LIGHT CONTROL FILM
    1.
    发明申请
    LIGHT CONTROL FILM 有权
    光控膜

    公开(公告)号:US20140204464A1

    公开(公告)日:2014-07-24

    申请号:US14119725

    申请日:2012-05-24

    CPC classification number: G02B5/02 G02B2207/123 G02F1/133524

    Abstract: The present disclosure provides a light control film that is capable of transmitting light, or allowing a viewer to observe information, only within a viewing region centered around the normal (perpendicular line) to a surface. The light control film generally blocks information or light outside of this viewing region, and provides security in all directions including right-and-left and up-and-down of the film. The light control film includes a plurality of light-transmissive cavities that are surrounded by a light absorbing material, such that each of the plurality of cavities is optically isolated from adjacent cavities. Each of the light-transmissive cavities effectively block light which enters the cavity outside of a viewing (that is, cutoff) angle.

    Abstract translation: 本公开提供了一种光控制膜,其能够仅在以表面的法线(垂直线)为中心的观察区域内透射光,或允许观察者观察信息。 光控膜通常阻挡该观看区域外的信息或光,并且在所有方向提供电影的安全性,包括右上和左右。 光控制膜包括被光吸收材料包围的多个光透射腔,使得多个空腔中的每一个与相邻空腔光学隔离。 每个透光腔有效地阻挡在观察(即截止)角度之外进入空腔的光。

    POLISHING PADS AND SYSTEMS AND METHODS OF MAKING AND USING THE SAME

    公开(公告)号:US20170182629A1

    公开(公告)日:2017-06-29

    申请号:US15300125

    申请日:2015-03-31

    CPC classification number: B24B37/26 B24B7/228 B24B37/22 B24B37/245

    Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes a plurality of precisely shaped pores, a plurality of precisely shaped asperities and a land region. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

    PATTERNED CONDUCTIVE ARTICLE
    6.
    发明申请

    公开(公告)号:US20220167499A1

    公开(公告)日:2022-05-26

    申请号:US17602886

    申请日:2020-05-05

    Abstract: A patterned conductive article 200 includes a substrate 210 including a unitary layer 210-1 and includes a micropattern of conductive traces 220 embedded at least partially in the unitary layer. Each conductive trace extends along a longitudinal direction (y-direction) of the conductive trace and includes a conductive seed layer 230 having a top major surface 232 and an opposite bottom major surface 234 in direct contact with the unitary layer; and a unitary conductive body 240 disposed on the top major surface of the conductive seed layer. The unitary conductive body and the conductive seed layer differ in at least one of composition or crystal morphology. The unitary conductive body has lateral sidewalls 242, 244 and at least a majority of a total area of the lateral sidewalls is in direct contact with the unitary layer.

    Light Control Film
    7.
    发明申请

    公开(公告)号:US20240411061A1

    公开(公告)日:2024-12-12

    申请号:US18700470

    申请日:2022-10-17

    Abstract: A light control film includes a two-dimensional array of projections arranged across the light control film. A square of a magnitude of a Fourier transform frequency spectrum of the projections includes a plurality of distinct peaks separated by one or more valleys. The peaks and the one or more valleys have respective averages Pavg and Vavg, Pavg/Vavg≥5, such that when light from a substantially Lambertian light source is incident on the light control film, the light control film transmits the incident light with the transmitted light propagating along a transmission axis and having an intensity profile having a full width at half maximum of less than about 120 degrees in each cross-section of the intensity profile that comprises the transmission axis.

    MICROREPLICATED POLISHING SURFACE WITH ENHANCED CO-PLANARITY

    公开(公告)号:US20200164484A1

    公开(公告)日:2020-05-28

    申请号:US16636348

    申请日:2018-08-02

    Abstract: An article includes a polishing layer that includes a plurality of raised cells separated by a plurality of channels. Each of the plurality of raised cells includes a microstructured working surface, a substantially vertical channel surface, and an offset surface between an edge of the working surface and an upper edge of the channel surface. The microstructured working surface includes a plurality of microstructures. Tops of the plurality of microstructures define a top plane and bases of the plurality of microstructures define a base plane. The substantially vertical channel surface defines a wall of a channel of the plurality of channels and the channel surface defines a channel plane. The offset surface includes a nonplanar portion of displaced material. The displaced material defines a displacement plane that is below the base plane or within a tolerance of the top plane.

    POLISHING PADS AND SYSTEMS AND METHODS OF MAKING AND USING THE SAME

    公开(公告)号:US20170173758A1

    公开(公告)日:2017-06-22

    申请号:US15129639

    申请日:2015-03-31

    CPC classification number: B24B37/26 B24B7/228 B24B37/22 B24B37/245

    Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes at least one of a plurality of precisely shaped pores and a plurality of precisely shaped asperities. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

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