公开(公告)号：DE19647590A1

公开(公告)日：1998-05-20

申请号：DE19647590

申请日：1996-11-18

Applicant: ABB RESEARCH LTD

Inventor： FREY TONY DR ,  STUCK ALEXANDER DR ,  ZEHRINGER RAYMOND DR

IPC: H01L23/373 ,  H01L25/07 ,  H01L25/18 ,  H01L23/36

Abstract: The semiconductor chips (25, 26) of the semiconductor module (20) are located on the top side of a metallised ceramic substrate (22) of a first expansion coefft. The substrate underside is located on a base plate (21) of good thermal conductivity and high heat capacity, of a material with a second different expansion coefft. Between the substrate and base plate is fitted an intermediate plate (28) of a material of a third expansion coefft. of a magnitude lying between the first two expansion coeffts. The substrate is firmly coupled to the intermediate plate top side, while the base plate is secured to its underside.