Abstract:
The present disclosure relates to forming a bond with a high peel resistance between a bonding layer and an adjacent barrier layer. Such articles are particularly useful in the preparation of a device, in particular a luminescent device, and a method is described for assembly of the luminescent device. The luminescent device includes an encapsulation system using flexible transparent barrier film and an ultraviolet (UV) radiation curable (meth)acrylate matrix. The moisture sensitive luminescent material can be, for example, a quantum dot material disposed in a film, or a film construction that includes an OLED structure.
Abstract:
A multifunctional optical film for enhancing light extraction includes a flexible substrate, a structured layer, and a backfill layer. The structured layer effectively uses microreplicated diffractive or scattering nanostructures located near enough to the light generation region to enable extraction of an evanescent wave from an organic light emitting diode (OLED) device. The backfill layer has a material having an index of refraction different from the index of refraction of the structured layer. The backfill layer also provides a planarizing layer over the structured layer in order to conform the light extraction film to a layer of an OLED display device. The film may have additional layers added to or incorporated within it to an emissive surface in order to effect additional functionalities beyond improvement of light extraction efficiency.
Abstract:
A barrier adhesive composition comprising a resin system and organically modified nanoclay. The resin system comprises (a) a first polyisobutylene resin having a viscosity average molecular weight of about 300,000 to about 500,000 g/mol, (b) a second polyisobutylene resin having a viscosity average molecular of about 700,000 to about 900,000 g/mol and (c) tackifier.
Abstract:
A barrier film construction comprises an ultra-barrier film and a barrier adhesive. The adhesive layer comprises a barrier adhesive composition comprising a resin system and organically modified nanoclay; wherein the resin system comprises a first polyisobutylene resin having a viscosity average molecular weight of about 100,000 to about 1,200,000 g/mol and tackifier.
Abstract:
Edge-emitting organic light emitting diode (OLED) devices having optical microstructures and methods for fabricating them. The edge-emitting OLEDs include a substrate, an organic electroluminescent layer overlaying the substrate surface, and optical microstructures functioning as turning optics and separated from the OLEDs. The turning optics reflect and redirect the light from the edge-emitting OLEDs away from the top of the substrate, or through and away from the bottom of the substrate.
Abstract:
Barrier assemblies including ultrathin barrier laminates and methods of making the barrier assemblies are provided. A barrier assembly includes a thermoplastic polymer skin layer having opposite first and second major surfaces, and a barrier stack coated on the first major surface of the thermoplastic polymer skin layer to form an integral protective layer having a thickness no greater than about 0.5 mil (about 12.7 microns). The removable carrier film has a major surface releasably attached to the second major surface of the thermoplastic polymer skin layer. In some cases, the removal of the carrier film results in ultrathin barrier laminates.
Abstract:
A conducting film or device multilayer electrode includes a substrate and two transparent or semitransparent conductive layers separated by a transparent or semitransparent intervening layer. The intervening layer includes electrically conductive pathways between the first and second conductive layers to help reduce interfacial reflections occurring between particular layers in devices incorporating the conducting film or electrode.
Abstract:
Generally, the present disclosure relates to barrier assemblies that have a reduced transmission of water vapor, and processes for making the barrier assemblies. The barrier assemblies include a substrate and an inorganic layer disposed adjacent the substrate. The inorganic layer has a composition that changes throughout the thickness of the inorganic layer. The composition includes at least a first and a second inorganic material, and the relative proportion of the first and second inorganic material in the composition changes throughout the thickness of the inorganic layer. A process for making the barrier assemblies includes dual AC sputtering of pairs of targets having different elemental compositions.
Abstract:
Adhesive encapsulating compositions for use in electronic devices such as organic electroluminescent devices, touch screens, photovoltaic devices, and thin film transistors are disclosed herein. The adhesive encapsulating compositions include pressure sensitive adhesives comprising one or more polyisobutylene resins, in combination with optional multifunctional (meth)acrylate monomers and/or optional tackifiers.
Abstract:
A process for fabricating an amorphous diamond-like film layer for protection of a moisture or oxygen sensitive electronic device is described. The process includes forming a plasma from silicone oil, depositing an amorphous diamond-like film layer from the plasma, and combining the amorphous diamond-like film layer with a moisture or oxygen sensitive electronic device to form a protected electronic device. Articles including the amorphous diamond-like film layer on an organic electronic device are also disclosed.