公开(公告)号：WO2019133482A1

公开(公告)日：2019-07-04

申请号：PCT/US2018/067091

申请日：2018-12-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： BEIERMANN, Brett A. ,  CLARK, John C. ,  LARSON, Eric G. ,  HIGGINS, Jeremy M. ,  FORTICAUX, Audrey S. ,  LOMEDA, Jay R. ,  MAHONEY, Wayne S. ,  CHARLES, Scott B. ,  FLETCHER, Timothy D. ,  THOMPSON, Wendy L. ,  SCHWARTZ, Kyle R.

IPC: H05K5/00 ,  C08K3/22 ,  C08K3/14 ,  C08K3/38 ,  C08L63/00 ,  H01L23/29 ,  H01L23/18

Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure maybe a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

公开(公告)号：EP3732940A1

公开(公告)日：2020-11-04

申请号：EP18894583.6

申请日：2018-12-21

Applicant: 3M Innovative Properties Company

Inventor： BEIERMANN, Brett A. ,  CLARK, John C. ,  LARSON, Eric G. ,  HIGGINS, Jeremy M. ,  FORTICAUX, Audrey S. ,  LOMEDA, Jay R. ,  MAHONEY, Wayne S. ,  CHARLES, Scott B. ,  FLETCHER, Timothy D. ,  THOMPSON, Wendy L. ,  SCHWARTZ, Kyle R.

IPC: H05K5/00 ,  C08K3/22 ,  C08K3/14 ,  C08K3/38 ,  C08L63/00 ,  H01L23/29 ,  H01L23/18