公开(公告)号：US20230230852A1

公开(公告)日：2023-07-20

申请号：US18011263

申请日：2021-07-09

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Elizaveta Y. Plotnikov ,  Sung W. Moon ,  Nicholas A. Proite ,  Myron K. Jordan

IPC: H01L21/48 ,  H01L23/473

CPC classification number: H01L21/4882 ,  H01L23/473 ,  B33Y80/00

Abstract: A cold plate having a copper base plate and a plurality of fins on the copper base plate. The fins are porous and made by 3D printing a copper-silver alloy on the copper base plate. Alternatively, the fins can be 3D printed and then adhered to the copper base plate with a brazing material. The copper base plate is placed on electronics to be cooled, such as a chip package, using a thermal interface material. An optional manifold can be placed on the copper base plate for circulating a coolant across the fins.

公开(公告)号：US20230339194A1

公开(公告)日：2023-10-26

申请号：US17793109

申请日：2021-02-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jacob P. Podkaminer ,  Jens Eichler ,  Peter J. Schneider ,  Sebastian Goris ,  Victor Ho ,  Joseph A. Dunbar ,  Matthew T. Johnson ,  Jay B. Preston ,  Matthew H. Frey ,  Eric L. Askeland ,  Steven D. Solomonson ,  Sung W. Moon ,  Michael P. Wald

IPC: B29C70/14 ,  B29C70/88 ,  B29C70/54

CPC classification number: B29C70/14 ,  B29C70/88 ,  B29C70/545 ,  B29L2007/008

Abstract: The present disclosure provides a thermally conductive article including a pad having first and second opposed major surfaces and a thickness therebetween. The thickness is formed of entangled thermally conductive fibers and at least a portion of the entangled thermally conductive fibers have at least one terminal end at the first opposed major surface, the opposed second major surface, or both. The pad is at least partially impregnated with a polymer. Another thermally conductive article is provided including a) a pad having first and second opposed major surfaces and a thickness therebetween; b) a first thermally conductive skin layer; and c) a second thermally conductive skin layer. The thickness of the pad is formed of aligned thermally conductive fibers, and at least a portion of the thermally conductive fibers have a terminal end at the first opposed major surface and the opposed second major surface. The first and second thermally conductive skin layers each include a polymeric matrix at least partially embedded in the terminal end of at least a portion of the thermally conductive fibers at the first and second major surfaces of the pad, respectively. Methods of making the thermally conductive articles are also provided.

公开(公告)号：US20250001706A1

公开(公告)日：2025-01-02

申请号：US18830974

申请日：2024-09-11

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jens Eichler ,  Peter J. Schneider ,  Sebastian Goris ,  Jay B. Preston ,  Eric L. Askeland ,  Steven D. Solomonson ,  Sung W. Moon ,  Michael P. Wald

IPC: B29C70/14 ,  B29C70/54 ,  B29C70/88 ,  B29L7/00 ,  H01L23/373

Abstract: The present disclosure provides a thermally conductive article including a pad having first and second opposed major surfaces and a thickness therebetween. The thickness is formed of entangled thermally conductive fibers and at least a portion of the entangled thermally conductive fibers have at least one terminal end at the first opposed major surface, the opposed second major surface, or both. The pad is at least partially impregnated with a polymer. Another thermally conductive article is provided including a) a pad having first and second opposed major surfaces and a thickness therebetween; b) a first thermally conductive skin layer; and c) a second thermally conductive skin layer. The thickness of the pad is formed of aligned thermally conductive fibers, and at least a portion of the thermally conductive fibers have a terminal end at the first opposed major surface and the opposed second major surface. The first and second thermally conductive skin layers each include a polymeric matrix at least partially embedded in the terminal end of at least a portion of the thermally conductive fibers at the first and second major surfaces of the pad, respectively. Methods of making the thermally conductive articles are also provided.

公开(公告)号：US20220415752A1

公开(公告)日：2022-12-29

申请号：US17781129

申请日：2020-12-01

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Sung W. Moon ,  Brinda B. Badri ,  Siang Sin Foo

IPC: H01L23/427 ,  H05K1/02

Abstract: A direct to chip cooling film for two-phase cooling. The film includes a dielectric layer having a first surface for attachment to a cold plate or circuits and having a second surface. A metal layer is on the second surface of the dielectric layer with a pattern of features on a side opposite the dielectric layer. This surface pattern provides increased surface area and multiple nucleation sites for bubbles formation for two-phase cooling. The features can also include metal nodules to further enhance the nucleation.