPSON, Wendy L. ,  DAMTE, Gezahegn D. ,  TARBUTTON, Kent, S. ,  KAYSER, Armin

    IPC: C08K3/34 ,  C08K9/06

    CPC classification number: C08K3/34 ,  B82Y30/00 ,  C01B32/956 ,  C01P2004/64 ,  C08K3/14 ,  C08K9/06 ,  C08L75/02 ,  C08L75/08 ,  C08L2201/08 ,  C08L2203/16 ,  C08L75/00

    Abstract: Polyurethane/urea nanocomposites, precursors thereof, and methods of their manufacture and use are provided, the nanocomposites comprising: a) a polyurethane/urea polymer matrix, and b) surface modified silicon carbide nanoparticles dispersed within and covalently bound to a polyurethane/urea polymer comprising the polyurethane/urea polymer matrix. In some embodiments, the surface modified silicon carbide nanoparticle comprises a silicon carbide core and a linking group covalently bound to the surface of the silicon carbide core and covalently bound to the polyurethane/urea polymer. In some embodiments, the linking group is a moiety according to Formula where the urethane group of the linking group is covalently bound to the polyurethane/urea polymer; and where each open valence of the silicon atom of the linking group is bound to a hydroxyl group (-OH) or is covalently bound to the surface of the silicon carbide core through an oxygen atom.

    Abstract translation: 提供了聚氨酯/尿素纳米复合材料，其前体及其制造和使用方法，所述纳米复合材料包括：a）聚氨酯/脲聚合物基体，以及b）分散在聚氨酯/脲聚合物内并共价结合的表面改性的碳化硅纳米颗粒 包括聚氨酯/脲聚合物基质。 在一些实施方案中，表面改性的碳化硅纳米颗粒包括碳化硅芯和共价结合到碳化硅芯的表面并与聚氨酯/脲聚合物共价结合的连接基团。 在一些实施方案中，连接基团是根据式的部分，其中连接基团的氨基甲酸酯基团与聚氨酯/脲聚合物共价结合; 并且其中连接基团的硅原子的每个开放价态与羟基（-OH）结合或通过氧原子共价结合到碳化硅芯的表面。

    THERMALLY CONDUCTIVE PRESSURE SENSITIVE ADHESIVE COMPRISING ANISOTROPIC BORON NITRIDE AGGLOMERATES
    2.
    发明申请
    THERMALLY CONDUCTIVE PRESSURE SENSITIVE ADHESIVE COMPRISING ANISOTROPIC BORON NITRIDE AGGLOMERATES 审中-公开
    包含各向异性硼氮化物集合体的热传导型压敏粘合剂

    公开(公告)号：WO2017105921A1

    公开(公告)日：2017-06-22

    申请号：PCT/US2016/065103

    申请日：2016-12-06

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： WIENEKE, Jan U. ,  RIEDER-OTTERBURG, Susanne H. ,  KAYSER, Armin ,  UIBEL, Krishna B. ,  ENGLER, Martin ,  SCHÄDEL, Robert M. ,  YAMABE, Takujiro

    IPC: C08K3/38 ,  C09J11/04 ,  C09J133/02

    CPC classification number: C09J133/02 ,  C08K3/38 ,  C08K2003/385 ,  C09J9/00 ,  C09J11/04

    Abstract: The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. anisotropic boron nitride agglomerates comprising hexagonal boron nitride primary particles, wherein the hexagonal boron nitride primary particles have an average primary particle size d 50 comprised between 1 and 50 micrometer, wherein the anisotropic boron nitride agglomerates have an average agglomerate size d 50 comprised between 50 and 250 micrometer and an aspect ratio greater than 1.5, and wherein the envelope density of the anisotropic boron nitride agglomerates is greater than 1 g/cm3?, when measured according to the test method described in the experimental section; and ii. (optionally), free hexagonal boron nitride primary particles having an average primary particle size d50 comprised between 3 and 50 micrometer; and wherein the content of the boron nitride mixture composition is greater than 15 vol%, based on the volume of the thermally conductive pressure sensitive adhesive composition. The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.

    Abstract translation: 本公开涉及一种导热性压敏粘合剂组合物，其包含：a）丙烯酸类聚合物组分; 和b）氮化硼混合物组合物，其包含：i。 包含六方氮化硼初级颗粒的各向异性氮化硼团聚体，其中所述六方氮化硼初级颗粒具有1至50微米的平均初级粒径d 50，其中所述各向异性氮化硼团聚体具有平均团聚体 尺寸d 50包括在50和250微米之间并且纵横比大于1.5，并且其中当根据测试测量时，各向异性氮化硼团聚体的包络密度大于1g / cm 3δ 方法在实验部分描述; 和ii。 （任选地）具有3至50微米的平均一次粒径d50的游离六方氮化硼一次粒子; 并且其中基于所述导热压敏粘合剂组合物的体积，所述氮化硼混合物组合物的含量大于15体积％。 本公开还涉及制造这种导热压敏粘合剂的方法及其用途。

    THERMALLY CONDUCTIVE PRESSURE SENSITIVE ADHESIVE
    3.
    发明申请
    THERMALLY CONDUCTIVE PRESSURE SENSITIVE ADHESIVE 审中-公开
    导热敏感胶粘剂

    公开(公告)号：WO2017027178A1

    公开(公告)日：2017-02-16

    申请号：PCT/US2016/043045

    申请日：2016-07-20

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： WIENEKE, Jan ,  RIEDER-OTTERBURG, Susanne ,  KUESTER, Frank ,  RAYNOSCHEK, Simone ,  KAYSER, Armin ,  UIBEL, Krishna

    IPC: C09J7/02 ,  C09J133/06 ,  C08K3/38 ,  C09J9/00

    CPC classification number: C09J9/00 ,  C08K2003/385 ,  C08K2201/003 ,  C08K2201/014 ,  C09J133/06 ,  C08K3/38

    Abstract: The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. a first type of hexagonal boron nitride primary particle agglomerates having a first average agglomerate size d 50 comprised between 100 and 420 ųm; ii. optionally, hexagonal boron nitride primary particles having an average primary particle size d 50 comprised between 3 and 25 ųm; iii. optionally, a second type of hexagonal boron nitride primary particle agglomerates having a second average agglomerate size d 50 which is lower than the first average agglomerate size d 50 ; iv. optionally, a third type of hexagonal boron nitride primary particle agglomerates having a third average agglomerate size d 50 , wherein the third average agglomerate size d 50 is lower than the first average agglomerate size d 50 and is different from second average agglomerate size d 50 ; and wherein the hexagonal boron nitride primary particles have a platelet shape; wherein the envelope density of the first type of agglomerates, and optionally, the second type of agglomerates and the third type of agglomerates, are comprised between 0.3 and 2.2 g/cm 3 , when measured according to the test method described in the experimental section; and wherein the content of the boron nitride mixture composition is greater than 15 vol%, based on the volume of the thermally conductive pressure sensitive adhesive composition. The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.

    Abstract translation: 本发明涉及导热压敏粘合剂组合物，其包含：a）丙烯酸类聚合物组分; 和b）氮化硼混合物组合物，其包含： 具有100至420μm的第一平均团聚体尺寸d50的第一类型的六方氮化硼一次粒子附聚物; II。 任选地，具有3至25μm的平均初级粒径d50的六方氮化硼一次粒子; III。 任选地，具有低于第一平均团聚体尺寸d50的第二平均团聚体尺寸d50的第二类型的六方氮化硼一次粒子附聚物; IV。 可选地，具有第三平均团聚体尺寸d50的第三类型的六方氮化硼一次粒子附聚物，其中第三平均团聚体尺寸d50低于第一平均团聚体尺寸d50，并且不同于第二平均团聚体尺寸d50; 并且其中所述六方氮化硼一次粒子具有血小板形状; 其中当根据实验部分中描述的测试方法测量时，第一类型附聚物和任选的第二类型附聚物和第三类型附聚物的包络密度为0.3至2.2g / cm 3; 并且其中氮化硼混合物组合物的含量基于导热压敏粘合剂组合物的体积大于15体积％。 本公开还涉及制造这种导热压敏粘合剂的方法及其用途。

    POLYURETHANE/UREA SILICON CARBIDE NANOCOMPOSITE
    7.
    发明公开
    POLYURETHANE/UREA SILICON CARBIDE NANOCOMPOSITE 审中-公开

    公开(公告)号：EP3334778A1

    公开(公告)日：2018-06-20

    申请号：EP16748246.2

    申请日：2016-07-29

    Applicant: 3M Innovative Properties Company

    Inventor： MARX, Ryan E. ,  LOMEDA, Jay R. ,  THOMPSON, Wendy L. ,  DAMTE, Gezahegn D. ,  TARBUTTON, Kent, S. ,  KAYSER, Armin

    IPC: C08K3/34 ,  C08K9/06

    Abstract: Polyurethane/urea nanocomposites, precursors thereof, and methods of their manufacture and use are provided, the nanocomposites comprising: a) a polyurethane/urea polymer matrix, and b) surface modified silicon carbide nanoparticles dispersed within and covalently bound to a polyurethane/urea polymer comprising the polyurethane/urea polymer matrix. In some embodiments, the surface modified silicon carbide nanoparticle comprises a silicon carbide core and a linking group covalently bound to the surface of the silicon carbide core and covalently bound to the polyurethane/urea polymer. In some embodiments, the linking group is a moiety according to Formula where the urethane group of the linking group is covalently bound to the polyurethane/urea polymer; and where each open valence of the silicon atom of the linking group is bound to a hydroxyl group (—OH) or is covalently bound to the surface of the silicon carbide core through an oxygen atom.

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